A method (300) for determining temperature in a region (220/230) of an environment (200) by compensating for heat-up of a temperature sensor caused by ambient air and/or electronic heating, using a system (100) comprising: (i) a structure (110); (ii) a controller (130); and (iii) a temperature sensor (120), the method comprising: obtaining (320) first temperature measurements while the structure is in a first operating mode; changing (330) the first operating mode of the structure to a second operating mode; obtaining (340) second temperature measurements while the structure is in the second operating mode; determining (350) a temperature correction comprising an effect of the second operating mode on the temperature sensor; obtaining (360) a new temperature measurement during operation of the structure in the second operating mode; and adjusting (370), using the temperature correction, the new temperature measurement to generate a compensated temperature measurement.

A method (300) for determining temperature in a region (220/230) of an environment (200) by compensating for heat-up of a temperature sensor caused by ambient air and/or electronic heating, using a system (100) comprising: (i) a structure (110); (ii) a controller (130); and (iii) a temperature sensor (120), the method comprising: obtaining (320) first temperature measurements while the structure is in a first operating mode; changing (330) the first operating mode of the structure to a second operating mode; obtaining (340) second temperature measurements while the structure is in the second operating mode; determining (350) a temperature correction comprising an effect of the second operating mode on the temperature sensor; obtaining (360) a new temperature measurement during operation of the structure in the second operating mode; and adjusting (370), using the temperature correction, the new temperature measurement to generate a compensated temperature measurement.

Temperature sensing probes for sensing the temperature of a substrate based on fluorescence are disclosed. The temperature sensing probes include a fiber optic cable having at a cold end an optical interface and at a hot end a temperature sensing element for contacting a substrate. A sheath surrounds at least a portion of the hot end of the fiber optic cable. A retaining member securely and removably engages the sheath with a support member. The sheath forms a vacuum seal around the contact between the temperature sensing element and the substrate.

Temperature sensing probes for sensing the temperature of a substrate based on fluorescence are disclosed. The temperature sensing probes include a fiber optic cable having at a cold end an optical interface and at a hot end a temperature sensing element for contacting a substrate. A sheath surrounds at least a portion of the hot end of the fiber optic cable. A retaining member securely and removably engages the sheath with a support member. The sheath forms a vacuum seal around the contact between the temperature sensing element and the substrate.

An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.

An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.

An electronic vapor provision device including a power cell and a computer, wherein the computer includes a computer processor, a memory and an input-output means, and wherein the device further includes a pressure sensor and a temperature sensor.

An electronic vapor provision device including a power cell and a computer, wherein the computer includes a computer processor, a memory and an input-output means, and wherein the device further includes a pressure sensor and a temperature sensor.

A measurement device includes: a first cover member having a measuring instrument; a second cover member forming an air layer between the first cover member and the second cover member; and a third cover member that transports heat flux from a measurement target outside the first cover member to an upper portion of the second cover member between the first cover member and the second cover member.

A smart-home device may include a temperature sensor, energy-consuming subsystems, and processors programmed to receive a temperature measurement from the temperature sensor for an ambient environment surrounding the temperature sensor; receive inputs from the energy-consuming subsystems that indicate power-consuming activities of the energy-consuming subsystems; providing the inputs from the energy-consuming subsystems to a model that is trained to calculate an effect of the power-consuming activity of the energy-consuming subsystems on the temperature measurement from the temperature sensor; and calculating an estimate of the temperature of the ambient environment by compensating the temperature measurement from the temperature sensor with using the effect of the power-consuming activity of the energy-consuming subsystems.