A facility-equipment temperature control system allows for controlling the surface temperature of the facility equipment at a low cost and reduction in workload. The facility-equipment temperature control system includes a non-fixed image-capturing device and an image-processing device. The image-capturing device captures the image of the surface of facility equipment to obtain a visible image and a thermal image. Based on the shape information of the common reference part existing in the first visible image and the second visible image, the image-processing device sets a comparison area at the same position and in the same range on the first visible image and the second visible image. In addition, the image-processing device corrects the deviation of the field angle in the comparison area of the first thermal image and the second thermal image and displays the temperature-difference-information, which was obtained by comparing the corrected thermal images on the display screen.

A facility-equipment temperature control system allows for controlling the surface temperature of the facility equipment at a low cost and reduction in workload. The facility-equipment temperature control system includes a non-fixed image-capturing device and an image-processing device. The image-capturing device captures the image of the surface of facility equipment to obtain a visible image and a thermal image. Based on the shape information of the common reference part existing in the first visible image and the second visible image, the image-processing device sets a comparison area at the same position and in the same range on the first visible image and the second visible image. In addition, the image-processing device corrects the deviation of the field angle in the comparison area of the first thermal image and the second thermal image and displays the temperature-difference-information, which was obtained by comparing the corrected thermal images on the display screen.

This infrared imaging device includes: an infrared transmission lens which collects infrared light emitted from an object; an infrared imaging element having a screen in which pixels for converting infrared light collected by the infrared transmission lens to electric signals are arranged in a two-dimensional array; a signal processing unit which converts electric signals from the infrared imaging element to digital signals; an optical characteristics correction unit which performs optical characteristics correction for an output of the signal processing unit on the basis of non-image-formation information set in advance for the infrared transmission lens; a reference temperature detection unit which detects a reference temperature; and a temperature measurement unit which performs absolute temperature conversion for the object on the basis of an output of the optical characteristics correction unit and an output of the reference temperature detection unit.

This infrared imaging device includes: an infrared transmission lens which collects infrared light emitted from an object; an infrared imaging element having a screen in which pixels for converting infrared light collected by the infrared transmission lens to electric signals are arranged in a two-dimensional array; a signal processing unit which converts electric signals from the infrared imaging element to digital signals; an optical characteristics correction unit which performs optical characteristics correction for an output of the signal processing unit on the basis of non-image-formation information set in advance for the infrared transmission lens; a reference temperature detection unit which detects a reference temperature; and a temperature measurement unit which performs absolute temperature conversion for the object on the basis of an output of the optical characteristics correction unit and an output of the reference temperature detection unit.

A non-destructive testing system for photovoltaic cells includes a non-contact electromagnetic induction device, a short-wave infrared (SWIR) camera or/and a visible-light camera, a thermal imaging device, and an image processing device. The non-contact electromagnetic induction device is configured for generating an external electric field acting on the photovoltaic cell without being in contact with the photovoltaic cell. A direction of the external electric field is parallel to that of an internal electric field of the photovoltaic cell. The SWIR camera or/and the visible-light camera is/are configured for obtaining an optical radiation distribution map within the photovoltaic cell. The thermal imaging device is configured for obtaining a thermal radiation distribution map in the photovoltaic cell. The image processing device is configured for storing and processing the optical and thermal radiation distribution maps. Non-destructive testing equipment including the above system is further provided.

Methods and systems of heating a substrate in a vacuum deposition process include a resistive heater having a resistive heating element. Radiative heat emitted from the resistive heating element has a wavelength in a mid-infrared band from 5 μm to 40 μm that corresponds to a phonon absorption band of the substrate. The substrate comprises a wide bandgap semiconducting material and has an uncoated surface and a deposition surface opposite the uncoated surface. The resistive heater and the substrate are positioned in a vacuum deposition chamber. The uncoated surface of the substrate is spaced apart from and faces the resistive heater. The uncoated surface of the substrate is directly heated by absorbing the radiative heat.

Example aspects of a thermal monitoring system are disclosed. The thermal monitoring system can comprise a cryogenic storage container comprising an external wall and an internal wall, wherein a cold cryogenic liquid is housed within the internal wall, and wherein a vacuum is formed between the external wall and the internal wall; a thermal imaging camera configured to measure temperatures within a region of interest, wherein the cryogenic storage container is oriented within the region of interest and the thermal imaging camera measures an external temperature of the outer wall of the cryogenic storage container, the thermal imaging camera further comprising camera software configured to generate a thermographic video of the external temperature; a display device displaying the thermographic video; and an alarm unit configured to activate an alert when the external temperature of the cryogenic storage container drops below a pre-selected trigger temperature.

Example aspects of a thermal monitoring system are disclosed. The thermal monitoring system can comprise a cryogenic storage container comprising an external wall and an internal wall, wherein a cold cryogenic liquid is housed within the internal wall, and wherein a vacuum is formed between the external wall and the internal wall; a thermal imaging camera configured to measure temperatures within a region of interest, wherein the cryogenic storage container is oriented within the region of interest and the thermal imaging camera measures an external temperature of the outer wall of the cryogenic storage container, the thermal imaging camera further comprising camera software configured to generate a thermographic video of the external temperature; a display device displaying the thermographic video; and an alarm unit configured to activate an alert when the external temperature of the cryogenic storage container drops below a pre-selected trigger temperature.

Embodiments disclosed herein generally relate to a substrate temperature monitoring system in a substrate support assembly. In one embodiment, the substrate support assembly includes a support plate and a substrate temperature monitoring system. The support plate has a top surface configured to support a substrate. The substrate temperature monitoring system is disposed in the substrate support plate. The substrate temperature monitoring system is configured to measure a temperature of the substrate from a bottom surface of the substrate. The substrate temperature monitoring system includes a window, a body, and a temperature sensor. The window is integrally formed in a top surface of the support plate. The body is embedded in the support plate, through the bottom surface. The body defines an interior passage. The temperature sensor is disposed in the interior passage beneath the window. The temperature sensor is configured to measure the temperature of the substrate.

Systems, methods, and computer program products for thermal contrast determinations are provided. An example imaging system includes a first infrared (IR) imaging device that generates first IR image data of a field of view of the first IR imaging device and a computing device connected with the first IR imaging device. The computing device receives probe temperature data from a temperature probe indicative of an external environment of the imaging system and receives the first IR image data from the first IR imaging device. The computing device determines background temperature data based upon the first IR image data, determines gas temperature data based upon the probe temperature data, and determines a thermal contrast for each pixel based upon a comparison between the background temperature data and the gas temperature data. The computing device further determines a detection limit for each pixel as a function of thermal contrast.