Disclosed is a method for determining a rotor temperature value T.sub.Rot for an electric machine, such as an electric motor. In one example, the method includes calculating a support value P.sub.cu2_Trot using a rotor temperature value T.sub.rot that is determined with a temperature model and a motor current value I.sub.sdq. An auxiliary value P.sub.cu2_Ref can be determined using a motor torque T.sub.rq and a motor slip value ω.sub.slip. The support value P.sub.cu2_Trot can be linked with the auxiliary value P.sub.cu2_Ref in order to obtain a corrected rotor temperature value Delta.sub.Trot. Furthermore, the temperature model can be modified using the corrected rotor temperature value Delta.sub.Trot in order to obtain a corrected temperature model. Finally, the rotor temperature value T.sub.Rot can be determined using the corrected temperature model.

Techniques and circuitry, in one embodiment, determine a temperature of a battery by applying a calibration packet to the battery's terminals and at the battery's first SOC, wherein the calibration packet includes a first pulse (charge or discharge) which temporally precedes a rest period. In one embodiment, measurement circuitry measures a first terminal voltage at a time immediately prior to or at a beginning of the first pulse of the calibration packet, and a second terminal voltage, in response to the calibration packet, at a time during the partial relaxation time period of a battery. Control circuitry determines a partial relaxation time voltage (V.sub.PRT) at the battery's first SOC using the first and second terminal voltages and determines a temperature of the battery by correlating the V.sub.PRT at the first SOC to a temperature of the battery at the battery's current SOH.

A temperature-determining device for determining a temperature (TMED) of a medium via a temperature of a surface includes: an ambient-temperature sensor, arranged in surroundings of the surface, for measuring an ambient temperature (TU); a surface-temperature sensor, lying on the surface, for measuring a mixed temperature (TM) lying between the temperature (TMED) of a medium and the ambient temperature (TU); and an arithmetic-logic unit having an approximation formula electronically stored thereon for calculating an approximation (TMEDN) of a temperature of a medium. The approximation formula is a sum of the mixed temperature (TM) and a product of two factors. The first factor results from a difference between the mixed temperature (TM) and the ambient temperature (TU) and the second factor results from a ratio of a dividend to a quotient. The dividend results from a difference between a calibration temperature (TMEDKAL) of a medium and a calibration mixed temperature (TMKAL).

An apparatus, system and method for temperature measurement of a target site, such a human body site. The invention includes an intelligent temperature probe configured to physically contact a target site and to communicate with a host device, which can be implemented as a hand-held device or as a personal computer. The host device can compute, store and display an accurate predicted temperature, or an actual temperature at thermal equilibrium, of the target site for each of a plurality of different intelligent temperature probes that each have unique and varied operating characteristics. A set of unique operating characteristics for each temperature probe is represented by information communicated between each respective temperature probe and the host device.

An apparatus, system and method for temperature measurement of a target site, such a human body site. The invention includes an intelligent temperature probe configured to physically contact a target site and to communicate with a host device, which can be implemented as a hand-held device or as a personal computer. The host device can compute, store and display an accurate predicted temperature, or an actual temperature at thermal equilibrium, of the target site for each of a plurality of different intelligent temperature probes that each have unique and varied operating characteristics. A set of unique operating characteristics for each temperature probe is represented by information communicated between each respective temperature probe and the host device.

A method for determining the ambient temperature of an electronic device, the device comprising heat-generating components (102) and a temperature sensor (105) positioned within a common casing (101), the method comprising the steps of: in an environment with a controlled ambient temperature: determining (307) a device-specific coefficient of power dissipation change (a) between a first (E.sub.min) and second (E.sub.max) power modes, wherein in the second power mode (E.sub.max) the device dissipates more power than in the first power mode (E.sub.min); and in an environment for which the ambient temperature is to be determined: measuring (203-205) temperatures (T.sub.min, T.sub.max) by the temperature sensor (105) for the first power mode (E.sub.min) and the second power mode (E.sub.max), calculating (206) ambient temperature (T.sub.amb) as a function of the measured temperatures (T.sub.min, T.sub.max) and the device-specific coefficient of power dissipation change (a).

A method for determining the ambient temperature of an electronic device, the device comprising heat-generating components (102) and a temperature sensor (105) positioned within a common casing (101), the method comprising the steps of: in an environment with a controlled ambient temperature: determining (307) a device-specific coefficient of power dissipation change (a) between a first (E.sub.min) and second (E.sub.max) power modes, wherein in the second power mode (E.sub.max) the device dissipates more power than in the first power mode (E.sub.min); and in an environment for which the ambient temperature is to be determined: measuring (203-205) temperatures (T.sub.min, T.sub.max) by the temperature sensor (105) for the first power mode (E.sub.min) and the second power mode (E.sub.max), calculating (206) ambient temperature (T.sub.amb) as a function of the measured temperatures (T.sub.min, T.sub.max) and the device-specific coefficient of power dissipation change (a).

A sensor failure detection device includes a storage, a predictor, a calculator and a detector. The storage stores temperature information of individual sensors. The temperature information includes measured values of temperatures. The measured values of temperatures are measured by a plurality of sensors. The predictor predicts a temperature distribution by performing a thermal fluid simulation, on the basis of the temperature information received from a remaining sensor. The remaining sensor is a sensor of the plurality of sensors other than the test target sensor. The calculator calculates a difference value between a temperature at a position of the test target sensor in the temperature distribution and a temperature measured by the test target sensor. The detector detects that the difference value is higher than a predetermined value.

A method including obtaining calibration data for at least one sub-component in a heat transfer assembly, wherein the calibration data comprises at least one indication of coolant flow rate through the sub-component for a given surface temperature delta of the sub-component and a given heat load into said sub-component, determining a measured heat load into the sub-component, determining a measured surface temperature delta of the sub-component, and determining a coolant flow distribution in a first flow path comprising the sub-component from the calibration data according to the measured heat load and the measured surface temperature delta of the sub-component.

A switching amplifier includes a power device and a processing device. The power device is configured for powering a load and is comprised of a plurality of switches. The processing device configured to calculate a switch junction temperature for a bonding wire in each switch based at least in part on a power loss of each switch; generate a first accumulated fatigue damage of the bonding wire in each switch based on the switch junction temperature; and generate an estimated remaining lifetime of the switching amplifier based on the first accumulated fatigue damages of the bonding wires in each switch.