An electrical equipment diagnostic system can include an electrical equipment and a sensor device controlled by a user that takes a first measurement of a first parameter of the electrical equipment while the electrical equipment is operating. The system can also include a controller communicably coupled to the sensor device, where the controller includes a storage repository, where the storage repository includes at least one threshold value and at least one algorithm. The controller can receive the first measurement from the sensor device, and process the at least one first algorithm using the first measurement. The controller can also identify a problem with the electrical equipment based on results of the at least one first algorithm, and instruct the user to perform specific tasks to correct the problem with the electrical equipment.

A contactless thermometer for an in-wall power adapter is described. The contactless thermometer may comprise a first contact element of a plurality of contact elements configured to receive a power signal from the in-wall power adapter; a transformer coupled to the first contact element, wherein the transformer converts the power signal from a first voltage to a second voltage; a transmitter adapted to transmit a signal from the contactless thermometer; a receiver adapted to receive a reflected signal based upon the transmitted signal; and a control circuit coupled to the receiver, wherein the control circuit determines a temperature based upon the reflected signal.

A temperature abnormality detection system of the present invention includes a first temperature sensor that measures a first temperature indicated by a target device and a second temperature sensor that measures a second temperature indicated by ambient air around the target device. A temperature difference between the first temperature and the second temperature is calculated, and when this temperature difference becomes a predetermined threshold value or more, it is determined that a temperature abnormality of the target device has occurred.

A computer determines one or more temperature sensitive components from a part details in a bill of materials for soldering on a printed circuit board assembly, where the bill of materials is a record comprising part details having a reference designator. The computer determines whether temperature sensitive components exist in the bill of materials. Based on determining that at least one of the temperature sensitive components exist in the bill of materials, the computer determines temperature limits for each temperature sensitive component based on the reference designator, monitors, using the thermographic cameras the measured temperatures of the temperature sensitive components during soldering in the reflow oven. Then, based on determining that the measured temperatures of the temperature sensitive components exceeds the temperature limits, the computer determines an elapsed time outside of the temperature limit when the measured temperatures of the temperature sensitive components exceeds the temperature limits.

A switchboard monitoring system, according to one embodiment of the present specification, comprises: a thermal imaging apparatus for acquiring thermal imaging information of a device disposed in a switchboard panel; and a control apparatus for receiving the thermal imaging information from the thermal imaging apparatus, generating temperature information of the device on the basis of the received thermal imaging information, and detecting the temperature state of the device on the basis of the generated temperature information.

The present disclosure relates to a circuit breaker opening/closing assistance apparatus for correcting a thermal image of a circuit breaker on the basis of a visible image of the circuit breaker, and assisting an opening/closing operation of the relevant circuit breaker on the basis of a temperature identified through the corrected thermal image. Further, the present disclosure relates to a circuit breaker opening/closing assistance apparatus for identifying a temperature of a circuit breaker in which a failure has occurred, on the basis of a thermal image of the circuit breaker, and assisting an opening/closing operation of the relevant circuit breaker on the basis of the identified temperature.

A thermographic inspection system is provided for inspecting electrical equipment. The system may be used while the electrical equipment is energized to monitor active performance of the equipment. The system may be used to monitor temperature differences of various components in the equipment.

A monitoring system may include a sensor configured to be mounted inside a computer chassis and generate sensor signals representative of a temperature associated with at least one computer component inside the computer chassis. The monitoring system may also include a sensor processor configured to receive the sensor signals and determine the temperature associated with the at least one computer component based at least in part on the sensor signals. The sensor processor may also be configured to compare the determined temperature with an expected temperature associated with the at least one computer component, and initiate a response when the determined temperature differs from the expected temperature by an amount equal to or greater than a threshold amount.

A method for providing a high spatial resolution thermal imaging of an active electronic device. The method includes placing an electronic device on a testing stage of an imaging system. The method, calibrating the imaging system by determining thermoreflectance coefficient for a plurality of pixels forming thermal images, each pixel having a coordinate (x,y) captured from the electronic device at each of a plurality of wavelengths of illumination (C.sub.TRi(x,y,.sub.i), activating the electronic device, and determining changes in reflection for each of the plurality of pixels at each of the plurality of wavelengths (R/R), determining R/R vs. C.sub.TRi(x,y,.sub.i) for each of the plurality of pixels for each of the plurality of wavelengths, fitting R/R vs. C.sub.TRi(x,y,.sub.i) to a predetermined mathematical function and use the parameters to calculate the temperature at each pixel.

Systems, methods, and computer readable media to improve the operation of thermographic imaging systems are described. Techniques are disclosed for generating thermograms using single low-noise photon detectors. More particularly, an array of single low-noise photon detectors operating in the Geiger mode may be used to accurately identify the time delay between the application of a periodic power stimulus to a device under test and the generation of photons resulting from that stimulus. In one embodiment an array of single photon detectors may be used to time-tag each detected photon. Thereafter, a high-speed counting circuit can correlate the detected photons to the applied stimulus. When operating at the frequencies possible in the Geiger mode, such measurements permit a higher degree of spatial resolution (e.g., in the x, y and z axes) of thermal hot-spots within the device under test than prior art approaches.