An integrated circuit is described herein that includes a semiconductor substrate. First and second piezoresistive sensors are on or in the substrate where each have a respective sensing axis extending in first and second directions respectively parallel with a surface of the substrate, where the second direction is perpendicular to the first direction. A third piezoresistive sensor is on or in the substrate and has a respective sensing axis extending in a third direction parallel with the surface of the substrate and neither parallel nor perpendicular to the first and second directions.

A measuring system and method that computes and analyzes sensor data fused with multiple mechanical and thermally induced strain measurements is provided. Further, the measuring system and method realizes physics-based relations between sensor readings due to mechanical and thermal sources by optimally de-coupling a total strain into its mechanical and thermal components. The measuring system and method also auto-tunes coefficients involved in the optimal de-coupling equations using sensor specification data and previous system test results for initialization.

A measuring system and method that computes and analyzes sensor data fused with multiple mechanical and thermally induced strain measurements is provided. Further, the measuring system and method realizes physics-based relations between sensor readings due to mechanical and thermal sources by optimally de-coupling a total strain into its mechanical and thermal components. The measuring system and method also auto-tunes coefficients involved in the optimal de-coupling equations using sensor specification data and previous system test results for initialization.

A piezoelectric transducer for measuring a force includes a base element; a pre-loading element; at least one effective main seismic mass aggregation of pre-loaded parts capable of producing the force when being accelerated; a main piezoelectric ceramic element including a first piezoelectric ceramic; at least one compensation seismic mass aggregation of pre-loaded parts capable of producing a compensation force when being accelerated; a compensation piezoelectric ceramic element including a second piezoelectric ceramic. The first piezoelectric ceramic has a thermal sensitivity shift smaller than the second piezoelectric ceramic. The main piezoelectric ceramic element is oriented with respect to the force to be measured and the compensation piezoelectric ceramic element is oriented with respect to the compensation force such that the main electric charge and the compensation electric charge are opposite in polarity.

A sensor system includes a sensor element, a signal processing circuit, and a pseudo-signal correction circuit. The sensor element outputs an electric signal corresponding to an external force. The signal processing circuit converts the electric signal coming from the sensor element into a signal having a certain signal format and then outputs the signal thus converted. The pseudo-signal correction circuit corrects a pseudo-signal outputted by the sensor element. When receiving a test signal, the sensor element performs a self-diagnosis based on the test signal and then outputs the pseudo-signal, which represents a result of the self-diagnosis. The pseudo-signal correction circuit corrects the pseudo-signal based on environment information about an environment where at least one of the sensor element or the signal processing circuit is located.

A sensor system includes a sensor element, a signal processing circuit, and a pseudo-signal correction circuit. The sensor element outputs an electric signal corresponding to an external force. The signal processing circuit converts the electric signal coming from the sensor element into a signal having a certain signal format and then outputs the signal thus converted. The pseudo-signal correction circuit corrects a pseudo-signal outputted by the sensor element. When receiving a test signal, the sensor element performs a self-diagnosis based on the test signal and then outputs the pseudo-signal, which represents a result of the self-diagnosis. The pseudo-signal correction circuit corrects the pseudo-signal based on environment information about an environment where at least one of the sensor element or the signal processing circuit is located.

A stress-detecting element includes a support body, a support film, a first piezoelectric element, first and second elastic parts. The support body has an opening part with first and second rectilinear sections extending parallel to each other. The support film blocks off the opening part. The first piezoelectric element straddles the first rectilinear section from an interior area to an exterior area of the opening part as seen in plan view. The first elastic part straddles the first rectilinear section from the interior area to the exterior area of the opening part. The second elastic part straddles the second rectilinear section from the interior area to the exterior area of the opening part. The first and second elastic parts respectively have first and second elastic end sections disposed in the interior area of the opening part and spaced apart from each other.

A stress-detecting element includes a support body, a support film, a first piezoelectric element, first and second elastic parts. The support body has an opening part with first and second rectilinear sections extending parallel to each other. The support film blocks off the opening part. The first piezoelectric element straddles the first rectilinear section from an interior area to an exterior area of the opening part as seen in plan view. The first elastic part straddles the first rectilinear section from the interior area to the exterior area of the opening part. The second elastic part straddles the second rectilinear section from the interior area to the exterior area of the opening part. The first and second elastic parts respectively have first and second elastic end sections disposed in the interior area of the opening part and spaced apart from each other.

A sensor pressing member to which a sensor is attached such that the sensor is exposed toward a measurement target. The sensor pressing member presses the sensor in a first direction relative to the measurement target to bring the sensor into contact with the measurement target. The sensor pressing member includes an elastic body positioned opposite the measurement target with the sensor in between in the first direction. The elastic body includes a cavity therein.

Aspects of the present disclosure relate to a piezoelectric device having at least one piezoelectric element, which has a support plane oriented to a force introduction element, wherein in the event of a thermal loading of the piezoelectric device in the support plane, expansion differences between the piezoelectric element and the force introduction element occur. To compensate for shear loadings, at least one transition element is arranged between the piezoelectric element and the force introduction element, the E-module of which is smaller than the E-module of the piezoelectric element in the support plane.