As a temperature measurement apparatus using a surface acoustic wave of a piezoelectric substrate that performs temperature measurement wirelessly and without power supply, the temperature measurement apparatus accurately measures the temperature of the thermocouple tip end by analyzing the frequency characteristics of the surface acoustic wave propagating on the piezoelectric substrate and including temperature information of the piezoelectric substrate, and detecting change in propagation time of the surface acoustic wave of the piezoelectric substrate that is changed by the electromotive force of the thermocouple.

The present disclosure relates to a rapid thermal processing apparatus for rapid heat treatment of a substrate, and particularly, to increasing the accuracy in measuring the temperature of a substrate to be thermally processed by configuring a thermocouple for measuring the temperature of the substrate under the same conditions as the substrate to be thermally processed so as to be attached to and detached from the chamber, and the present disclosure provides a rapid thermal processing apparatus having a thermocouple installed to measure a temperature of a substrate to be thermally processed located inside a chamber, and the rapid thermal processing apparatus includes a mounting hole formed in the chamber, and a thermocouple kit inserted into and mounted to the mounting hole so that a bonding portion of a thermocouple wire is located at a thermocouple substrate extending into the chamber.

The present disclosure relates to a rapid thermal processing apparatus for rapid heat treatment of a substrate, and particularly, to increasing the accuracy in measuring the temperature of a substrate to be thermally processed by configuring a thermocouple for measuring the temperature of the substrate under the same conditions as the substrate to be thermally processed so as to be attached to and detached from the chamber, and the present disclosure provides a rapid thermal processing apparatus having a thermocouple installed to measure a temperature of a substrate to be thermally processed located inside a chamber, and the rapid thermal processing apparatus includes a mounting hole formed in the chamber, and a thermocouple kit inserted into and mounted to the mounting hole so that a bonding portion of a thermocouple wire is located at a thermocouple substrate extending into the chamber.

The present disclosure includes a sensor element for registering temperature of an object, which includes: a substrate, wherein the substrate includes a platform face, which defines a first plane; a temperature detector, which is applied on a first temperature plane on the substrate and which is embodied to register the temperature of the object, wherein the first temperature plane lies in the first plane or essentially in parallel with the first plane; at least one sensor applied on a first subregion of the substrate for determining a temperature difference within the first subregion; and a passivation, which is applied on the substrate and which covers the substrate, the temperature detector and the sensor for determining the temperature difference, as well as residing in a method for assessing measurement quality of a sensor element of the present disclosure.

The present disclosure provides a temperature detection system arranged in a temperature detection device, and a charging device thereof. The temperature detection system includes a power supply, a Bluetooth chip configured to detect a temperature of an object to be measured, output detection pulses and including a thermistor module that is configured to detect an ambient temperature of the object to be measured to obtain an intermediate temperature value, and a pulse temperature sensor arranged around the Bluetooth chip. The Bluetooth chip is configured to receive the detection pulses, determine a final temperature value according to the intermediate temperature value and number of the detection pulses per unit time, and convert the final temperature value into Bluetooth signals to output. The present disclosure can ensure detection redundancy and improve detection accuracy, by providing two temperature detections to calculate the final temperature value according to a preset software program.

A bubbler device and method of its operation are disclosed. The bubbler device includes a bubbler tube that provides bubbles to a molten material in a furnace; a protective layer disposed on the bubbler tube; and a wire that is electrically coupled to the protective layer. The wire extends through the bore, and the protective layer and the wire partially form an electrical circuit for measuring integrity of the bubbler device based on at least one of conductivity or resistance in the electrical circuit. Sometimes, an inner protective material may be disposed on an inside surface of the tube and coupled to the protective layer, and the wire can be coupled to the inner protective material or multiple wires may be used. The use of dissimilar materials in these components may be used to form a thermocouple junction to measure the temperature of the molten material in a furnace.

A bubbler device and method of its operation are disclosed. The bubbler device includes a bubbler tube that provides bubbles to a molten material in a furnace; a protective layer disposed on the bubbler tube; and a wire that is electrically coupled to the protective layer. The wire extends through the bore, and the protective layer and the wire partially form an electrical circuit for measuring integrity of the bubbler device based on at least one of conductivity or resistance in the electrical circuit. Sometimes, an inner protective material may be disposed on an inside surface of the tube and coupled to the protective layer, and the wire can be coupled to the inner protective material or multiple wires may be used. The use of dissimilar materials in these components may be used to form a thermocouple junction to measure the temperature of the molten material in a furnace.

A method for determining a temperature of an object includes contacting the object with a first electrical conductor. A difference in electronegativity between the object and the first electrical conductor is greater than a predetermined value. The method also includes contacting the object or a substrate on which the object is positioned with a second electrical conductor. A difference in electronegativity between the object or the substrate and the second electrical conductor is less than the predetermined value. The method also includes connecting the first and second electrical conductors together. The method also includes measuring the temperature of the object using the first and second electrical conductors. The first and second electrical conductors form at least a portion of a thermocouple.

A method for determining a temperature of an object includes contacting the object with a first electrical conductor. A difference in electronegativity between the object and the first electrical conductor is greater than a predetermined value. The method also includes contacting the object or a substrate on which the object is positioned with a second electrical conductor. A difference in electronegativity between the object or the substrate and the second electrical conductor is less than the predetermined value. The method also includes connecting the first and second electrical conductors together. The method also includes measuring the temperature of the object using the first and second electrical conductors. The first and second electrical conductors form at least a portion of a thermocouple.

A heat amount measuring method includes a first step of providing a heat-transferring component that transfers and receives heat to and from a heating component and measuring, while the heating component is generating heat, a first heat amount of heat transmitted from the heating component to the heat-transferring component, a first heating component temperature, and a first substrate temperature, a second step of changing an output of the heat-transferring component and measuring a second heat amount of heat transmitted from the heating component to the heat-transferring component, a second heating component temperature, and a second substrate temperature, and a third step of calculating a heat amount of heat transmitted from the heating component to a substrate by using the first heat amount, the first heating component temperature, the first substrate temperature, the second heat amount, the second heating component temperature, and the second substrate temperature.