A method for installing a replacement electrical heat sensor in a heatable aircraft window laminate structure comprising the steps of: drilling a blind hole in the edge of the window laminate; routing a channel in the edge of the window laminate from the blind hole to a terminal block of an originally installed heat sensor; inserting the replacement heat sensor into the hole; filling the hole with a material to seal the hole and the heat sensor from contamination; heating the window laminate; photographing the window laminate using an infrared camera to determine uniformity of heat distribution; placing a heated plate against the exterior surface of the window laminate directly over the position of the replacement heat sensor; measuring an electrical resistance of the replacement heat sensor to confirm proper operation of the replacement heat sensor.

A method for installing a replacement electrical heat sensor in a heatable aircraft window laminate structure comprising the steps of: drilling a blind hole in the edge of the window laminate; routing a channel in the edge of the window laminate from the blind hole to a terminal block of an originally installed heat sensor; inserting the replacement heat sensor into the hole; filling the hole with a material to seal the hole and the heat sensor from contamination; heating the window laminate; photographing the window laminate using an infrared camera to determine uniformity of heat distribution; placing a heated plate against the exterior surface of the window laminate directly over the position of the replacement heat sensor; measuring an electrical resistance of the replacement heat sensor to confirm proper operation of the replacement heat sensor.

Techniques for facilitating testing analytics of imaging systems and methods using molds are provided. In one example, a system includes a mold temperature controller configured to apply a thermal signature to a mold of a target. The system further includes a focal plane array configured to capture an infrared image of the mold. The system further includes an image analytics device configured to determine thermal analytics associated with the mold based on the infrared image. Related devices and methods are also provided.

Techniques for facilitating testing analytics of imaging systems and methods using molds are provided. In one example, a system includes a mold temperature controller configured to apply a thermal signature to a mold of a target. The system further includes a focal plane array configured to capture an infrared image of the mold. The system further includes an image analytics device configured to determine thermal analytics associated with the mold based on the infrared image. Related devices and methods are also provided.

An upper radiation thermometer is provided obliquely above a semiconductor wafer to be measured. The upper radiation thermometer includes a photovoltaic detector that produces an electromotive force when receiving light. The photovoltaic detector has both high-speed responsivity and good noise properties in a low-frequency range. The upper radiation thermometer does not require a mechanism for cooling because the photovoltaic detector is capable of obtaining sufficient sensitivity at room temperature without being cooled. There is no need to provide a light chopper and a differentiating circuit in the upper radiation thermometer. This allows the upper radiation thermometer to measure the front surface temperature of the semiconductor wafer with a simple configuration both during preheating by means of halogen lamps and during flash irradiation.

An upper radiation thermometer is provided obliquely above a semiconductor wafer to be measured. The upper radiation thermometer includes a photovoltaic detector that produces an electromotive force when receiving light. The photovoltaic detector has both high-speed responsivity and good noise properties in a low-frequency range. The upper radiation thermometer does not require a mechanism for cooling because the photovoltaic detector is capable of obtaining sufficient sensitivity at room temperature without being cooled. There is no need to provide a light chopper and a differentiating circuit in the upper radiation thermometer. This allows the upper radiation thermometer to measure the front surface temperature of the semiconductor wafer with a simple configuration both during preheating by means of halogen lamps and during flash irradiation.

The invention proposed the thermal imaging radar includes of main components: Assembly pedestal, Assembly rotary shaft, and Assembly housing. Electronic circuits, encoders, mechanisms, motor are optimized arranged and scientifically designed the layout space and the weight of the structure. This device is compact for camouflage purposes, easy to assemble or disassemble, and waterproof. The invention's products can be applied in automatic security station, produces 360-degree panoramic imaging of the continuously day and night for surveillance area, detects and tracks moving objects captured by the thermal sensor. Furthermore, The product is also applicable for monitoring the ambient temperature in large areas, localizing high-temperature areas to recognize and warn the possible explosions.

The invention proposed the thermal imaging radar includes of main components: Assembly pedestal, Assembly rotary shaft, and Assembly housing. Electronic circuits, encoders, mechanisms, motor are optimized arranged and scientifically designed the layout space and the weight of the structure. This device is compact for camouflage purposes, easy to assemble or disassemble, and waterproof. The invention's products can be applied in automatic security station, produces 360-degree panoramic imaging of the continuously day and night for surveillance area, detects and tracks moving objects captured by the thermal sensor. Furthermore, The product is also applicable for monitoring the ambient temperature in large areas, localizing high-temperature areas to recognize and warn the possible explosions.

Example implementations described herein are directed to integration of far infrared cameras in a vehicle system to detect objects based on relative temperature of objects. Such implementations can improve accuracy when paired, for example, with classification systems that classify objects based on the shape of the object, as both the shape and relative temperature can be used to ensure that the classification is accurate. Further, example implementations can synchronize far infrared cameras with other sensor systems to determine distance, energy, and absolute temperature of an object, which can also be used to enhance classification. Such classifications can then be provided to an advanced driver assistance systems (ADAS), which can control the vehicle system in accordance with the object classification.

Example implementations described herein are directed to integration of far infrared cameras in a vehicle system to detect objects based on relative temperature of objects. Such implementations can improve accuracy when paired, for example, with classification systems that classify objects based on the shape of the object, as both the shape and relative temperature can be used to ensure that the classification is accurate. Further, example implementations can synchronize far infrared cameras with other sensor systems to determine distance, energy, and absolute temperature of an object, which can also be used to enhance classification. Such classifications can then be provided to an advanced driver assistance systems (ADAS), which can control the vehicle system in accordance with the object classification.