Patent classifications
G01K1/26
METHODS, SYSTEMS, ARTICLES OF MANUFACTURE, AND APPARATUS FOR IMPROVED THERMAL TESTS OF INTEGRATED CIRCUIT DEVICES
Systems, apparatus, articles of manufacture, and methods are disclosed that improve thermal tests of integrated circuit devices. An example apparatus includes interface circuitry; machine readable instructions; and programmable circuitry to at least one of instantiate or execute the machine readable instructions to determine a condition of a fluid to be dispensed by a pneumatic nozzle, the condition of the fluid including a temperature of the fluid; determine a ratio of a first liquid, a second liquid, and a superheated vapor that combine to result in the condition of the fluid; and cause the first liquid, the second liquid, and the superheated vapor to be provided to the pneumatic nozzle in proportions defined by the ratio.
METHODS, SYSTEMS, ARTICLES OF MANUFACTURE, AND APPARATUS FOR IMPROVED THERMAL TESTS OF INTEGRATED CIRCUIT DEVICES
Systems, apparatus, articles of manufacture, and methods are disclosed that improve thermal tests of integrated circuit devices. An example apparatus includes interface circuitry; machine readable instructions; and programmable circuitry to at least one of instantiate or execute the machine readable instructions to determine a condition of a fluid to be dispensed by a pneumatic nozzle, the condition of the fluid including a temperature of the fluid; determine a ratio of a first liquid, a second liquid, and a superheated vapor that combine to result in the condition of the fluid; and cause the first liquid, the second liquid, and the superheated vapor to be provided to the pneumatic nozzle in proportions defined by the ratio.
Few-mode Rayleigh-based distributed fiber sensor for simultaneous temperature and strain sensing
Aspects of the present disclosure describe Rayleigh-based DTSS that utilizes few-mode fiber (FMF), which supports multiple spatial modes. For each spatial mode, a wavelength-scanning configuration gives the relative wavelength (or frequency) shift between two consecutive measurements. The temperature and strain changes can therefore be separated through different temperature/strain sensitivities of various mode-pairs. Advantageously, Rayleigh-based DTSS according to aspects of the present disclosure removes temperature-strain ambiguity, enhances measurement accuracy, reduces errors. and enables new features for multi-parameter sensing.
Managing a memory sub-system based on composite temperature
A plurality of device temperature values that are each indicative of a temperature at a respective device of a plurality of devices of a system is identified. A respective composite temperature threshold ratio is determined for each device of the plurality of devices. A respective normalization value based on the respective composite temperature threshold ratio and the respective device temperature value is determined for each device of the plurality of devices. A largest normalization value of the plurality of devices is determined. A composite temperature of the system based on the largest normalization value of the plurality of devices is set.
Systems and methods for monitoring food temperatures
A system includes one or more memory units and a processor. The processor is configured to receive, from a food temperature probe, a first temperature associated with a first food item. The processor is further configured to receive, from the food temperature probe, a second temperature associated with a second food item. The processor is further configured to receive, from the food temperature probe, a third temperature that was measured by the food temperature probe after measuring the first temperature but before measuring the second temperature, the third temperature associated with a cleaning of the food temperature probe. The processor is further configured to send an alert for display on a user device when the third temperature is greater than the cleaning threshold temperature.
COIL OF REFERENCE FIBER FOR DOWNHOLE FIBER SENSING MEASUREMENT
A method may include receiving interrogation data from a sensing fiber via a coil of reference fiber of a same type of fiber as the sensing fiber. The sensing fiber may be coupled in series with the coil of reference fiber. The method may also include receiving a known temperature and a known strain from the coil of reference fiber and outputting the known temperature, the known strain, and the interrogation data for use in calibrating a measurement of the interrogation data.
Sensor device for measuring a temperature difference in a computer chip system
A sensor system. The sensory system includes a substrate extending in a substrate plane, a closed cavity and a movable structure in the closed cavity, at least one portion of the movable structure being situated at a distance opposite a surface of the substrate extending in parallel to the main extension plane within the cavity, the distance varying when the movable structure is deflected, a temperature difference between the surface of the substrate and the movable structure being measurable by an action of force on the movable structure.
Sensor device for measuring a temperature difference in a computer chip system
A sensor system. The sensory system includes a substrate extending in a substrate plane, a closed cavity and a movable structure in the closed cavity, at least one portion of the movable structure being situated at a distance opposite a surface of the substrate extending in parallel to the main extension plane within the cavity, the distance varying when the movable structure is deflected, a temperature difference between the surface of the substrate and the movable structure being measurable by an action of force on the movable structure.
SENSOR PANEL
A panel for a skin inspection device is described. The panel comprises a substrate; an array of temperature sensors; an interlayer comprising a material for thermally insulating the temperature sensors from the substrate.
SENSOR PANEL
A panel for a skin inspection device is described. The panel comprises a substrate; an array of temperature sensors; an interlayer comprising a material for thermally insulating the temperature sensors from the substrate.