A semiconductor device includes a pad formed on a surface of a substrate, a bonding wire for connecting the pad to an external circuit, and a resin layer covering at least a connection portion between the pad and the bonding wire and exposing at least a part of the substrate outside the pad.

A reconfigurable pressure transducer assembly having an input tube filter assembly is provided. The resonant frequency and dampening characteristics associate with the pressure transducer assembly may be configured by the input tube filter assembly. The input tube filter assembly includes one or more inserts disposed in an input tube channel, the one or more inserts including one or more bores of selectable dimensions and extending therethrough from a first end to a second end. The one or more inserts define an effective input tube bore, and the input tube filter assembly is tunable by selection of the selectable dimensions of the one or more inserts.

A differential MEMS pressure sensor includes a topping wafer with a top side and a bottom side, a diaphragm wafer having a top side connected to the bottom side of the topping wafer and a bottom side, and a backing wafer having a top side connected to the bottom side of the diaphragm wafer and a bottom side. The topping wafer includes a first cavity formed in the bottom side of the topping wafer. The diaphragm wafer includes a diaphragm, a second cavity formed in the bottom side of the diaphragm wafer underneath the diaphragm, an outer portion surrounding the diaphragm, and a trench formed in the top side of the diaphragm wafer and positioned in the outer portion surrounding the diaphragm.

A pressure gauge and/or relief valve which may be used in a single-use fluid system, such as a sterilizable fluid system. The pressure gauge and/or pressure relief valve may be formed of a disposable and/or sterilizable material, such as a non-metallic (e.g., polymeric) material. The material of the pressure gauge and/or pressure relief valve may be compatible with the material of a fluid-containing structure of the fluid system, such as to be bonded (e.g., welded) therewith. The fluid-containing structure may be retrofitted to integrate the pressure gauge and/or pressure relief valve therewith. The pressure gauge and/or pressure relief valve may have a simple configuration, such as a housing with a movable element therein. The movable element moves with respect to the housing to indicate pressure and/or to relieve pressure from within the housing and/or fluid-containing structure.

An oil-fill pressure transducer including a flexible member configured to protect an isolation diaphragm and sensing element. The pressure transducer includes a sensing element mounted to the header, an isolation diaphragm mounted on the front side of the header, and adjacent to the sensing element such that an oil-fill cavity is defined between the sensing element and the isolation diaphragm. The flexible member is disposed adjacent to the isolation diaphragm and a retention member is disposed adjacent to the flexible member. A cavity in communication with the retention member is configured to transmit pressure media to the isolation diaphragm via the flexible member. The flexible member can include thru-holes. The flexible member may compress under an applied positive pressure change. The flexible member may temporarily separate from at least a portion of the isolation diaphragm under an applied negative pressure change.

The present disclosure relates to a relative-pressure sensor for determining a pressure of a medium in relation to an atmospheric pressure, the sensor comprising a housing; a measuring element arranged in the housing, wherein the pressure to be measured acts upon an outer surface of the measuring element, said surface being in contact with the medium; a reference-pressure supply, which supplies an inner surface of the measuring element with atmospheric pressure in the form of ambient air; an evaluation unit, which determines the pressure of the medium from a variable determined using the measuring element; and at least one drying chamber arranged in the housing for taking up atmospheric humidity from the ambient air supplied through the reference-pressure supply. Here, a bushing is provided, which can be pressed into the housing and has a capillary-type groove, which is helical at least in sections and runs around the bushing.

Embodiments for a packaged semiconductor device and methods of making are provided herein, where a packaged semiconductor device includes a package body having a recess in which a pressure sensor is exposed; a polymeric gel within the recess that vertically and laterally surrounds the pressure sensor; and a protection layer including a plurality of beads embedded within a top region of the polymeric gel.

A water detecting pressure-sensing device includes a metal housing including a cavity. A pressure sensor is disposed on a die and configured to generate a signal in response to a pressure variation. A protection medium at least partially fills the cavity and covers the die. One or more electrodes are disposed on the die and are used to detect a presence of a water droplet on the protection medium.

A micromechanical component for a sensor device, including a substrate, at least one first counter-electrode, at least one first electrode adjustably situated on a side of the at least one first counter-electrode facing away from the substrate, and a capacitor sealing structure, which seals gas-tight an interior volume, including the at least one first counter-electrode present therein and the at least one first electrode present therein. The at least one first counter-electrode is fastened directly or indirectly to a frame structure fastened directly or indirectly to the substrate, and the frame structure framing a cavity, and the at least one first counter-electrode at least partially spanning the cavity in such a way that at least one gas is transferable between the cavity and the interior volume via at least one opening formed at and/or in the at least one first counter-electrode.

A semiconductor device for ambient sensing including: a cap traversed by a hole; and a main body mechanically coupled to the cap so as to delimit a cavity, which is interposed between the main body and the cap. The main body includes a semiconductor body and a coupling structure, which is interposed between the semiconductor body and the cap and laterally delimits a channel, which fluidically couples the cavity and the hole. The channel performs a mechanical filtering that is finer than the mechanical filtering performed by the hole.