The invention describes a pressure measuring device having a carrier (1), a base (3) which is connected to the carrier (1), and a pressure sensor (5) which is mounted on the base (3) and of which the base area is greater than a base area of the base (5), the pressure sensor (5) being protected against thermomechanical stresses by an end, which is averted from the pressure sensor (5), of the base (3) being adhesively bonded into a recess (17) in the support (1) by means of an adhesive bond (19, 23, 25).

The invention describes a pressure measuring device having a carrier (1), a base (3) which is connected to the carrier (1), and a pressure sensor (5) which is mounted on the base (3) and of which the base area is greater than a base area of the base (5), the pressure sensor (5) being protected against thermomechanical stresses by an end, which is averted from the pressure sensor (5), of the base (3) being adhesively bonded into a recess (17) in the support (1) by means of an adhesive bond (19, 23, 25).

A gauge pressure transducer assembly having anti-icing features to allow for easy drainage of fluids to prevent pooling and icing. The assembly can include a header having one or more atmospheric ports extending therethrough, a differential sensing element mounted to the header, a header cap attached to at least a portion of the header, a gauge adapter attached to the header and in communication with the one or more atmospheric ports of the header, an elongated tube attached to the header cap, and a front port attached to the elongated tube. The gauge adapter includes a plurality of through-holes to facilitate drainage and de-icing, which is an improvement over conventional transducers that can trap water within the ports that can freeze and cause damage. The header and the gauge adapter of the gauge pressure transducer assembly can reduce or eliminate regions where water can pool and freeze.

A semiconductor pressure sensor includes a fixed electrode placed at a principal surface of a semiconductor substrate, and a diaphragm movable through an air gap in a thickness direction of the semiconductor substrate at least in an area where the diaphragm is opposed to the fixed electrode. The diaphragm includes: a movable electrode; a first insulation film placed closer to the air gap with respect to the movable electrode; a second insulation film placed opposite to the air gap with respect to the movable electrode, the second insulation film being of a same film type as the first insulation film; and a shield film that sandwiches the second insulation film with the movable electrode.

A pressure sensor includes a housing with a cavity. The cavity includes a fill fluid and a compensation material. The fill fluid conveys a pressure from a process fluid through a diaphragm to a sensor. The compensation material reduces a difference of thermal expansions between the cavity and the fill fluid.

A pressure sensor includes a housing with a cavity. The cavity includes a fill fluid and a compensation material. The fill fluid conveys a pressure from a process fluid through a diaphragm to a sensor. The compensation material reduces a difference of thermal expansions between the cavity and the fill fluid.

In a sensor module for measuring a pressure of a fluid, having at least one supporting element, at least one electronic circuit, particularly an integrated circuit, arranged on at least one circuit carrier, and with at least one pressure measuring chip that has at least one pressure measuring membrane, wherein at least sections of the circuit carrier are surrounded by a protective material to protect it from surrounding fluids, it is provided as essential to the invention that the pressure measuring chip and the circuit carrier are arranged vertically one underneath the other, and that the pressure measuring chip is at least partially mechanically decoupled from the supporting element.

A pressure sensor outputting an electrical signal upon a fluid pressure in a target space includes a diaphragm having a pressure receiving surface disposed in the target space for receiving a fluid pressure, and a back surface on a back side of the pressure receiving surface, an inner member disposed to face the back surface and a diaphragm supporting portion connected to the diaphragm. The diaphragm includes a center portion disposed to face the inner member and is distorted as a concave shape toward the detecting direction because of the heat transmitted to the pressure receiving surface and the distortion of the center portion as a concave shape toward the detecting direction. A contacting portion provided on a connecting portion between the center portion and the outside portion is in contact with the inner member.

Systems and methods are disclosed for a switched, multiple range sensor system including multiple transducers. In one embodiment, a method is provided that includes receiving and measuring at a first transducer and a second transducer, a pressure to generate a respective first and second pressure signal; amplifying the first and second pressure signals with corresponding first and second fixed-gain amplifier to generate first and second amplified pressure signals; selecting for monitoring, the first or second amplified pressure signal; converting the selected amplified pressure signal to an intermediate digital pressure signal; measuring, at a thermal sensor associated with the selected amplified pressure signal, a temperature; compensating, based on the measured temperature, the intermediate digital pressure signal to generate a compensated digital pressure output signal; and outputting the compensated digital pressure output signal.

Systems and methods are disclosed for a switched, multiple range sensor system including multiple transducers. In one embodiment, a method is provided that includes receiving and measuring at a first transducer and a second transducer, a pressure to generate a respective first and second pressure signal; amplifying the first and second pressure signals with corresponding first and second fixed-gain amplifier to generate first and second amplified pressure signals; selecting for monitoring, the first or second amplified pressure signal; converting the selected amplified pressure signal to an intermediate digital pressure signal; measuring, at a thermal sensor associated with the selected amplified pressure signal, a temperature; compensating, based on the measured temperature, the intermediate digital pressure signal to generate a compensated digital pressure output signal; and outputting the compensated digital pressure output signal.