A sensor placement optimization device is provided, which may include a preprocessing circuit and an operational circuit. The preprocessing circuit may perform a pre-process for the sensing signals of a plurality of temperature sensors, installed on a machine tool, to generate a pre-processed data. The operational circuit may execute a normalization for the pre-processed data to generate a normalized data, perform a principal component analysis for the normalized data to generate a dimensionality-reduced data and implement a principal component regression for the dimensionality-reduced data to obtain the contributions of the temperature sensors. Then, the operational circuit may rank the temperature sensors according to the contributions thereof to generate a ranking result and execute a screening process according to the ranking result to select at least one redundant sensor from the temperature sensors; afterward, the operational circuit may remove the redundant sensor from the temperature sensors.

A flow guiding and heat dissipating type dry block temperature calibrator, which belongs to the temperature calibration field. The temperature calibrator includes a furnace body located in a housing and at least one air flow generating device. The air flow generating device is on one side or at the periphery of the furnace body, and is one or a combination of a gas passage, a flow guiding fan, an air pump and a blower. The air flow generated by the air flow generating device is blown toward a handle of a device being tested that is inserted in the furnace body, such that the handle is cooled, thereby preventing the sensor inside the handle from failing due to high temperature, facilitating the heat dissipation of the internal electronic components of the instrument itself, and extending the service life of the temperature calibrator.

The present invention discloses a method for regulating temperature in a temperature calibrator, taking into account also a velocity of the change of the temperature. The characterizing features are the steps of calculating a rate of change of the actual temperature of the temperature calibrator by a derivator, which derivator takes the measured temperature, PV.sub.T, by the temperature sensor as its input, and letting a user to specify a maximum rate of change for the temperature, as an input value for the processor; and regulating the temperature of the temperature calibrator by the processor so that the maximum rate of change for the temperature is never exceeded, and so that during temperature regulation, when the temperature error signal decreases as a function of time, also the rate of change of the actual temperature is set to decrease as a function of time.

The present invention discloses a method for regulating temperature in a temperature calibrator, taking into account also a velocity of the change of the temperature. The characterizing features are the steps of calculating a rate of change of the actual temperature of the temperature calibrator by a derivator, which derivator takes the measured temperature, PV.sub.T, by the temperature sensor as its input, and letting a user to specify a maximum rate of change for the temperature, as an input value for the processor; and regulating the temperature of the temperature calibrator by the processor so that the maximum rate of change for the temperature is never exceeded, and so that during temperature regulation, when the temperature error signal decreases as a function of time, also the rate of change of the actual temperature is set to decrease as a function of time.

A sensor placement optimization device is provided, which may include a preprocessing circuit and an operational circuit. The preprocessing circuit may perform a pre-process for the sensing signals of a plurality of temperature sensors, installed on a machine tool, to generate a pre-processed data. The operational circuit may execute a normalization for the pre-processed data to generate a normalized data, perform a principal component analysis for the normalized data to generate a dimensionality-reduced data and implement a principal component regression for the dimensionality-reduced data to obtain the contributions of the temperature sensors. Then, the operational circuit may rank the temperature sensors according to the contributions thereof to generate a ranking result and execute a screening process according to the ranking result to select at least one redundant sensor from the temperature sensors; afterward, the operational circuit may remove the redundant sensor from the temperature sensors.

A calibration device for precise calibration of a microwave radiometer is described. The calibration device has a housing that partially encompasses a calibration chamber. The housing includes a microwave transparent portion that is provided at a wall of the housing. The microwave transparent portion defines an entry for microwaves into the calibration chamber. The microwave transparent portion is made by a microwave transparent material that is insulating. An absorber at a defined temperature is provided within the calibration chamber. An interface between the microwave transparent portion and the absorber is provided, which ensures a substantially reflection free entry of the microwaves into the calibration chamber. The substantially reflection free entry of the microwaves corresponds to capturing at least 3 orders of reflection of the microwaves. Further, a method of calibrating a microwave radiometer is described.

Methods for measuring a temperature of a wafer chuck and calibrating temperature and a temperature measuring system are provided. The measuring method includes: placing a test wafer on a wafer chuck, where a plurality of semiconductor devices having electrical parameters varying as a function of temperature are formed on the test wafer; making the temperature of the wafer chuck reach set temperatures; measuring the semiconductor devices respectively to obtain electrical parameters corresponding to the semiconductor devices; obtaining actual temperatures of the semiconductor devices according to the electrical parameters and variations, of the electrical parameters, as the function of temperature; and obtaining an actual temperature distribution of the wafer chuck according to the actual temperatures of the semiconductor devices.

The present invention discloses a method for regulating temperature in a temperature calibrator, taking into account also a velocity of the change of the temperature. The characterizing features are the steps of calculating a rate of change of the actual temperature of the temperature calibrator by a derivator, which derivator takes the measured temperature, PV.sub.T, by the temperature sensor as its input, and letting a user to specify a maximum rate of change for the temperature, as an input value for the processor; and regulating the temperature of the temperature calibrator by the processor so that the maximum rate of change for the temperature is never exceeded, and so that during temperature regulation, when the temperature error signal decreases as a function of time, also the rate of change of the actual temperature is set to decrease as a function of time.

The present invention discloses a temperature calibrator, which comprises or has an externally attached inclination angle sensing means. A temperature sensor and an internal battery is applied as well, together with a fan. The temperature calibrator comprises regular heating elements, a processor, and a User Interface. The system measures the inclination angle and internal temperature of the temperature calibrator. If the angle or temperature value or both exceed a certain threshold value, the system is configured to switch off the heating elements immediately, and to show or send a warning indicator or signal to the user or manager of the device via the UI 22, e.g. through a red LED light, a beeping sound or a warning message on the screen of the temperature calibrator or of the remote device.

A temperature monitoring system for accurate and real-time temperature monitoring may be employed at a conduit and/or a temperature control element. The conduit is configured to transport a fluid along the length of the conduit, and the conduit may comprise a variety of conduit structures having numerous cross-sections, shapes, orientation, geometry, operating conditions, operation functions, etc. The temperature control element operatively coupled to the conduit may be utilized to control the temperature of the fluid within the conduit. Typically, the temperature control element is configured to heat or cool the fluid within the conduit. The temperature monitoring system may further comprise one or more temperature sensors, such as distributed temperature sensor(s) or discrete temperature sensor(s), operatively coupled to the conduit and/or the temperature control element. The temperature sensor(s) are configured to capture temperature readings at one or more locations along the length of the conduit or the temperature control element.