A pressure sensor system including at least one pressure sensor unit, the pressure sensor unit being configured with at least one sensor element which is situated in a cavity of a support structure, signal processing elements being integrated into support structure, the at least one sensor element being embeddable into the support structure to form the pressure sensor unit, and the support structure being formed by a land grid array/mold premold structure (LGA/MPM). The pressure sensor unit is introduced into a sensor housing to be provided with a diaphragm and is supported therein, a residual volume of the sensor housing, which is provided with at least one diaphragm and to the wiring of which the pressure sensor unit is electrically connected, being filled with an incompressible fluid. Also described is a method for manufacturing such a pressure sensor system and a measuring device.

A pressure sensor includes a connection portion provided with a screw portion configured to fix the pressure sensor to a combustion chamber of a vehicle engine; a hollow liquid-enclosing container fixed to one end of the connection portion; a pressure transmission fluid enclosed inside the liquid-enclosing container; a diaphragm fixed to one end of the liquid-enclosing container and elastically deformed when receiving pressure to transmit the pressure to the pressure transmission fluid; a pressure detection element fixed to the other end of the liquid-enclosing container and detecting the pressure transmitted to the pressure transmission fluid and converts the detected pressure into an electric signal; and a heat-dissipating rod provided inside the liquid-enclosing container. The connection portion and the liquid-enclosing container, and the connection portion and the diaphragm are mechanically connected to each other by welding or the like.

A variable capacitance type pressure transducer is constructed by electrically conductive diaphragm and electrode disposed on the surface of a dielectric disk. The gap between electrode and diaphragm is formed and solely decided by a spacer made of Super Invar or Invar, which has extra low thermal expansion coefficient. The gap between the electrode and the diaphragm is formed easily and almost no change when temperature of the transducer changes. The dielectric disk is centered with diaphragm radically by a mating between a pin made on the top lid of the pressure transducer and a center hole on the dielectric disk.

A pressure sensor assembly, which includes a support substrate, circuitry mounted to the support substrate, at least one conductor mounted to the support substrate and in electrical communication with the circuitry, and at least one vertically conductive path connected to and in electrical communication with the at least one conductor. The pressure sensor assembly also includes a diaphragm, at least one sealing glass section connected to the diaphragm and the support substrate, and at least one lateral conductive feed-through mounted to the diaphragm. At least one conductive joint is connected to the vertically conductive path and the lateral conductive feed-through, and the conductive joint provides electrical communication between the vertically conductive path and the lateral conductive feed-through.

A process transmitter includes a transmitter housing and a liquid detector coupled to the transmitter housing. The liquid detector includes a temperature sensor configured to generate signals indicative of a presence of liquid within the transmitter housing. The process transmitter also includes a controller coupled to the liquid detector configured to receive the generated signals, determine the presence of liquid within the transmitter housing based on the received signals, and generate an output indicative of the determined presence of liquid within the transmitter housing.

A pressure sensing module for an electronic device includes a substrate and a module housing coupled to the substrate. The module housing defines a first chamber and a second chamber. The second chamber is separate from the first chamber. The first chamber is configured to connect to an environment around an electronic device. The second chamber is configured to connect to an internal volume of the housing of the electronic device. A first pressure sensing element is electrically coupled to the substrate and disposed in the first chamber and is operative to detect an external pressure around the electronic device. A second pressure sensing element is electrically coupled to the substrate and disposed in the second chamber and is operative to detect an internal pressure within the electronic device housing.

A controller for an environmental sensor provides digital environmental measurement values from analog environmental measurements performed by analog circuitry, the digital environmental measurement values lying in a global scale range. The controller subjects the global scale range to a subdivision into scale subranges that are proper subranges of the global scale range. The controller selects, among the scale subranges, one scale subrange in which an analog environmental measurement is to be performed, selects an offset information and a gain information that are associated with the selected scale subrange and that are indicative of an offset and a gain to be applied by the analog circuitry to perform an analog environmental measurement in the selected scale subrange, and to provide the offset information and the gain information to the analog circuitry.

A pressure sensor has a stem in which a pressure introduction hole into which a pressure medium is introduced and a diaphragm deformable according to the pressure of the pressure medium are formed, and a strain detecting element which is arranged on the diaphragm via an insulating film and being configured to output a detection signal according to the deformation of the diaphragm. The strain detecting element is configured to have a portion made of polysilicon. A low doping layer having a higher electrical resistivity than polysilicon and a higher crystallinity than the insulating film is arranged between the insulating film and the strain detecting element.

A sensor device having a first counter electrode extending under an intermediate carrier, and having a first distance between the intermediate carrier and the first counter electrode being modifiable by the pressure on the movable region, and the first counter electrode encompassing, under the intermediate carrier, at least one electrically separated region that is disposed below a spacing element and includes at least a lateral extent of the spacing element.

A pressure sensor and method of manufacturing the like are provided for determining a pressure of a fluid. An example pressure sensor includes a pressure sensor housing sealably attached to a diaphragm at a first end. The header includes a lip configured to engageably fit with the second end of the pressure sensor housing to create a hermetically sealed component compartment. The header also includes header pin(s) configured to transmit electrical signals between an interior and an exterior of the hermetically sealed component compartment. A sensing element and a processor are disposed within the hermetically sealed component compartment and in communication with one another. The sensing element is mounted to the processor within the hermetically sealed compartment. The corresponding method of manufacture is also provided.