Techniques for providing a tamper mechanism for semiconductor devices are disclosed herein. The techniques include, for example, providing at least one die and at least one strain gauge, orienting the at least one strain gauge to the die, forming an encapsulated semiconductor device by encapsulating the die and each strain gauge within a mold compound to maintain respective orientation, and measuring an initial strain value for the at least one strain gauge after forming the encapsulated semiconductor device.

Various braking devices, systems, and methods are disclosed. In some embodiments, the braking device includes a support element, a block of friction material supported by the support element, at least one piezoceramic sensor supported by the support element and interposed between the block of friction material (and the support element, and a protective element located at the piezoceramic sensor and embedding the latter. The protective element can have one or more layers of resin-based material applied to protect the piezoceramic sensor and direct a predetermined part of the external compression force onto an area of the support element surrounding the piezoceramic sensor. In some embodiments, a signal transduction device is provided and includes at least one piezoceramic sensor supported on a support element and has an integral protective coating having properties of mechanical and temperature resistance.

A device that includes a piece of armor made from a material that has a domain of plastic deformation under bad before breaking and an elastic deformation domain. The plastic deformation domain represents less than 1% of the elastic deformation domain. The device includes a deformation sensor fixed to the piece of armor and configured to deform plastically under the effect of at least a stress applied to the piece of armor and leading to damage of the piece of armor.

A device that includes a piece of armor made from a material that has a domain of plastic deformation under bad before breaking and an elastic deformation domain. The plastic deformation domain represents less than 1% of the elastic deformation domain. The device includes a deformation sensor fixed to the piece of armor and configured to deform plastically under the effect of at least a stress applied to the piece of armor and leading to damage of the piece of armor.

Sensors and sensor systems incorporating piezoresistive materials for integration with footwear are described.

An apparatus includes a sensor assembly. The sensor assembly includes a transmission-line assembly having an electrical transmission-line parameter configured to change, at least in part, in response to reception, at least in part, of a vehicular load of a moving vehicle moving relative to a vehicular roadway to the transmission-line assembly positionable, at least in part, relative to the vehicular roadway.

An apparatus includes a sensor assembly. The sensor assembly includes a transmission-line assembly having an electrical transmission-line parameter configured to change, at least in part, in response to reception, at least in part, of a vehicular load of a moving vehicle moving relative to a vehicular roadway to the transmission-line assembly positionable, at least in part, relative to the vehicular roadway.

Sensors and sensor systems incorporating piezoresistive materials for integration with footwear are described.

The present subject matter discloses a method of measuring a peak load, including the steps of placing an indenter between a first surface and a second surface, exerting a load on at least one of the first and second surfaces, measuring at least one of a width, depth, radial chord length, and cross-sectional area of an indentation formed by the indenter in at least one of the first and second surfaces; and converting the measured parameter into a load value. Certain methods further include the steps of converting the measured parameter into a load per length value and obtaining a load value by integrating along a circumferential length of the indentation. In still other methods, the exerted load is a compressive load.

The present subject matter discloses a method of measuring a peak load, including the steps of placing an indenter between a first surface and a second surface, exerting a load on at least one of the first and second surfaces, measuring at least one of a width, depth, radial chord length, and cross-sectional area of an indentation formed by the indenter in at least one of the first and second surfaces; and converting the measured parameter into a load value. Certain methods further include the steps of converting the measured parameter into a load per length value and obtaining a load value by integrating along a circumferential length of the indentation. In still other methods, the exerted load is a compressive load.