A structure for, and method of, forming a first optoelectronic circuitry that generates an optical signal, a second optoelectronic circuitry that receives an optical signal, and a loopback waveguide that connects the output from the first optoelectronic circuitry to the second optoelectronic circuitry on an interposer substrate are described. The connected circuits, together comprising a photonic integrated circuit, are electrically tested using electrical signals that are provided via probing contact pads on the PIC die. Electrical activation of the optoelectrical sending devices and the subsequent detection and measurement of the optical signals in the receiving devices, in embodiments, provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

An optical circuit inspection probe includes a piezoelectric element and a gel-like medium layer provided at an end of the piezoelectric element to absorb light and convert the light into a sound wave. The piezoelectric element may be formed of piezoelectric ceramics such as Pb (Zr.Math.Ti)O.sub.3 (PZT). The piezoelectric element has, for example, a cylindrical shape. The medium layer is formed of a hydrogel. The hydrogel may include, for example, polydimethylsiloxane (PDMS). Further, the medium layer may contain carbon.

This coating condition detection method according to one embodiment uses a simple device structure to detect the coating condition of a resin layer of a coated fiber. Under the coating condition detection method, an imaging optical system including a reflection mirror having a guide hole through which the optical fiber passes is prepared, and the imaging optical system is disposed so as to cause an object plane conjugate with an imaging plane to intersect the optical fiber that has passed through the reflection mirror and forms an image of light released from the optical fiber on the imaging plane to detect intensity of light at each point on the imaging plane with the intensity of light associated with information on a corresponding position on the object plane.

An optical path correction subassembly, an optical detection assembly, and an optical detection system are provided. The optical path correction subassembly can be optionally configured to be applied to a light detector. The optical path correction subassembly includes a holder structure and an optical path correction structure carried by the holder structure, and the optical path correction structure has a light beam guiding surface arranged as a reverse inclination inclined relative to a vertical line. The light beam guiding surface of the optical path correction structure can be configured to effectively or accurately guide a predetermined light beam to a light receiving surface of the light detector so as to facilitate collection of the predetermined light beam. The light beam guiding surface of the optical path correction structure can be arranged at an acute angle relative to the light receiving surface of the light detector.

Provided is a method of manufacturing an optical device that includes a multicore fiber including a plurality of cores and a fan-in/fan-out device including single-core fibers that are respectively connected to the cores based on a plurality of connection combinations when the multicore fiber is rotated. The method includes: a first step of determining an optical loss for each of the cores while changing the connection combinations between the single-core fibers and the cores; and a second step of selecting one of the connection combinations according to a result of the first step and connecting an end portion of the multicore fiber and an end portion of the fan-in/fan-out device to connect the single-core fibers with the cores based on the one of the connection combinations.

An optical fiber pay-off system includes a draw spool around which an optical fiber is wound and defining a longitudinal axis; a pay-off arm movable parallel to the longitudinal axis and engaged with a pay-off portion of the optical fiber; a controller configured to receive first and second position signals and instructs the pay-off arm to selectively move in a first direction and in an opposite second direction; first and second proximity sensors mounted on the pay-off arm; a tilting support rotatably mounted on the pay-off arm. The system further includes an activation body fixed to the tilting support and extending between the first and second proximity sensors to be selectively detected by the sensors according to positions assumed by the tilting support. The system further includes first and second contacts fixed to the tilting support and defining an intermediate space in which the pay-off portion can move.

A mode control system and method for controlling an output mode of a broadband radiation source including a photonic crystal fiber (PCF). The mode control system includes at least one detection unit configured to measure one or more parameters of radiation emitted from the broadband radiation source to generate measurement data, and a processing unit configured to evaluate mode purity of the radiation emitted from the broadband radiation source, from the measurement data. Based on the evaluation, the mode control system is configured to generate a control signal for optimization of one or more pump coupling conditions of the broadband radiation source. The one or more pump coupling conditions relate to the coupling of a pump laser beam with respect to a fiber core of the photonic crystal fiber.

Electrical test of optical components via metal-insulator-semiconductor capacitor structures is provided via a plurality of optical devices including a first material embedded in a second material, wherein each optical device is associated with a different thickness range of a plurality of thickness ranges for the first material; a first capacitance measurement point including the first material embedded in the second material; and a second capacitance measurement point including a region from which the first material has been replaced with the second material.

It is provided an apparatus, comprising a box configured to conduct an optical fiber from an exterior to an interior of the box; at least one of a mounting means adapted to mount a connecting means to which the optical fiber may be connected and a guiding means adapted to guide the optical fiber, wherein the at least one of the mounting means and the guiding means is arranged in the interior of the box; a detecting means arranged in the interior of the box adapted to detect a first signal from the interior of the box, wherein the first signal is at least one of a light and a smoke; wherein the interior of the box is substantially shielded from a second signal from an exterior of the box, and the detecting means is suitable to detect the second signal in a same manner as the first signal.

In some implementations, an optical component of a microscope may capture an image of a profile of a ferrule and a connector of an optical fiber based on the ferrule being received by a first opening of a first connector adapter of the microscope. A mechanical axis of the ferrule may be orthogonal to an optical path from a camera of the microscope to the ferrule when the ferrule is received by the first opening. One or more processors associated with the microscope may process the image to determine a measurement of a chamfer of the ferrule. The optical component may capture an image of an endface of the ferrule based on the ferrule being received by a second opening of a second connector adapter. The mechanical axis of the ferrule may be axially aligned with the optical path when the ferrule is received by the second opening.