A semiconductor package includes a flat plate-shaped terminal integrally formed with a housing portion for a semiconductor chip and a rod-shaped terminal pin that penetrates through a through-hole of the plate-shaped terminal. On a surface of the plate-shaped terminal, a resin guide portion for guiding the terminal pin to the through-hole of the plate-shaped terminal is provided. The resin guide portion is a portion of the housing portion and has a through-hole that is continuous with the through-hole of the plate-shaped terminal. During assembly of the semiconductor package, the terminal pin is inserted into the through-hole of the plate-shaped terminal, via the through-hole of the resin guide portion. A sidewall of the through-hole of the resin guide portion and a sidewall of the through-hole of the plate-shaped terminal have a same slope and form a single continuous surface; a border between the through-hole of the resin guide portion and the through-hole of the plate-shaped terminal is free of any step.

A chip package includes a chip, a dam layer, a permanent adhesive layer, a support, a buffer layer, a redistribution layer, a passivation layer, and a conducting structure. A conducting pad and a sensing device of the chip are located on a first surface of a substrate of the chip, and the conducting pad protrudes from the side surface of the substrate. The dam layer surrounds the sensing device. The permanent adhesive layer is between the support and the substrate. The support and the permanent adhesive layer have a trench to expose the conducting pad. The buffer layer is located on the support. The redistribution layer is located on the buffer layer and on the support, the permanent adhesive layer, and the conducting pad facing the trench. The passivation layer covers the redistribution layer, the buffer layer, and the conducting pad.

A chip package includes a chip, a dam layer, a permanent adhesive layer, a support, a buffer layer, a redistribution layer, a passivation layer, and a conducting structure. A conducting pad and a sensing device of the chip are located on a first surface of a substrate of the chip, and the conducting pad protrudes from the side surface of the substrate. The dam layer surrounds the sensing device. The permanent adhesive layer is between the support and the substrate. The support and the permanent adhesive layer have a trench to expose the conducting pad. The buffer layer is located on the support. The redistribution layer is located on the buffer layer and on the support, the permanent adhesive layer, and the conducting pad facing the trench. The passivation layer covers the redistribution layer, the buffer layer, and the conducting pad.

A sensor for detecting a pressure of a fluid medium is provided. The sensor includes a sensor element for detecting the pressure of the fluid medium, a supply duct for supplying the fluid medium to the sensor element and a control and/or evaluation circuit for processing signals of the sensor element. The control and/or evaluation circuit is situated on the sensor element.

A force detector capable of preventing short-circuit fault between electrodes and allowing for downsizing. A prescribed region encompasses a projection region defined by projecting a deformation region of a force sensor element, which is deformed when a force transmission member applies a force to the force sensor element, onto a base substrate. A plurality of terminals are provided by four soldering land electrodes formed, respectively, at four corners of the base substrate. The soldering land electrodes are shaped such that a portion of each soldering land electrode is located within the projection region to form a soldering portion.

The invention relates to a method for producing a pressure sensor, comprising the following steps: assembling a support substrate with a deformable membrane on which strain gauges have been deposited, wherein the deformable membrane comprises a thinned area at the center thereof, the support substrate is disposed on top of the deformable membrane, the support substrate comprises an upper surface and a lower surface in contact with the deformable membrane, and the support substrate also comprises lateral recesses arranged on top of the strain gauges and a central recess arranged on top of the thinned area of the membrane, so as to obtain a micromechanical structure; and, once the assembly has been obtained, depositing, in a single step, at least one conductive material on the upper surface of the support and in the lateral recesses of the support, said conductive material extending into the recesses in order to be in contact with the strain gauges so as to form electrical contacts in contact with the strain gauges.

The invention relates to a capacitive pressure measuring cell for detecting the pressure of a medium adjacent to the pressure measuring cell, comprising a ceramic elastic measuring membrane, the first side of which at least partially contacts the medium and the second side of which facing away from the medium comprises a measuring electrode, and a ceramic cylindrical basic body disposed opposite to the second side of the measuring membrane and comprising at least one counter electrode which forms a measuring capacitance with the measuring electrode.

A sensor assembly is configured to be securely connected to a portion of an engine, for example, of a vehicle. The sensor assembly may include a main body, a connector shroud extending from the main body, a port extending from the main body, a deflectable locking member extending from the main body, and a radial tab extending from the main body. The connector shroud is configured to receive an electrical connector that electrically connects the sensor assembly to an engine control unit. The port is configured to be inserted into an opening formed in the portion of the engine. The deflectable locking member and the radial tab cooperate to securely connect the sensor assembly to the portion of the engine, such as through rotation of the sensor assembly in relation to the engine.

A small form factor Microfused Silicon Strain gage (MSG) sensor incorporates an offset spring and feed-in features. A pressure sensor includes a spring having first and second coiled sections offset by a coiled center section in a middle that is used to make offset contact between two electrical contact pads.

A piezoelectric pressure sensor includes a sensor housing that accommodates a membrane, a piezoelectric sensor, a charge pick-off and a pre-stressing assembly. The membrane captures a pressure profile, and polarization charges are generated accordingly on the piezoelectric sensor by the captured pressure profile. The pre-stressing assembly includes a pre-stressing body and a pre-stressing sleeve and mechanically pre-stresses the piezoelectric sensor. The charge pick-off receives the polarization charges and is electrically insulated from the pre-stressing sleeve by a second gap. The charge pick-off is mechanically connected to the pre-stressing body via a first electric insulation body on a side of the pre-stressing body that faces away from the membrane and seals the second gap in a pressure-tight manner from an environment of the second gap.