A semiconductor device includes first and second electrode pads for externally connecting two electrodes of a sensor capacitor that has a capacitance that changes according to an environmental change. The semiconductor device further includes a capacitor having a pair of electrodes, one of the pair of electrodes being connected to the first electrode pad, a capacitance circuit having a reference capacitance, and a determination circuit that includes first and second relay terminals. The determination circuit is configured to send a charging current from the first relay terminal to the other electrode of the capacitor and send a charging current from the second relay terminal to the capacitance circuit, and determine whether or not the size of a potential of the first relay terminal is greater than the size of a potential of the second relay terminal, thereby determining whether a capacitance of the sensor capacitor has changed or not.

An arrangement for monitoring an aseptic manufacturing process includes product condition sensors capable of making closely spaced measurements of a product condition such as temperature or humidity. The measurements are made using closely spaced sensors arranged in a linear array on a single probe, which may be used to take measurements at multiple levels within the product. Data from the sensors is transmitted to a data collection point via short range wireless digital communications. The sensors may be used to measure temperature and humidity at a single point. For example, when the sensors are used in pharmaceutical freeze drying, the location of a sublimation front may be calculated for each vial, and the freeze drying process may be controlled using the data.

An arrangement for monitoring an aseptic manufacturing process includes product condition sensors capable of making closely spaced measurements of a product condition such as temperature or humidity. The measurements are made using closely spaced sensors arranged in a linear array on a single probe, which may be used to take measurements at multiple levels within the product. Data from the sensors is transmitted to a data collection point via short range wireless digital communications. The sensors may be used to measure temperature and humidity at a single point. For example, when the sensors are used in pharmaceutical freeze drying, the location of a sublimation front may be calculated for each vial, and the freeze drying process may be controlled using the data.

Provided is a system for directly sensing, measuring, or monitoring the temperature of an electrical conductor (31) of a power cable (10). A temperature sensitive capacitor (21C) is disposed in direct thermal contact with the electrical conductor (31). The temperature sensitive capacitor (21C) includes a dielectric material that has a dielectric constant variable with the temperature of the electrical conductor (31). The temperature of the electrical conductor (31) can be sensed, measured, or monitored by measuring the capacitance of the temperature sensitive capacitor (21C).

Provided is a system for directly sensing, measuring, or monitoring the temperature of an electrical conductor (31) of a power cable (10). A temperature sensitive capacitor (21C) is disposed in direct thermal contact with the electrical conductor (31). The temperature sensitive capacitor (21C) includes a dielectric material that has a dielectric constant variable with the temperature of the electrical conductor (31). The temperature of the electrical conductor (31) can be sensed, measured, or monitored by measuring the capacitance of the temperature sensitive capacitor (21C).

A processing system includes sensor circuitry and processing circuitry. The sensor circuitry is configured to be coupled to force sensor electrodes, and is configured to drive the force sensor electrodes to obtain capacitive measurements. The processing circuitry is operatively connected to the sensor circuitry and configured to aggregate the capacitive measurements into an aggregated measurement, and apply, to the aggregated measurement, a capacitive measurement to temperature mapping to obtain a current temperature of the force sensor electrodes.

A processing system includes sensor circuitry and processing circuitry. The sensor circuitry is configured to be coupled to force sensor electrodes, and is configured to drive the force sensor electrodes to obtain capacitive measurements. The processing circuitry is operatively connected to the sensor circuitry and configured to aggregate the capacitive measurements into an aggregated measurement, and apply, to the aggregated measurement, a capacitive measurement to temperature mapping to obtain a current temperature of the force sensor electrodes.

The present invention concerns an elongated capacitive sensor for fluid monitoring. The sensor comprising: a fibre support made of a dielectric material or dielectric composite material; and a first electrode and a second electrode arranged longitudinally along the fibre support, the first and second electrodes forming together with the fibre support a capacitive sensing element whose capacitance is dependent upon one or more electrical properties of one or more materials inside the support and/or outside the support, and/or is dependent upon a change of materials configuration and associated overall change of one or more electrical properties inside the support and/or outside the support.

The present invention concerns an elongated capacitive sensor for fluid monitoring. The sensor comprising: a fibre support made of a dielectric material or dielectric composite material; and a first electrode and a second electrode arranged longitudinally along the fibre support, the first and second electrodes forming together with the fibre support a capacitive sensing element whose capacitance is dependent upon one or more electrical properties of one or more materials inside the support and/or outside the support, and/or is dependent upon a change of materials configuration and associated overall change of one or more electrical properties inside the support and/or outside the support.

The invention relates to a surface element (1), intended for use as a floor, wall and/or ceiling surface element for a floor, wall and/or ceiling covering, having at least one carrier plate (2) and at least one functional layer (3), wherein the carrier plate (2) comprises a top side (5) facing a usable side (4) and an underside (7) opposite the top side (5) and facing the underground (6). According to the invention, it is provided that the functional layer (3) is provided underneath the carrier plate (2), and that the functional layer (3) is designed in such a way that, in the installed state, it projects beyond the side edge (10) of the side (8), in particular of the long side (9), on at least one side (8), especially on at least one long side (9).