Provided are a sampling probe and a sampling probe automatic separation device, and a use method thereof. The sampling probe comprises a probe tail area (1) and a probe sampling area (2) connected to the top of the probe tail area (1). The probe sampling area (2) comprises a two-piece mold housing component (3) and a sample (4) disposed inside the two-piece mold housing component (3). The two-piece mold housing component (3) is wound and fixed by means of an adhesive tape capable of burning and melting. The automatic separation device comprises a cutting device (5) for cutting a sampling probe, and an inclined bottom plate. The front end of the inclined bottom plate is placed close to the cutting device (5). The inclined bottom plate gradually inclines downwards from the front end to the rear end. A first posture adjustment device (9), a first separation device (10), a second posture adjustment device (11), and a second separation device (12) are sequentially arranged between the front end and the rear end of the inclined bottom plate. Not only the problem that it is difficult to separate the sample from a housing can be effectively solved, but also the situation that an actuation mechanism is stuck with each component is avoided by constraint on the posture of each component.

A thermal simulator simulates the thermal behavior of items such as eggs for which the actual internal temperature profile is difficult to measure. A yolk body simulates the egg yolk, an albumen body surrounds the yolk body and simulates the egg albumen, and a shell layer surrounds the albumen body to simulate the shell. The thermal properties of the materials forming the egg body, albumen body and shell layer are tuned to match the thermal properties of the egg yolk, egg albumen and egg shell. Thermometric devices are positioned within the egg body and egg albumen along with communication devices which process signals from the thermometric devices indicative of temperature and communicate these signals to a computer for further processing and display.

A thermal simulator simulates the thermal behavior of items such as eggs for which the actual internal temperature profile is difficult to measure. A yolk body simulates the egg yolk, an albumen body surrounds the yolk body and simulates the egg albumen, and a shell layer surrounds the albumen body to simulate the shell. The thermal properties of the materials forming the egg body, albumen body and shell layer are tuned to match the thermal properties of the egg yolk, egg albumen and egg shell. Thermometric devices are positioned within the egg body and egg albumen along with communication devices which process signals from the thermometric devices indicative of temperature and communicate these signals to a computer for further processing and display.

An immersion probe with a variable connection length is configured to compensate for longitudinal and/or radial length variations in an immersion sublance connected to the immersion probe. The immersion probe is characterized by an adjustable portion that changes length upon engagement with a coupling end of an immersion sublance. The immersion probe can have a sensor head. An immersion assembly of the immersion probe connected to an immersion sublance can be used to take measurements or samples of molten metal in a converter furnace.

An immersion probe with a variable connection length is configured to compensate for longitudinal and/or radial length variations in an immersion sublance connected to the immersion probe. The immersion probe is characterized by an adjustable portion that changes length upon engagement with a coupling end of an immersion sublance. The immersion probe can have a sensor head. An immersion assembly of the immersion probe connected to an immersion sublance can be used to take measurements or samples of molten metal in a converter furnace.

Implementations described herein generally relate to semiconductor manufacturing, and more specifically to a temperature measurement device. In one implementation, the temperature measurement device includes a substrate and a stack of metal layers coupled to the substrate. Each metal layer of the stack of metal layers extends continuously uninterrupted from edge to edge of the substrate. The first metal layer has a lower electrical resistivity than the second metal layers. The electrical resistivity of the stack is based on the electrical resistivity of the first metal layer, which is temperature dependent. Utilizing a known relationship between temperature measurements and resistivity measurements, the temperature measurement device can measure and store temperature information in various substrate processing processes.

The present disclosure describes methods and apparatus for remote sensing with data analytics. The methods and apparatus have many applications including monitoring the quality of grain during storage and/or transport. The present disclosure describes a way to collect temperature and other environmental data to describe and predict quality of stored grains, current and future, based on a myriad factors including fumigation, external temperature and humidity, in storage grain temperature and humidity.

The present disclosure relates to a wireless probe for food, including a circuit board, a temperature sensor connected to electrical signals of the circuit board, a super capacitor and a wireless transmitter. The temperature sensor is used for measuring a temperature of the food. The super capacitor is used for supplying power to the circuit board. The wireless transmitter is used for broadcasting temperature signals measured by the temperature sensor in the form of wireless signals. The present disclosure also relates to a wireless food temperature real-time monitoring system, including the wireless probe for food, a mobile device and/or a wireless range extender for receiving the temperature signals transmitted from the wireless probe. A wireless food temperature real-time monitoring method is also disclosed. The present disclosure can monitor temperature of the food being cooked in real-time in order to better assist users in cooking.

The present disclosure relates to a wireless probe for food, including a circuit board, a temperature sensor connected to electrical signals of the circuit board, a super capacitor and a wireless transmitter. The temperature sensor is used for measuring a temperature of the food. The super capacitor is used for supplying power to the circuit board. The wireless transmitter is used for broadcasting temperature signals measured by the temperature sensor in the form of wireless signals. The present disclosure also relates to a wireless food temperature real-time monitoring system, including the wireless probe for food, a mobile device and/or a wireless range extender for receiving the temperature signals transmitted from the wireless probe. A wireless food temperature real-time monitoring method is also disclosed. The present disclosure can monitor temperature of the food being cooked in real-time in order to better assist users in cooking.

A specimen container configured for cryogenic processing of a specimen includes an elongate member, a first specimen processing medium contained within a lumen of the elongate member at a first position, a second specimen processing medium contained within the lumen of the elongate member at a second position located distal to the first position, and a barrier positioned between the first and second specimen processing mediums such that the first and second specimen processing mediums are spaced apart from each other within the lumen of the elongate member.