A device having both an electronic assembly having an electronic component assembled on a first substrate, and also a body defining a cavity having a first end in fluid flow communication with a fluid, the electronic component extending inside the cavity and the first substrate including a portion in contact with a wall of the cavity. The coefficient of thermal expansion of the material of the first substrate is less than that of the electronic component, and the electronic component is assembled on the first substrate by a brazing type assembly method involving the application of heat. A method of making an electronic assembly. An assembly obtained by the method.

A semiconductor package includes a flat plate-shaped terminal integrally formed with a housing portion for a semiconductor chip and a rod-shaped terminal pin that penetrates through a through-hole of the plate-shaped terminal. On a surface of the plate-shaped terminal, a resin guide portion for guiding the terminal pin to the through-hole of the plate-shaped terminal is provided. The resin guide portion is a portion of the housing portion and has a through-hole that is continuous with the through-hole of the plate-shaped terminal. During assembly of the semiconductor package, the terminal pin is inserted into the through-hole of the plate-shaped terminal, via the through-hole of the resin guide portion. A sidewall of the through-hole of the resin guide portion and a sidewall of the through-hole of the plate-shaped terminal have a same slope and form a single continuous surface; a border between the through-hole of the resin guide portion and the through-hole of the plate-shaped terminal is free of any step.

A pressure sensor and a packaging method thereof. The pressure sensor comprises: a sensitive chip, which comprises a thin-wall part and a supporting part connected to the periphery of the thin-wall part, the supporting part being provided with an electrode; a sealing element, which is fitted over the sensitive chip and partially surrounds together with the sensitive chip to form a sealing cavity, the sealing element being provided with a through hole corresponding to the electrode; a conductive component, which is provided in the through hole in a sealed mode and electrically connected to the electrode, the conductive component and the sealing element being arranged in an insulating mode, and the conductive component comprising a filling part and a leading-out part embedded in the filling part.

In at least two groups of independent sensors connected to an electronic control device(s), at least two output signal ports are included in a sensor of a first group, and one output signal port is included in a sensor of a second group; and two output signals in the first group have different characteristics while having a constant relationship to each other defined in advance, and the one output signal in the second group has an equivalent characteristic to either one of the two output signals in the first group. The electronic control device(s) includes an abnormality determination unit which is configured in such a manner that all of output signals of the output signal ports are compared, and, for the control by the electronic control device(s), only a normal output signal(s) is used among the output signals thereof having been determined by the abnormality determination unit.

A pressure sensor includes: a cylindrical case defining an inner space in communication with an outer space; a pressure detector provided in the inner space of the cylindrical case and configured to detect a gauge pressure of a target fluid; an atmospheric pressure detector configured to detect an atmospheric pressure; and an electronic component configured to calculate an absolute pressure of the target fluid on a basis of the gauge pressure of the target fluid detected by the pressure detector and the atmospheric pressure detected by the atmospheric pressure detector.

A process pressure transmitter includes transmitter electronics disposed within a housing coupled to a pressure sensor formed by a cell body defining an interior cavity. A deflectable diaphragm separates the interior cavity into a first cavity and a second cavity. The deflectable diaphragm includes a groove region located around a periphery of the deflectable diaphragm.

The present invention belongs to the field of pressure sensors, and particular relates to a self-powered pressure sensor based on the phenomenon of post-buckling. The self-powered pressure sensor comprises a carrier module, an electric every storage module, a sensing information control module and a pressure sensing module, wherein the pressure sensing module comprises a base, a cover plate and a flexible piezoelectric patch; the cover plate is inserted into the base, a first elastic element is arranged between the cover plate and the base in a matching manner, and a mounting cavity is further defined between the cover plate and the base; and the flexible piezoelectric patch is arranged in the mounting cavity, the periphery of the flexible piezoelectric patch matches the mounting cavity in a limiting manner, and a second elastic element is arranged between the flexible piezoelectric patch and the cover plate in a matching manner.

A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.

A pressure sensor device includes a semiconductor die having a die surface that includes a pressure sensitive area; and a bond wire bonded to a first peripheral region of the die surface and extends over the die surface to a second peripheral region of the die surface, wherein the pressure sensitive area is interposed between the second peripheral region and the first peripheral region, wherein the bond wire comprises a crossing portion that overlaps an area of the die surface, and wherein the crossing portion extends over the pressure sensitive area that is interposed between the first and the second peripheral regions.

A connector for use with a sensor, such as a pressure sensor, has EMI absorbing capabilities. The connector includes a polymeric body configured for coupling to a sensor body and an EMI absorbing material. The EMI absorbing material may be entrained in the polymeric body, coated on the polymeric body, or otherwise integrated with the polymeric body. The EMI absorbing material may be carbon black or carbon nanotubes.