An assembly for measuring the air flow in an air intake duct of an internal combustion engine. The assembly includes a housing with an inlet opening, an outlet opening, a channel with an inner wall defining a predetermined cross-sectional area and a closure member that is movably mounted in the channel between a closed and opened position. A first annular chamber is situated upstream from the closure member and a second annular chamber is placed downstream of the closure member. Each chamber has an inner chamber wall with a number of apertures that are in fluid communication with the channel. A first pressure sensor is connected to the first chamber for measuring a pressure in the first chamber, a second pressure sensor being connected to the first chamber and to the second chamber for measuring a difference in pressure in the first and second chamber.

A pressure sensor having an anti-adhesion layer, and a method for manufacturing such a pressure sensor. In this context, the pressure sensor includes a pressure sensor element, which is accommodated and/or situated in a housing of the pressure sensor. In order to protect the pressure sensor element, at least one filling material is provided, which is introduced into the housing and covers the pressure sensor element at least partially. The surface of the at least one filling material is configured to have an antistatic effect.

A pressure sensor having an anti-adhesion layer, and a method for manufacturing such a pressure sensor. In this context, the pressure sensor includes a pressure sensor element, which is accommodated and/or situated in a housing of the pressure sensor. In order to protect the pressure sensor element, at least one filling material is provided, which is introduced into the housing and covers the pressure sensor element at least partially. The surface of the at least one filling material is configured to have an antistatic effect.

A pressure transmitter is mounted to the sampling output of a sampling meter resetter. The pressure transmitter and the sampling meter resetter are mounted in a subterranean meter box. In embodiments, the pressure transmitter is removably mounted to a spring-loaded sampling valve.

A pressure transmitter is mounted to the sampling output of a sampling meter resetter. The pressure transmitter and the sampling meter resetter are mounted in a subterranean meter box. In embodiments, the pressure transmitter is removably mounted to a spring-loaded sampling valve.

The disclosed technology relates to a field serviceable pressure scanner suitable for high-pressure sensing applications and replacement of large pressure transmitter panels. The pressure scanner includes a housing having a mounting plate comprising a plurality of through-hole bores extending from a front to back side for mating with corresponding transducer ports of the pressure sensors, and a plurality of input ports disposed on the front side of the mounting plate and in communication with the corresponding plurality of through-hole bores. The pressure scanner assembly includes two or more field-replaceable (swappable) pressure sensors seal mounted to the back side of the mounting plate, each pressure sensor comprising one or more sensor ports, each of the one or more sensor port in communication with corresponding through-hole bores in the mounting plate, and a multi-channel data acquisition system configured to receive pressure signals from the two or more field-replaceable pressure sensors.

The disclosed technology relates to a field serviceable pressure scanner suitable for high-pressure sensing applications and replacement of large pressure transmitter panels. The pressure scanner includes a housing having a mounting plate comprising a plurality of through-hole bores extending from a front to back side for mating with corresponding transducer ports of the pressure sensors, and a plurality of input ports disposed on the front side of the mounting plate and in communication with the corresponding plurality of through-hole bores. The pressure scanner assembly includes two or more field-replaceable (swappable) pressure sensors seal mounted to the back side of the mounting plate, each pressure sensor comprising one or more sensor ports, each of the one or more sensor port in communication with corresponding through-hole bores in the mounting plate, and a multi-channel data acquisition system configured to receive pressure signals from the two or more field-replaceable pressure sensors.

A sensor assembly includes a mounting portion arranged to support a sensing device, a thermal shunt portion extending from the mounting portion, and a housing portion. The housing portion extends from the thermal shunt portion and is arranged on a side of the thermal shunt portion opposite the mounting portion to limit temperature of a sensor connector fixed to the housing portion of the sensor assembly. Gas turbine engines having sensor assemblies and methods of making sensor assemblies are also described.

An embodiment provides a beam projector module including: a light source configured to output light; a substrate configured to support the light source; an optical device configured to reduce the light in terms of intensity output to a predetermined space; a frame configured to separate the optical device from the light source by a predetermined distance; an optical substrate configured to attach the optical device thereto and to define a sealed space with the substrate and the frame, the sealed space having internal pressure lower than pressure outside the sealed space; a sensor configured to measure a state of the sealed space; and a processor configured to change an operation mode of the light source depending on a measured value of the sensor.

A differential MEMS pressure sensor includes a topping wafer with a top side and a bottom side, a diaphragm wafer having a top side connected to the bottom side of the topping wafer and a bottom side, and a backing wafer having a top side connected to the bottom side of the diaphragm wafer and a bottom side. The topping wafer includes a first cavity formed in the bottom side of the topping wafer. The diaphragm wafer includes a diaphragm, a second cavity formed in the bottom side of the diaphragm wafer underneath the diaphragm, an outer portion surrounding the diaphragm, and a trench formed in the top side of the diaphragm wafer and positioned in the outer portion surrounding the diaphragm.