The present disclosure includes a sensor element for registering temperature of an object, which includes: a substrate, wherein the substrate includes a platform face, which defines a first plane; a temperature detector, which is applied on a first temperature plane on the substrate and which is embodied to register the temperature of the object, wherein the first temperature plane lies in the first plane or essentially in parallel with the first plane; at least one sensor applied on a first subregion of the substrate for determining a temperature difference within the first subregion; and a passivation, which is applied on the substrate and which covers the substrate, the temperature detector and the sensor for determining the temperature difference, as well as residing in a method for assessing measurement quality of a sensor element of the present disclosure.

A temperature sensor malfunction diagnosis apparatus is provided in a vehicle that includes a device, a refrigerant circuit, an electric pump, a battery, and a temperature sensor, and configured to diagnose malfunction of the temperature sensor. The temperature sensor malfunction diagnosis apparatus includes a pump driver and a malfunction diagnosis unit. The pump driver is configured to drive the electric pump after stopping of driving of the vehicle, on the basis of the battery as a power supply. The malfunction diagnosis unit is configured to perform a malfunction diagnosis of the temperature sensor, on a condition that a charged time reaches a temperature converging time of the temperature sensor while the electric pump is driven. The charged time is a time during which charging of the battery is performed from start of the charging of the battery.

The present disclosure includes an HVAC system that includes a plurality of dampers each corresponding to one building zone of a plurality of building zones, a plurality of sensors each corresponding to the one of the plurality of building zones, and a control board communicatively coupled with the plurality of dampers and sensors. The control board includes a plurality of status light sources, each corresponding to one damper the plurality of dampers, a plurality of communication light sources each corresponding to one sensor of the plurality of sensors, and a microcontroller programmed to control operation of equipment in the HVAC system. The microcontroller is configured to perform “a hardware test mode” to facilitate diagnosis of the plurality of dampers by causing the plurality of status light sources to sequentially execute a first light scheme or a second light scheme in response to instructions to the plurality of dampers.

A semiconductor device includes a first temperature sensor module, a second temperature sensor module, a first temperature controller, and a second temperature controller. The first temperature sensor module includes a bandgap reference circuit that outputs a plurality of divided voltages, and a first conversion circuit that performs analog-to-digital conversion processing on one of the plurality of divided voltages to generate a first digital value. The second temperature sensor module includes a second conversion circuit that performs analog-to-digital conversion processing on the one of the plurality of divided voltages to generate a second digital value. The first temperature sensor controller converts the first digital value to a first temperature. The second temperature sensor controller converts the second digital value to a second temperature. The semiconductor device determines whether the first and second temperature modules operate normally based on a difference between the first temperature and the second temperature.

An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

The present disclosure is of an atmospheric characterization system that has a central processing board that has a first and a second communication interface. Further, the atmospheric characterization system further has a first precision temperature sensor that is communicatively coupled to the central processing board via the first communication interface and positioned a distance from a first side of the processing board, wherein the precision temperature measures a first temperature and transfers data indicative of the first temperature to the central processing board. In addition, the atmospheric characterization system has a second precision temperature sensor that is communicatively coupled to the central processing board via the second communication interface and positioned the distance from a second opposing side of the processing board such that the first precision temperature sensor and the second precision temperature sensor are equidistance from the processing board and a distance between the first precision sensor and the second precision sensor is a predetermined distance, r, and the second precision temperature sensor measures a second temperature and transfers data indicative of the second temperature to the central processing board simultaneously with the transferring of the first temperature. Additionally, the atmospheric characterization system has a processor that receives the first temperature and the second temperature and calculates a value indicative of atmospheric turbulence based upon the first temperature and the second temperature, wherein the value indicative of the atmospheric turbulence is used for designing, modifying, calibrating, or correcting an optical system.

The present disclosure is of an atmospheric characterization system that has a central processing board that has a first and a second communication interface. Further, the atmospheric characterization system further has a first precision temperature sensor that is communicatively coupled to the central processing board via the first communication interface and positioned a distance from a first side of the processing board, wherein the precision temperature measures a first temperature and transfers data indicative of the first temperature to the central processing board. In addition, the atmospheric characterization system has a second precision temperature sensor that is communicatively coupled to the central processing board via the second communication interface and positioned the distance from a second opposing side of the processing board such that the first precision temperature sensor and the second precision temperature sensor are equidistance from the processing board and a distance between the first precision sensor and the second precision sensor is a predetermined distance, r, and the second precision temperature sensor measures a second temperature and transfers data indicative of the second temperature to the central processing board simultaneously with the transferring of the first temperature. Additionally, the atmospheric characterization system has a processor that receives the first temperature and the second temperature and calculates a value indicative of atmospheric turbulence based upon the first temperature and the second temperature, wherein the value indicative of the atmospheric turbulence is used for designing, modifying, calibrating, or correcting an optical system.

A diode voltage from a diode circuit can be combined with a proportional to absolute temperature (PTAT) voltage generated by a PTAT circuit to determine a temperature sensor voltage. This temperature sensor voltage may correspond to a temperature of a circuit or a localized temperature. By determining the temperature sensor voltage using a combination of a PTAT voltage and diode voltage, it is possible to remove or a PTAT circuit used to generate a bandgap voltage, which may shrink the temperature sensor and increase the accuracy of the temperature sensor circuit.

A signal processing method of a wireless temperature measurement system comprises: acquiring inherent background noise intensity of a receiver (11) of a reader (10) and maximum output signal intensity of the receiver (S101); acquiring current noise intensity on a receiving channel of the receiver (11) in real time when an antenna (14) is connected to the reader (10) and an excitation signal is not transmitted to a temperature sensor (20) (S102); and determining an intensity threshold value of a temperature signal currently measured by the temperature sensor (20) according to the background noise intensity, the maximum output signal intensity and the current noise intensity (S103).

There is described a method of detecting failure in an array of thermocouples connected in parallel. The method comprising: during an operation mode of the array of thermocouples, measuring a voltage V across the array of thermocouples, the voltage V associated with a temperature T; during a failure detection mode of the array of thermocouples, shunting the array of thermocouples, and measuring a shunt voltage Vs occurring across a resistive element connected in series with the array of thermocouples; comparing the shunt voltage Vs to an expected shunt voltage Vs_exp for the array of thermocouples at the temperature T; and generating a failure signal indicative of a detected failure in the array of thermocouples when the shunt voltage Vs deviates from the expected shunt voltage Vs_exp by more than a deviation threshold.