Patent classifications
G01L1/25
LIGHT-BASED TACTILE SENSING WITH DIRECTIONAL SENSITIVITY
A device includes a substrate and a set of force sensors supported by the substrate. Each force sensor includes a pillar extending outward from the substrate, each pillar comprising a stack of semiconductor layers, the stack of semiconductor layers being configured to emit light upon biasing of the stack of semiconductor layers, and post disposed along only a portion of a perimeter of the pillar such that, taken together, the pillar and the post have an asymmetrical cross-sectional shape. Each pillar has a cross-section elongated along an axis. An orientation of the axis, and a peripheral position of the portion of the perimeter at which the post is disposed, differ across the set of force sensors such that a variation in light emitted by the stack of semiconductor layers of one or more of the force sensors is indicative of a direction of a shear force applied to the set of force sensors.
Situ monitoring of stress for additively manufactured components
A material deposition process including in situ sensor analysis of a component in a formation state is provided. The material deposition process is implemented in part by a sensor device of an additive manufacturing machine producing the component. The material deposition process includes sensing, by the sensing device, in situ physical properties of an area of interest of the component during a three-dimensional object production. Compliance to specifications or defects are then detected in the in situ physical properties with respect to pre-specified material requirements. The defects are analyzed to determine corrective actions, and an updated three-dimensional object production, which includes the corrective actions, is implemented to complete the component.
Situ monitoring of stress for additively manufactured components
A material deposition process including in situ sensor analysis of a component in a formation state is provided. The material deposition process is implemented in part by a sensor device of an additive manufacturing machine producing the component. The material deposition process includes sensing, by the sensing device, in situ physical properties of an area of interest of the component during a three-dimensional object production. Compliance to specifications or defects are then detected in the in situ physical properties with respect to pre-specified material requirements. The defects are analyzed to determine corrective actions, and an updated three-dimensional object production, which includes the corrective actions, is implemented to complete the component.
Methods of non-destructive residual stress measurement using barkhausen noise and use of such methods
A method for determining residual stress in a selectively hardened parts including an unhardened region adjacent to a hardened region is provided. The method includes obtaining a Barkhausen Noise (BN) value for the unhardened region and selecting a corresponding absolute residual stress value from a correlation between BN values and absolute residual stress values. The selected absolute residual stress value accurately estimates the absolute residual stress in the hardened region of the selectively hardened part. In variations of the method the unhardened region is surrounded by the hardened region, the hardened region is a laser hardened region and the unhardened region is not laser hardened.
Device and method for ultrasonic detecting of mechanical member based on magnetic fluid coupling
A device and a method for ultrasonic detecting a mechanical member based on magnetic fluid coupling. The device comprises a magnetic field generating apparatus, magnetic fluid and an ultrasonic probe. The magnetic field generating apparatus has a cylindrical structure, into which the magnetic fluid is injected, where an upper portion of the apparatus is provided with the ultrasonic probe a front end that vertically extends into a liquid level of the magnetic fluid, and a bottom portion of the apparatus covers a detected position of a member under detection. The magnetic fluid at least contains magnetic suspension particles and oil-based or water-based liquid. With the device and the method, the ultrasonic probe is coupled with the member under detection to realize ultrasonic detecting of the service stress of the member under detection.
DETERIORATION EVALUATION METHOD
A deterioration evaluation method includes a determination step of determining a shot peening condition for imparting a maximum residual stress to an object formed of a metal material; a first shot peening step of performing first shot peening on the object under the shot peening condition; a first measurement step of measuring a first residual stress of the object after the first shot peening step; a second shot peening step of performing second shot peening on the object after the first measurement step under the shot peening condition; a second measurement step of measuring a second residual stress of the object after the second shot peening step; and an evaluation step of evaluating deterioration of the object based on the first residual stress and the second residual stress.
DETERIORATION EVALUATION METHOD
A deterioration evaluation method includes a determination step of determining a shot peening condition for imparting a maximum residual stress to an object formed of a metal material; a first shot peening step of performing first shot peening on the object under the shot peening condition; a first measurement step of measuring a first residual stress of the object after the first shot peening step; a second shot peening step of performing second shot peening on the object after the first measurement step under the shot peening condition; a second measurement step of measuring a second residual stress of the object after the second shot peening step; and an evaluation step of evaluating deterioration of the object based on the first residual stress and the second residual stress.
Gear positioning device, stress measurement system, gear positioning method, and stress measurement method
A gear positioning device according to an embodiment includes: a chuck configured to hold a gear; a rotation drive mechanism configured to rotationally drive the chuck so that the gear rotates around a predetermined rotation axis; a displacement meter configured to continuously or periodically acquire a measurement value representing a distance between a reference point located outside the gear and an outer peripheral surface of the gear while rotating the gear; and a control device configured to set a part of the outer peripheral surface of the gear as a measurement object on the basis of a rotation angle of the gear, the measurement value, and at least one predetermined reference value and control the rotation drive mechanism so that the measurement object is disposed at a reference position.
Gear positioning device, stress measurement system, gear positioning method, and stress measurement method
A gear positioning device according to an embodiment includes: a chuck configured to hold a gear; a rotation drive mechanism configured to rotationally drive the chuck so that the gear rotates around a predetermined rotation axis; a displacement meter configured to continuously or periodically acquire a measurement value representing a distance between a reference point located outside the gear and an outer peripheral surface of the gear while rotating the gear; and a control device configured to set a part of the outer peripheral surface of the gear as a measurement object on the basis of a rotation angle of the gear, the measurement value, and at least one predetermined reference value and control the rotation drive mechanism so that the measurement object is disposed at a reference position.
Compound sensor
A compound sensor that is capable of being used with robotics is provided such that the compound sensor includes a distance measurement unit and a pressure measurement unit. Further, a contact detection unit, which is dedicated to performing a detection when a measurement target contacts with a surface of the sensor is included.