A system for determining a temperature of an object includes a three-dimensional (3D) printer configured to successively deposit a first layer of material, a second layer of material, and a third layer of material to form the object. The 3D printer is configured to form a recess in the second layer of material. The material is a metal. The system also includes a temperature sensor configured to be positioned at least partially with the recess and to have the third layer deposited thereon. The temperature sensor is configured to measure a temperature of the first layer of material, the second layer of material, the third layer of material, or a combination thereof.

A system for determining a temperature of an object includes a three-dimensional (3D) printer configured to successively deposit a first layer of material, a second layer of material, and a third layer of material to form the object. The 3D printer is configured to form a recess in the second layer of material. The material is a metal. The system also includes a temperature sensor configured to be positioned at least partially with the recess and to have the third layer deposited thereon. The temperature sensor is configured to measure a temperature of the first layer of material, the second layer of material, the third layer of material, or a combination thereof.

A method for determining a temperature of an object includes contacting the object with a first electrical conductor. A difference in electronegativity between the object and the first electrical conductor is greater than a predetermined value. The method also includes contacting the object or a substrate on which the object is positioned with a second electrical conductor. A difference in electronegativity between the object or the substrate and the second electrical conductor is less than the predetermined value. The method also includes connecting the first and second electrical conductors together. The method also includes measuring the temperature of the object using the first and second electrical conductors. The first and second electrical conductors form at least a portion of a thermocouple.

An object printed by a three-dimensional (3D) printer includes a plurality of layers of material printed by the 3D printer. The layers of material bond together to form the object as the layers of material cool and solidify after being printed by the 3D printer. The object also includes a temperature sensor placed in contact with one or more of the layers when the layers of material are being printed by the 3D printer. The temperature sensor remains in contact with the object after the layers of material cool and solidify to form the object. The temperature sensor is configured to measure a temperature of the object after the layers of material cool and solidify to form the object.

A detection and alerting system for precursors to spoilage in haystacks caused by aerobic microbe activity. The system includes a plurality of temperature probes, measuring the temperature of the haystacks, at least one local communication system, communicating with the temperature probes about the temperatures of the haystacks. The system further includes an internet connected base communication module communicating with each of the local communication module, providing the temperature information of the haystacks; and alerting if the temperature information includes a first temperature indication such as a rapid increase in temperature.

A detection and alerting system for precursors to spoilage in haystacks caused by aerobic microbe activity. The system includes a plurality of temperature probes, measuring the temperature of the haystacks, at least one local communication system, communicating with the temperature probes about the temperatures of the haystacks. The system further includes an internet connected base communication module communicating with each of the local communication module, providing the temperature information of the haystacks; and alerting if the temperature information includes a first temperature indication such as a rapid increase in temperature.

A temperature sensing device for a hot stamping die apparatus includes: a processor, wherein when a second die moves toward a first die to press a workpiece, a pushing signal is transmitted to the processor; at least one temperature sensing unit is disposed in the first die and includes: a moving rod, a buffer, and a temperature sensor; a displacement regulator; and a controller, whereby when the processor receives the pushing signal, the processor controls the displacement regulator through the controller, so that the moving rod drives the buffer and the temperature sensor to move a predetermined distance, and further the temperature sensor moves toward the workpiece to touch the workpiece and sense a temperature of the workpiece.

A temperature sensing device for a hot stamping die apparatus includes: a processor, wherein when a second die moves toward a first die to press a workpiece, a pushing signal is transmitted to the processor; at least one temperature sensing unit is disposed in the first die and includes: a moving rod, a buffer, and a temperature sensor; a displacement regulator; and a controller, whereby when the processor receives the pushing signal, the processor controls the displacement regulator through the controller, so that the moving rod drives the buffer and the temperature sensor to move a predetermined distance, and further the temperature sensor moves toward the workpiece to touch the workpiece and sense a temperature of the workpiece.

A method including steps of (1) heating, with a heating system, an apparatus comprising an enclosure assembly and a temperature emulation assembly positioned within said enclosure assembly; (2) thermally isolating said temperature emulation assembly from said heating system with said enclosure assembly; (3) permitting conductive heat transfer to said temperature emulation assembly only through an enclosure assembly-leading end of said enclosure assembly; and (4) representing a hottest temperature and a coldest temperature of an article being emulated by said apparatus with said temperature emulation assembly.

A method including steps of (1) heating, with a heating system, an apparatus comprising an enclosure assembly and a temperature emulation assembly positioned within said enclosure assembly; (2) thermally isolating said temperature emulation assembly from said heating system with said enclosure assembly; (3) permitting conductive heat transfer to said temperature emulation assembly only through an enclosure assembly-leading end of said enclosure assembly; and (4) representing a hottest temperature and a coldest temperature of an article being emulated by said apparatus with said temperature emulation assembly.