The present disclosure provides a temperature detection circuit. The temperature detection circuit includes: a first comparator, the first comparator having a first negative input terminal, a first positive input terminal and a first output terminal, the first negative input terminal being connected with an output terminal of a temperature sensor, the first positive input terminal being connected with a first reference voltage terminal; a monostable trigger, an input terminal of the monostable trigger being connected with the first output terminal of the first comparator; a low pass filter, an input terminal of the low pass filter being connected with an output terminal of the monostable trigger. The present disclosure further provides a temperature sensor device and a display device.

This application relates to methods and apparatus for temperature monitoring for integrated circuits, and in particular to temperature monitoring using a locked-loop circuits, e.g. FLLs, PLLs or DLLs. According to embodiments a locked-loop circuit includes a controlled signal timing module, wherein the timing properties of an output signal (S.sub.OUT, S.sub.FB) are dependent on a value of a control signal and on temperature. A controller compares a feedback signal (S.sub.FB) output from the timing module to a reference signal (S.sub.REF) and generates a control signal (S.sub.C) to maintain a desired timing relationship. A temperature monitor monitors temperature based on the value of the control signal. For FLLs and PLLs the signal timing module may be a controlled oscillator.

This application relates to methods and apparatus for temperature monitoring for integrated circuits, and in particular to temperature monitoring using a locked-loop circuits, e.g. FLLs, PLLs or DLLs. According to embodiments a locked-loop circuit includes a controlled signal timing module, wherein the timing properties of an output signal (S.sub.OUT, S.sub.FB) are dependent on a value of a control signal and on temperature. A controller compares a feedback signal (S.sub.FB) output from the timing module to a reference signal (S.sub.REF) and generates a control signal (S.sub.C) to maintain a desired timing relationship. A temperature monitor monitors temperature based on the value of the control signal. For FLLs and PLLs the signal timing module may be a controlled oscillator.

A dual-output microelectromechanical system (MEMS) resonator can be operated selectively and concurrently in an in-plane mode of vibration and an out-of-plane mode of vibration to obtain, respectively, a first electrical signal having a first frequency and a second electrical signal having a second frequency that is less than the first frequency. The first and second electrical signals are mixed to obtain a third electrical signal having a third frequency, where the third frequency is proportional to a temperature of the MEMS resonator. The temperature is determined based on the third frequency. Values of the first and second frequencies can be adjusted based on the determined temperature to compensate for frequency deviations due to temperature deviations. Also described herein are methods and systems for determining the temperature of the dual-output MEMS and for performing frequency compensation, as well as a method of manufacturing the dual-output MEMS.

An object provide a technique capable of measuring temperature on the basis of optically detected magnetic resonance with higher precision, The object is achieved by a method for measuring the temperature of an object on the basis of optically detected magnetic resonance of an inorganic fluorescent particle, including (a) irradiating the object, containing the inorganic fluorescent particle with each of multiple microwaves having different frequencies, (b) measuring the fluorescence intensities of the inorganic fluorescent particle with individual photon counters at the time of irradiation of respective microwaves, (c) correcting the fluorescence intensities on the basis of dependencies in the number of pulse measurements between the photon counters and (d) Calculating the temperature of the object on the basis of the obtained fluorescence intensity with the correction values.

An object provide a technique capable of measuring temperature on the basis of optically detected magnetic resonance with higher precision, The object is achieved by a method for measuring the temperature of an object on the basis of optically detected magnetic resonance of an inorganic fluorescent particle, including (a) irradiating the object, containing the inorganic fluorescent particle with each of multiple microwaves having different frequencies, (b) measuring the fluorescence intensities of the inorganic fluorescent particle with individual photon counters at the time of irradiation of respective microwaves, (c) correcting the fluorescence intensities on the basis of dependencies in the number of pulse measurements between the photon counters and (d) Calculating the temperature of the object on the basis of the obtained fluorescence intensity with the correction values.

An LC oscillator is provided. The LC oscillator includes a single layer inductor disposed within a single layer inlay, wherein the single layer inductor is configured in a spiral pattern within the layer of the inlay, wherein an integrated circuit is mounted on the single layer inlay; and a capacitor included in the integrated circuit, wherein the capacitor is connected to the single layer inductor.

An LC oscillator is provided. The LC oscillator includes a single layer inductor disposed within a single layer inlay, wherein the single layer inductor is configured in a spiral pattern within the layer of the inlay, wherein an integrated circuit is mounted on the single layer inlay; and a capacitor included in the integrated circuit, wherein the capacitor is connected to the single layer inductor.

There is provided a method of detecting the temperature of a component of a support system for semiconductor processing equipment, the method comprising: applying a radio frequency identity tag to the component, the radio frequency identity tag having a serial number; reading the radio frequency identity tag with a reader, the reader arranged to read the serial number of the radio frequency identity tag, and to identify the resonant frequency of the radio frequency identity tag; and converting the resonant frequency of the radio frequency tag to a temperature of the radio frequency identity tag.

There is provided a method of detecting the temperature of a component of a support system for semiconductor processing equipment, the method comprising: applying a radio frequency identity tag to the component, the radio frequency identity tag having a serial number; reading the radio frequency identity tag with a reader, the reader arranged to read the serial number of the radio frequency identity tag, and to identify the resonant frequency of the radio frequency identity tag; and converting the resonant frequency of the radio frequency tag to a temperature of the radio frequency identity tag.