A semiconductor device includes a detector assembly mounted on a base substrate and including a detector to detect pressure, a resin package on the base substrate, and a tube supported by the resin package. The resin package includes a base portion on the base substrate and in which the detector assembly is embedded, and a projecting portion including an exposed hole that exposes the detector and projects from the base portion into the tube. The tube includes a tubular body portion and a lower flange portion supported by the base portion. The lower flange portion is inside an outer edge portion of the base portion in plan view. An outer side surface of the projecting portion is bonded to an inner circumferential surface of the tube.

A device includes a housing unit with an internal volume. The device further includes a sensor coupled to a substrate via an electrical coupling, wherein the sensor is disposed within the internal volume of the housing unit, and wherein the sensor is in communication with an external environment of the housing unit from a side other than a side associated with the substrate. The device also includes a moisture detection unit electrically coupled to the sensor, wherein the moisture detection unit comprises at least two looped wires at different heights, and wherein the moisture detection unit is configured to detect presence of a moisture within an interior environment of the housing unit when the moisture detection unit becomes in direct contact with the moisture.

A pressure sensor includes a cylindrical member configured to be attached to a body having a fluid passage, and a pressure sensor unit connected to the cylindrical member for detecting a pressure of a fluid flowing through the fluid passage, wherein the cylindrical member is made of a nickel-molybdenum-chromium alloy material or a stainless steel material, wherein the pressure sensor unit includes a sensor body closed at one end with a diaphragm and a pressure detecting element for outputting displacement of the diaphragm as pressure, and wherein the sensor body is made of a cobalt-nickel alloy material, and is connected at an opening side end portion to one end portion of the cylindrical member.

A semiconductor device includes a detector mounted on a base substrate and including a pressure detector to detect pressure, a base portion on the base substrate where the detector is buried, a protruding portion protruding upward from the base portion and including an exposure hole which causes the pressure detector to be exposed upward, and a lid supported by an upper surface of the protruding portion to close the exposure hole. An outer circumferential portion of the lid extends outward from the protruding portion in plan view. The lid includes a slit that is open to an outer side surface and causes the exposure hole to communicate with outside sideward of the semiconductor device.

A process transmitter includes an isolation unit, a process sensor, a compensation circuit, and an output circuit. The isolation unit is configured to engage a process and includes a medium. The process sensor is configured to produce a process signal that is a function of a parameter of the process that is communicated through the medium. The compensation circuit is configured to compensate the process signal for a response time of the isolation unit, and output a compensated process signal. The output circuit is configured to produce a transmitter output as a function of the compensated process signal.

A pressure sensor includes a cylindrical member configured to be attached to a body having a fluid passage, and a pressure sensor unit connected to the cylindrical member for detecting a pressure of a fluid flowing through the fluid passage, wherein the cylindrical member is made of a nickel-molybdenum-chromium alloy material or a stainless steel material, wherein the pressure sensor unit includes a sensor body closed at one end with a diaphragm and a pressure detecting element for outputting displacement of the diaphragm as pressure, and wherein the sensor body is made of a cobalt-nickel alloy material, and is connected at an opening side end portion to one end portion of the cylindrical member.

A pressure sensing device for sensing pressure. The pressure sensing device includes a sealed chamber, a second flexible diaphragm, and a protector member. The sealed chamber includes an upper portion comprising a first flexible diaphragm and a lower portion. The protector member includes a bottom surface with a fist concave shape, a top surface with a second concave shape, and a longitudinal hole between a lower cavity and an upper cavity. The lower cavity is between the first flexible diaphragm and a bottom surface of the protector member. The upper cavity is between the second flexible diaphragm and an upper surface of the protector member.

An apparatus in the field of optics technology, can include a reflector, a reflector substrate, and an extinction component. The reflector can be mounted on the reflector substrate. The extinction component can be arranged on a front surface of the reflector substrate. The reflector can be configured to reflect incident light signals. The extinction component can be configured to reduce the scattered light produced by the incident light signal on the reflector substrate. An optical scanning device (for example, lidar) having such features may greatly reduce the scattered light inside the lidar, reduce the detection blind area caused by the stray light, and greatly improve the receiving and detecting capabilities of the lidar.

Provided is a particle trapping apparatus for preventing an error of a pressure measurement. A particle trapping apparatus for preventing an error of a pressure measurement includes a pressure-measuring means; a measuring pipe for connecting the pressure-measuring means to a processing chamber; and a trapping means for capturing particles in a gas flowing through the measuring pipe, wherein the trapping means is coupled to the measuring pipe or is a portion of the measuring pipe.

A pressure sensor device is provided with: a pressure detection structure made in a first die of semiconductor material; a package, configured to internally accommodate the pressure detection structure in an impermeable manner, the package having a base structure and a body structure, arranged on the base structure, with an access opening in contact with an external environment and internally defining a housing cavity, in which the first die is arranged covered with a coating material. The pressure sensor device is also provided with a heating structure, accommodated in the housing cavity and for allowing heating of the pressure detection structure from the inside of the package.