A process transmitter includes a transmitter housing and a liquid detector coupled to the transmitter housing. The liquid detector includes a temperature sensor configured to generate signals indicative of a presence of liquid within the transmitter housing. The process transmitter also includes a controller coupled to the liquid detector configured to receive the generated signals, determine the presence of liquid within the transmitter housing based on the received signals, and generate an output indicative of the determined presence of liquid within the transmitter housing.

A distributed air data module system includes several air data systems and a control module communicatively connected to each air data system via a data channel. Each of the air data systems includes a sensor that is configured to sense an air data parameter and to provide a sensor output signal that is indicative of the sensed air data parameter, and a sensor analog-to-digital converter that produces a digital air data parameter signal that is representative of the sensor output signal. Each air data system has an associated air data system address code. The control module is configured to generate a selected air data system address code corresponding to a selected air data systems, receive the digital air data parameter signal associated with the selected air data system via the data channel, and transmit the digital air data parameter signal via an aircraft data bus.

A pressure sensing module for an electronic device includes a substrate and a module housing coupled to the substrate. The module housing defines a first chamber and a second chamber. The second chamber is separate from the first chamber. The first chamber is configured to connect to an environment around an electronic device. The second chamber is configured to connect to an internal volume of the housing of the electronic device. A first pressure sensing element is electrically coupled to the substrate and disposed in the first chamber and is operative to detect an external pressure around the electronic device. A second pressure sensing element is electrically coupled to the substrate and disposed in the second chamber and is operative to detect an internal pressure within the electronic device housing.

A pressure sensor device includes a pressure sensor having a housing positioned on a center axis extending vertically, a sensing hole provided in a lower part of the housing, and an electrode unit provided in an upper part of the housing; and a connecting member having a contact spring that is pressed against the electrode unit of the pressure sensor. The electrode unit includes a first frame-shaped electrode having a frame-like shape that is rotationally symmetrical with respect to the center axis; and an annular first-surface portion on which the first frame-shaped electrode is placed.

A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.

A pressure-sensitive chip, a pressure sensor, and a pressure monitoring system. In an embodiment, a pressure-sensitive chip and a signal processing module are packaged to form a pressure sensor. The pressure sensor and a display instrument are connected to form a pressure monitoring system. A pressure-sensitive chip is a ceramic body made of eight green ceramic sheets by stacking and sintering, and includes two capacitors. In another embodiment, a pressure signal of a measurement area is obtained by a method including the following steps: sensing a pressure in a measurement area by the pressure-sensitive chip; generating a capacitance signal by the pressure-sensitive chip; converting the capacitance signal to a voltage signal by the signal processing module; and converting the voltage signal into the pressure signal by the display instrument.

Capacitive pressure sensors and other devices are disclosed. In an embodiment a semiconductor device includes a first electrode, a cavity over the first electrode and a second electrode including a suspended membrane over the cavity and electrically conductive anchor trenches laterally surrounding the cavity, wherein the anchor trenches include an inner anchor trench and an outer anchor trench, the outer anchor trench having rounded corners.

Instead of insert molding a mold member with a resin case to integrate it, a filler is filled into a first opening formed in the resin case while the mold member is disposed therein, whereby integration is performed. This makes it possible to suppress peeling between the mold member and the resin case due to a thermal cycle, and also makes it possible to suppress leakage of a measurement medium to the outside through a gap between the mold member and the resin case.

A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.

An electrical connector includes a main body portion, connection portions, a first temperature sensing element and a second temperature sensing element. The connection portions allow the main body portion to be electrically connected to a charged element provided in a flow channel. The main body portion includes a first side and a second side which are parallel to a flow direction of fluid. The first temperature sensing element and the second temperature sensing element are provided at mutually opposite positions on the first side and the second side in an electrically insulated manner. A fluid state test device having the electrical connector and a fluid heat exchange system are further provided. Thus, the original flow field where the electrical connector of the electrode of the electric heater is located may not change, and destruction to the flow field is avoided.