A temperature sensor is provided including a inner body (e.g., a connector body), an outer body (e.g., a cup), a thermally-conductive plate, a fastener clip, and a temperature sensor element. The cup includes a bottom wall with an opening with a portion of the plate positioned within the opening. The temperature sensor element is attached to the connector body and the connector body is attached to the cup with the temperature sensor element being positioned within the cup and in close proximity to the plate. A fastener clip is attached to the connector body.

A temperature sensor is provided including a inner body (e.g., a connector body), an outer body (e.g., a cup), a thermally-conductive plate, a fastener clip, and a temperature sensor element. The cup includes a bottom wall with an opening with a portion of the plate positioned within the opening. The temperature sensor element is attached to the connector body and the connector body is attached to the cup with the temperature sensor element being positioned within the cup and in close proximity to the plate. A fastener clip is attached to the connector body.

A sensor system included in an integrated circuit includes multiple sensor circuits and a control circuit. Using characterization data, a model may be generated that defines a relationship between measurable parameters of the integrated circuit and an operating characteristic of the integrated circuit. The control circuit can combine, using a function included in the model, data from the multiple sensor circuits to determine a value of the operating characteristic that is more accurate than a sensor circuit configured to measure a single parameter of the integrated circuit that varies with the operating characteristic.

A sensor system included in an integrated circuit includes multiple sensor circuits and a control circuit. Using characterization data, a model may be generated that defines a relationship between measurable parameters of the integrated circuit and an operating characteristic of the integrated circuit. The control circuit can combine, using a function included in the model, data from the multiple sensor circuits to determine a value of the operating characteristic that is more accurate than a sensor circuit configured to measure a single parameter of the integrated circuit that varies with the operating characteristic.

A sensor sheet includes unit sensor sheets configured to detect a physical property value at multiple points on a sensor layer, each unit sensor sheet including a first substrate, and an electrode layer and the sensor layer sequentially formed on one side of the first substrate; and a wiring substrate to which the unit sensor sheets are configured to be coupled, the wiring substrate including a second substrate, and a plurality of wirings provided on one side of the second substrate. One side of the wiring substrate and one side of each unit sensor sheet are facing each other. A conductive bonding member configured to electrically couple each unit sensor sheet and the wiring substrate with each other, is included between the electrode layer of each unit sensor sheet and at least one of the wirings of the wiring substrate.

A sensor sheet includes unit sensor sheets configured to detect a physical property value at multiple points on a sensor layer, each unit sensor sheet including a first substrate, and an electrode layer and the sensor layer sequentially formed on one side of the first substrate; and a wiring substrate to which the unit sensor sheets are configured to be coupled, the wiring substrate including a second substrate, and a plurality of wirings provided on one side of the second substrate. One side of the wiring substrate and one side of each unit sensor sheet are facing each other. A conductive bonding member configured to electrically couple each unit sensor sheet and the wiring substrate with each other, is included between the electrode layer of each unit sensor sheet and at least one of the wirings of the wiring substrate.

A device and a method for measuring and/or monitoring at least one process variable of a medium is provided. The device comprises a sensor unit with a mechanically vibrating unit, at least one reflection unit, a piezoelectric element which is attached to the membrane, and an electronic. The device is designed to excite the mechanically vibrating unit to mechanical vibrations using an excitation signal, to receive the mechanical vibrations of the vibrating unit and convert them into a first reception signal, to emit a transmission signal, and to receive a second reception signal. The electronic unit is designed to determine the at least one process variable of the medium based on the first and/or second reception signal.

A device and a method for measuring and/or monitoring at least one process variable of a medium is provided. The device comprises a sensor unit with a mechanically vibrating unit, at least one reflection unit, a piezoelectric element which is attached to the membrane, and an electronic. The device is designed to excite the mechanically vibrating unit to mechanical vibrations using an excitation signal, to receive the mechanical vibrations of the vibrating unit and convert them into a first reception signal, to emit a transmission signal, and to receive a second reception signal. The electronic unit is designed to determine the at least one process variable of the medium based on the first and/or second reception signal.

To provide a temperature sensor unit and a body core thermometer making it possible to produce in low costs. The temperature sensor unit (1) is used to measure a deep part body temperature Ti as a body core temperature of a testee. The temperature sensor unit (1) comprises at a measurement face side facing a body surface of the testee first-fourth temperature sensors (111-114) for measuring the body surface of the testee. Among the first and the second temperature sensors (111, 112), the first thermal resistor (121) is disposed only at the measurement face side of the first temperature sensor (111). Furthermore, the first temperature sensor (111) and the second temperature sensors (112) are disposed proximally such that a temperature Ti at the measurement face side of the first thermal resistor (121) becomes approximately equal to a temperature T2 measured by the second temperature sensor (112).

To provide a temperature sensor unit and a body core thermometer making it possible to produce in low costs. The temperature sensor unit (1) is used to measure a deep part body temperature Ti as a body core temperature of a testee. The temperature sensor unit (1) comprises at a measurement face side facing a body surface of the testee first-fourth temperature sensors (111-114) for measuring the body surface of the testee. Among the first and the second temperature sensors (111, 112), the first thermal resistor (121) is disposed only at the measurement face side of the first temperature sensor (111). Furthermore, the first temperature sensor (111) and the second temperature sensors (112) are disposed proximally such that a temperature Ti at the measurement face side of the first thermal resistor (121) becomes approximately equal to a temperature T2 measured by the second temperature sensor (112).