A process fluid multivariable measurement system is provided. The multivariable measurement system includes a thermowell configured to couple to a process fluid conduit and extend through a wall of the process fluid conduit. The multivariable measurement system also includes a temperature sensor assembly disposed within the thermowell, the temperature sensor assembly having at least one temperature sensitive element disposed therein. The multivariable measurement system also includes a pressure sensor assembly coupled to the thermowell, the pressure sensor assembly having at least one pressure sensitive element disposed therein. The multivariable measurement system further includes transmitter circuitry, communicatively coupled to the temperature sensor assembly and the pressure sensor assembly, configured to receive a temperature sensor signal from the at least one temperature sensitive element and responsively generate a temperature measurement output based on the temperature sensor signal. The transmitter circuitry is further configured to receive a pressure sensor signal from the at least one pressure sensitive element and responsively generate a pressure measurement output based on the pressure sensor signal.

A sensor assembly includes a controller, a sensor, and a housing. The housing encloses the controller and sensor and includes a body supporting the controller and a head supporting the sensor. The body prevents exposure of the controller to an external environment, and the head includes slots enabling exposure of the sensor to the external environment.

A sensor assembly includes a controller, a sensor, and a housing. The housing encloses the controller and sensor and includes a body supporting the controller and a head supporting the sensor. The body prevents exposure of the controller to an external environment, and the head includes slots enabling exposure of the sensor to the external environment.

A unit for high-temperature for uses above 700° C. is provided. The unit includes a housing and an electrical functional element. The functional element has a non-conducting substrate, an electrically conductive element, and at least one connection wire or pad. The functional element has a first section, a second section, and a third section. The first section is within the housing and shielded from a local environment. The second section includes the at least one connection wire or pad and is accessible externally to the housing. The third section is between the first and second sections and is embedded in an electrically insulating material. The insulating material seals off the housing from the functional element. A physical and/or chemical bond at an interface between the insulating material and the functional element.

A unit for high-temperature for uses above 700° C. is provided. The unit includes a housing and an electrical functional element. The functional element has a non-conducting substrate, an electrically conductive element, and at least one connection wire or pad. The functional element has a first section, a second section, and a third section. The first section is within the housing and shielded from a local environment. The second section includes the at least one connection wire or pad and is accessible externally to the housing. The third section is between the first and second sections and is embedded in an electrically insulating material. The insulating material seals off the housing from the functional element. A physical and/or chemical bond at an interface between the insulating material and the functional element.

In a described example, an apparatus includes: a package substrate including a die pad configured for mounting a semiconductor die, a first lead connected to the die pad, and a second lead and a third lead; and a semiconductor die including a temperature sensor mounted on the die pad. The semiconductor die includes a first metallization layer being a metallization layer closest to the active surface of the semiconductor die, and successive metallization layers overlying the previous metallization layer, the metallization layers including a respective conductor layer in a dielectric material for the particular metallization layer and conductive vias; and the temperature sensor formed of the conductor layer in an uppermost metallization layer and coupled to the second lead and to the third lead. The semiconductor die includes a high voltage ring formed in the uppermost metallization layer, spaced from and surrounding the temperature sensor.

A temperature measurement device includes: a case fixed to a measurement target product; a flexible printed circuit board attached to the case; and a thermistor element mounting portion having a thermistor element to be electrically connected to a wiring provided on the flexible printed circuit board, the case has a holding portion for holding the thermistor element mounting portion and a support portion for supporting the holding portion, the holding portion is connected through a hinge portion to a case body provided with the support portion, and the holding portion is supported by the support portion in such a manner that the holding portion is folded back to bend the hinge portion.

A temperature measurement device includes: a case fixed to a measurement target product; a flexible printed circuit board attached to the case; and a thermistor element mounting portion having a thermistor element to be electrically connected to a wiring provided on the flexible printed circuit board, the case has a holding portion for holding the thermistor element mounting portion and a support portion for supporting the holding portion, the holding portion is connected through a hinge portion to a case body provided with the support portion, and the holding portion is supported by the support portion in such a manner that the holding portion is folded back to bend the hinge portion.

A wearable environmental sensor is configured to measure environmental information regarding a place where the device is worn, and includes a black-bulb temperature sensor including a black bulb and a temperature sensor for measuring internal temperature in the black bulb, the black-bulb temperature sensor being in a housing, wherein the black bulb includes an insertion hole into which the temperature sensor is inserted, the black bulb includes a weld portion welded to the housing, in an outer-circumferential portion of the bottom surface, the black bulb includes a guide portion in an outer-circumferential portion around the insertion hole, the housing includes an insertion opening into which the guide portion of the black bulb is inserted, the housing includes a protruding portion at an outer-circumferential portion around the insertion opening, and the guide portion is supported by the protruding portion.

A wearable environmental sensor is configured to measure environmental information regarding a place where the device is worn, and includes a black-bulb temperature sensor including a black bulb and a temperature sensor for measuring internal temperature in the black bulb, the black-bulb temperature sensor being in a housing, wherein the black bulb includes an insertion hole into which the temperature sensor is inserted, the black bulb includes a weld portion welded to the housing, in an outer-circumferential portion of the bottom surface, the black bulb includes a guide portion in an outer-circumferential portion around the insertion hole, the housing includes an insertion opening into which the guide portion of the black bulb is inserted, the housing includes a protruding portion at an outer-circumferential portion around the insertion opening, and the guide portion is supported by the protruding portion.