An infrared image sensor includes: a plurality of reference circuits configured to provide a plurality of reference analog values to a plurality of bolometer cells, respectively; a front-end analog circuit configured to collect a plurality of output analog values according to the plurality of reference analog values; and a noise suppression circuit configured to switch a correspondence between the plurality of bolometer cells and the plurality of reference analog values at unit time intervals.

An infrared image sensor includes: a plurality of reference circuits configured to provide a plurality of reference analog values to a plurality of bolometer cells, respectively; a front-end analog circuit configured to collect a plurality of output analog values according to the plurality of reference analog values; and a noise suppression circuit configured to switch a correspondence between the plurality of bolometer cells and the plurality of reference analog values at unit time intervals.

An electromagnetic wave sensor 1 has electromagnetic wave absorbers disposed side by side in first and second directions, temperature detection portions held by the respective electromagnetic wave absorbers and sets of two arm portions connected to each electromagnetic wave absorber at two connection portions. In a plan view, the arm portions have two first extending portions extending from the connection portions in directions of which components in the second direction are opposite to each other, and two second extending portions extending from the first extending portions in directions of which components in the first direction are opposite to each other. Four sides of a rectangle circumscribing each of the electromagnetic wave absorbers with a smallest area are inclined with respect to the first direction in directions in which each electromagnetic wave absorber is away from the second extending portions with the connection portions as fulcrums.

An apparatus and method for inspecting articles incorporating positive temperature coefficient resistors. The inspection apparatus includes a computing device, a power source, a housing, a support, and a thermal imager, each mounted within an interior volume of the housing. The inspection method includes receiving a first thermal image of the unpowered article mounted within the support and receiving a second thermal image of the powered article after an optimized time delay. The method further includes outputting a health indication of the positive temperature coefficient resistors based on a comparison of the first thermal image and the second thermal image.

A device for occupancy detection of a space includes a passive infrared (PIR) sensor having a fixed field of view; an infrared reflector positioned proximate to the PIR sensor for re-directing infrared radiation received from within the space toward the PIR sensor; an electromechanical device coupled to the infrared reflector and operative to alter a pointing angle thereof in response to a control signal; and, detection and control circuitry (or a microcontroller), coupled to the PIR sensor and the electromechanical device, operative to receive a signal from the PIR sensor indicative of motion of a person within the space, and further operative to selectively alter the pointing angle of the infrared reflector, using the electromechanical device, whereby the relative position of the person is shifted within the fixed field of view of the PIR sensor, thereby simulating motion of the person even when stationary.

Described herein is a method of detecting anomalies on a surface of a structure. The method may comprise taking a thermal image of the surface of the structure. The method may further comprise taking a visual image of the surface of the structure. The method may then comprise conducting a thermal image numerical analysis on the thermal image. The thermal image numerical analysis may comprise obtaining a thermal image numerical value table. The thermal image numerical analysis may then comprise obtaining a surface nominal thermal value of the surface material. The thermal image numerical analysis may then comprise eliminating a first subset of pixels having a thermal value within a nominal thermal variation from the plurality of pixels. The thermal image numerical analysis may then comprise comparing the thermal value of each pixel of the plurality of pixels not in the first subset of pixels to the surface nominal thermal value to identify at least one anomaly. The thermal image numerical analysis method may then comprise removing a first number (n.sub.1) of first anomalies from the thermal image numerical analysis. Finally, the method may comprise comparing the first anomalies from the thermal image numerical analysis to the visual image.

Described herein is a method of detecting anomalies on a surface of a structure. The method may comprise taking a thermal image of the surface of the structure. The method may further comprise taking a visual image of the surface of the structure. The method may then comprise conducting a thermal image numerical analysis on the thermal image. The thermal image numerical analysis may comprise obtaining a thermal image numerical value table. The thermal image numerical analysis may then comprise obtaining a surface nominal thermal value of the surface material. The thermal image numerical analysis may then comprise eliminating a first subset of pixels having a thermal value within a nominal thermal variation from the plurality of pixels. The thermal image numerical analysis may then comprise comparing the thermal value of each pixel of the plurality of pixels not in the first subset of pixels to the surface nominal thermal value to identify at least one anomaly. The thermal image numerical analysis method may then comprise removing a first number (n.sub.1) of first anomalies from the thermal image numerical analysis. Finally, the method may comprise comparing the first anomalies from the thermal image numerical analysis to the visual image.

An object of the present invention is to provide a bolometer having a high TCR value and a low resistance, and a method for manufacturing the same.

According to the present invention, a bolometer manufacturing method including: fabricating an interlayer having a function that enhances binding between a substrate and a carbon nanotube, in a predetermined shape on the substrate; and, making a semiconducting carbon nanotube dispersion liquid move on the interlayer in one direction relative to the fabricated interlayer is provided.

The present invention provides a far infrared (FIR) sensor device formed on a substrate, wherein the FIR sensor device includes: a sensor region, which is formed on the substrate, and is configured to operably sense a far infrared signal; and a sensor dielectric layer, which is formed on the sensor region, wherein a thickness of the sensor dielectric layer is determined by a sacrificial metal layer.

An electronic device for enhancing accuracy upon contactless body temperature measurement is provided. The electronic device includes an image sensor for obtaining an image of an object, a temperature sensor disposed at a position adjacent to the image sensor for measuring a temperature of the obtained object, and a controller for performing control to determine the temperature of the object using a focal length of a camera module including the image sensor corresponding to a time of obtaining the image of the object and a temperature output from the temperature sensor corresponding to the time of obtaining the image of the object.