G01K1/16

Accurate battery temperature measurement by compensating self heating

A method for accurately measuring a battery temperature using a temperature sensor embodied in a battery monitoring integrated circuit is disclosed. The method includes performing calibration to estimate a thermal resistance between the battery monitoring integrated circuit and a terminal of a battery, measuring a temperature using the temperature sensor, measuring a voltage at the terminal or at a supply pin of the battery monitoring integrated circuit while a current is being used to charge or discharge the battery, calculating a power by multiplying the voltage and the current, and calculating a self-heating temperature adjustment to the temperature by multiplying the power and the thermal resistance.

Plurality of heat sinks for a semiconductor package

Various embodiments may provide a semiconductor package. The semiconductor package may include a first electrical component, a second electrical component, a first heat sink, and a second heat sink bonded to a first package interconnection component and a second package interconnection component. The first package interconnection component and the second package interconnection component may provide lateral and vertical interconnections in the package.

Resonance device

A resonance device with improved precision of temperature control. The resonance device includes a platform; a resonator including a vibrator and one or more holding arms that connect the vibrator and the platform to each other such that a first groove is provided around the vibrator. Moreover, the resonance device includes a sensor with a measurement portion that measures temperature and a heater formed on the platform. A second groove is provided between the measurement portion and the heater.

Resonance device

A resonance device with improved precision of temperature control. The resonance device includes a platform; a resonator including a vibrator and one or more holding arms that connect the vibrator and the platform to each other such that a first groove is provided around the vibrator. Moreover, the resonance device includes a sensor with a measurement portion that measures temperature and a heater formed on the platform. A second groove is provided between the measurement portion and the heater.

Furnace for relieving stress from glass products

A furnace for relieving glass products of stress is provided. The furnace has a furnace interior and a thermal element that measures temperatures in the furnace interior. The thermal element is enclosed by an enveloping tube composed of an inorganic material.

Cooktop appliance with a wired temperature sensor

A gas burner assembly includes a gas burner. A grate with a plurality of fingers is positioned above the gas burner. The plurality of fingers includes a sensor finger. A temperature sensor is mounted to the sensor finger of the plurality of fingers of the grate at a first end portion of the sensor finger. The temperature sensor is thermally isolated from the grate.

Structure for detecting temperature of electronic device

An electronic device is provided. The electronic device includes a housing configured to form an external shape thereof, a first board disposed in a first direction that is away from the housing, wherein at least one processor is mounted at the first board, a second board disposed between the housing and the first board and electrically connected with the first board, and a thermistor mounted on the second board, wherein the at least one processor measures a temperature of the housing based on an electrical signal received from the second board.

Structure for detecting temperature of electronic device

An electronic device is provided. The electronic device includes a housing configured to form an external shape thereof, a first board disposed in a first direction that is away from the housing, wherein at least one processor is mounted at the first board, a second board disposed between the housing and the first board and electrically connected with the first board, and a thermistor mounted on the second board, wherein the at least one processor measures a temperature of the housing based on an electrical signal received from the second board.

Fiber optic temperature probe

There is provided a fiber optic temperature probe having a base, a first tube connected to the base, a second tube provided coaxially within the first tube, a probe tip extending through an opening in a distal end of the first tube; and an optical fiber extending from within the base through an opening in the proximal end of the first tube and being substantially coaxial with respect to the first tube. There is also provided a fiber optic temperature probe having a base, a first tube connected to the base, a probe tip extending through an opening in a distal end of the first tube, an optical fiber extending from within the base through an opening in the proximal end of the first tube and being substantially coaxial with respect to the first tube, and a first lens positioned between the probe tip and the optical fiber.

Monitoring device
11586232 · 2023-02-21 · ·

A wireless and cellular vibration monitoring device (2) comprising a connection structure (6) suitable for attaching the monitoring device (2) to equipment to be monitored is disclosed. The monitoring device (2) comprises a temperature sensor (8) and a vibration sensor (10) configured to remotely monitor vibration and temperature transferred to the monitoring device (2) via the connection structure (6). The device comprises an integrated satellite-based radio-navigation system for location detection. The monitoring device (2) comprises a metal base (4) comprising a body portion (56) comprising a threaded portion (6) constituting the connection structure (6). The threaded portion (6) comprises male threads and protrudes from the body portion (56) of the base (4). The temperature sensor (8) is thermally connected to the body portion (56) of the base (4).