Described are methods and systems using optical fiber interferometry to sense interference causing events in a region of interest and differentiate between a strain event and a thermal event. Other methods and systems relate to the use of optical fiber interferometry for determining temperature offset in a region of interest and using the determined temperature offset for determining temperature in the region of interest.

The invention comprises a system for calculating a value for the effective thermal mass of a building. The climate control system obtains temperature measurements from at least a first location conditioned by the climate system. One or more processors receive measurements of outside temperatures from at least one source other than the control system and compare the temperature measurements from the first location with expected temperature measurements. The expected temperature measurements are based at least in part upon past temperature measurements obtained by said HVAC control system and said outside temperature measurements. The processors then calculate one or more rates of change in temperature at said first location.

Various embodiments of the present technology may comprise methods and apparatus for predictive modeling in an imaging system. The methods and apparatus for predictive modeling may comprise various circuits and/or systems configured to measure a temperature and utilize the measured temperature in conjunction with a predictive model to predict a self-heating value, temperature changes, and an ambient temperature.

Various embodiments of the present technology may comprise methods and apparatus for predictive modeling in an imaging system. The methods and apparatus for predictive modeling may comprise various circuits and/or systems configured to measure a temperature and utilize the measured temperature in conjunction with a predictive model to predict a self-heating value, temperature changes, and an ambient temperature.

A cooled thermocouple arrangement (1) including a thermocouple (2) comprising two wires (3,4) joined at a first sensing end (5) to define a hot thermocouple function. At least a portion of the wires (3,4) are in thermal communication with a cooling arrangement, and the cooling arrangement has an inlet (14) for coolant and an outlet (15) for coolant. The thermocouple probe arrangement (1) includes a first inlet temperature sensor (21) for determining the temperature of the coolant as it enters the cooling arrangement, and a flow rate sensor (20) for determining the flow rate of coolant passing through the cooling arrangement. The thermocouple probe arrangement (1) includes connectors for connecting the outputs from the thermocouple (2), first inlet temperature sensor (21) and the flow rate sensor (20) to a correction data processor (23) whereby the data processor can correct the temperature sensed by the thermocouple to take account of the effect of the cooling arrangement. The pair of thermocouple wires (3,4) are arranged inside a sheath or casing, and a cooling jacket (12) is provided around the thermocouple probe. The cooling jacket (12) includes a pair of concentric tubes (16,17) defining a return coolant circuit from the end of the probe proximal the connectors (8), to a portion of the probe distal from the connectors, and then back to the proximal end (8) of the probe, and the portion of the thermocouple probe containing the sensing end (5) of the thermocouple projects from the distal end of the cooling jacket (12).

A cooled thermocouple arrangement (1) including a thermocouple (2) comprising two wires (3,4) joined at a first sensing end (5) to define a hot thermocouple function. At least a portion of the wires (3,4) are in thermal communication with a cooling arrangement, and the cooling arrangement has an inlet (14) for coolant and an outlet (15) for coolant. The thermocouple probe arrangement (1) includes a first inlet temperature sensor (21) for determining the temperature of the coolant as it enters the cooling arrangement, and a flow rate sensor (20) for determining the flow rate of coolant passing through the cooling arrangement. The thermocouple probe arrangement (1) includes connectors for connecting the outputs from the thermocouple (2), first inlet temperature sensor (21) and the flow rate sensor (20) to a correction data processor (23) whereby the data processor can correct the temperature sensed by the thermocouple to take account of the effect of the cooling arrangement. The pair of thermocouple wires (3,4) are arranged inside a sheath or casing, and a cooling jacket (12) is provided around the thermocouple probe. The cooling jacket (12) includes a pair of concentric tubes (16,17) defining a return coolant circuit from the end of the probe proximal the connectors (8), to a portion of the probe distal from the connectors, and then back to the proximal end (8) of the probe, and the portion of the thermocouple probe containing the sensing end (5) of the thermocouple projects from the distal end of the cooling jacket (12).

A temperature sensor assembly for measuring a gas temperature in a gas flow stream includes a first substrate having a first surface configured to be connected to a thermally conductive structure in a gas path, a first temperature sensor mounted to the first substrate a first distance from the first surface, and a second temperature sensor mounted to the first substrate a second distance from the first surface. The second distance is less than the first distance. The first and second temperature sensors are arranged along a temperature gradient.

A temperature-determining device for determining a temperature (TMED) of a medium via a temperature of a surface includes: an ambient-temperature sensor, arranged in surroundings of the surface, for measuring an ambient temperature (TU); a surface-temperature sensor, lying on the surface, for measuring a mixed temperature (TM) lying between the temperature (TMED) of a medium and the ambient temperature (TU); and an arithmetic-logic unit having an approximation formula electronically stored thereon for calculating an approximation (TMEDN) of a temperature of a medium. The approximation formula is a sum of the mixed temperature (TM) and a product of two factors. The first factor results from a difference between the mixed temperature (TM) and the ambient temperature (TU) and the second factor results from a ratio of a dividend to a quotient. The dividend results from a difference between a calibration temperature (TMEDKAL) of a medium and a calibration mixed temperature (TMKAL).

A temperature-determining device for determining a temperature (TMED) of a medium via a temperature of a surface includes: an ambient-temperature sensor, arranged in surroundings of the surface, for measuring an ambient temperature (TU); a surface-temperature sensor, lying on the surface, for measuring a mixed temperature (TM) lying between the temperature (TMED) of a medium and the ambient temperature (TU); and an arithmetic-logic unit having an approximation formula electronically stored thereon for calculating an approximation (TMEDN) of a temperature of a medium. The approximation formula is a sum of the mixed temperature (TM) and a product of two factors. The first factor results from a difference between the mixed temperature (TM) and the ambient temperature (TU) and the second factor results from a ratio of a dividend to a quotient. The dividend results from a difference between a calibration temperature (TMEDKAL) of a medium and a calibration mixed temperature (TMKAL).

An apparatus includes a substrate, a nested enclosure assembly including an outer enclosure and an inner enclosure, wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses at least the electronic assembly. An insulating medium is disposed within a cavity between the outer surface of the inner enclosure and the inner surface of the outer enclosure and the system includes a sensor assembly communicatively coupled to the electronic assembly. The sensor assembly includes one or more sensors that are configured to acquire one or more measurement parameters at one or more locations of the substrate. The electronic assembly is configured to receive the one or more measurement parameters from the one or more sensors.