Systems and methods for monitoring copper corrosion in an integrated circuit (IC) device are disclosed. A corrosion-sensitive structure formed in the IC device may include a p-type active region adjacent an n-type active region to define a p-n junction space charge region. A copper region formed over the silicon may be connected to both the p-region and n-region by respective contacts, to thereby define a short circuit. Light incident on the p-n junction space charge region, e.g., during a CMP process, creates a current flow through the metal region via the short circuit, which drives chemical reactions that cause corrosion in the copper region. Due to the short circuit configuration, the copper region is highly sensitive to corrosion. The corrosion-sensitive structure may be arranged with less corrosion-sensitive copper structures in the IC device, with the corrosion-sensitive structure used as a proxy to monitor for copper corrosion in the IC device.

Systems and methods for monitoring copper corrosion in an integrated circuit (IC) device are disclosed. A corrosion-sensitive structure formed in the IC device may include a p-type active region adjacent an n-type active region to define a p-n junction space charge region. A copper region formed over the silicon may be connected to both the p-region and n-region by respective contacts, to thereby define a short circuit. Light incident on the p-n junction space charge region, e.g., during a CMP process, creates a current flow through the metal region via the short circuit, which drives chemical reactions that cause corrosion in the copper region. Due to the short circuit configuration, the copper region is highly sensitive to corrosion. The corrosion-sensitive structure may be arranged with less corrosion-sensitive copper structures in the IC device, with the corrosion-sensitive structure used as a proxy to monitor for copper corrosion in the IC device.

The embodiments of the present disclosure provide methods for assessing electrochemical corrosion of a smart gas pipeline. The method may be implemented based on a smart gas pipeline network safety management platform of an Internet of Things system for assessing electrochemical corrosion of a smart gas pipeline. The method may include: obtaining environmental data of at least one position of a gas pipeline at a first time; determining an electrochemical corrosion degree of each of the at least one position of the gas pipeline at a second time based on the environmental data of the at least one position at the first time, wherein the first time is before the second time; determining, based on electrochemical corrosion degree, a protection scheme of the gas pipeline.

The embodiments of the present disclosure provide methods for assessing electrochemical corrosion of a smart gas pipeline. The method may be implemented based on a smart gas pipeline network safety management platform of an Internet of Things system for assessing electrochemical corrosion of a smart gas pipeline. The method may include: obtaining environmental data of at least one position of a gas pipeline at a first time; determining an electrochemical corrosion degree of each of the at least one position of the gas pipeline at a second time based on the environmental data of the at least one position at the first time, wherein the first time is before the second time; determining, based on electrochemical corrosion degree, a protection scheme of the gas pipeline.

A carbon nanotube (CNT) assembled thin film modified steel wire array electrode, a preparation method and application thereof. The array electrode includes: a surface of a steel wire is negatively modified, and the surface of the steel wire is assembled with a plurality of layers of CNT thin films; one end of the steel wire is welded to a conductor, and a welding position between the steel wire and the conductor is wrapped with an insulating heat shrinkable tube; and the insulating template and the steel wire are encapsulated and cured by using an epoxy resin. The preparation method of the array electrode of the invention mainly includes the following steps: first, performing negative modification on a steel wire, then, assembling CNT thin films on the steel wire, and preparing the modified array steel wire into the CNT assembled thin film modified steel wire array electrode.

A carbon nanotube (CNT) assembled thin film modified steel wire array electrode, a preparation method and application thereof. The array electrode includes: a surface of a steel wire is negatively modified, and the surface of the steel wire is assembled with a plurality of layers of CNT thin films; one end of the steel wire is welded to a conductor, and a welding position between the steel wire and the conductor is wrapped with an insulating heat shrinkable tube; and the insulating template and the steel wire are encapsulated and cured by using an epoxy resin. The preparation method of the array electrode of the invention mainly includes the following steps: first, performing negative modification on a steel wire, then, assembling CNT thin films on the steel wire, and preparing the modified array steel wire into the CNT assembled thin film modified steel wire array electrode.

A testing device includes a scaffold for supporting conductive wires. The scaffold is placed in housing in which liquid and vapor phases of a fluid are provided, such that a first of the conductive wires extends into the liquid and a second of the conductive wires remains in the vapor throughout a test. The scaffold may include a plurality of lower support members and a plurality of upper wire support members, each of the support members including a plurality of routing supports to wrap a respective one of the test wires around. The device allows measurements to be made contemporaneously for the test wires.

A testing device includes a scaffold for supporting conductive wires. The scaffold is placed in housing in which liquid and vapor phases of a fluid are provided, such that a first of the conductive wires extends into the liquid and a second of the conductive wires remains in the vapor throughout a test. The scaffold may include a plurality of lower support members and a plurality of upper wire support members, each of the support members including a plurality of routing supports to wrap a respective one of the test wires around. The device allows measurements to be made contemporaneously for the test wires.

A system, apparatus, and method for analyzing cathodic protection (CP) current shielding of a coating are provided. The system includes: a test cell configured to have a coating film disposed therein and to be filled with electrically conductive solution surrounding the coating film; an electrical resistance (ER) probe mounted through a port of the test cell; and a potentiostat configured to: apply potential to the test cell to thereby polarize a sensing element of the ER probe such that the ER probe is configured to measure data indicative of a corrosion rate of the sensing element when the coating film is disposed within the test cell and while a CP current flows through the sensing element; and measure a current density through the sensing element in order to indicate an extent of CP current shielding of the coating film.

A system, apparatus, and method for analyzing cathodic protection (CP) current shielding of a coating are provided. The system includes: a test cell configured to have a coating film disposed therein and to be filled with electrically conductive solution surrounding the coating film; an electrical resistance (ER) probe mounted through a port of the test cell; and a potentiostat configured to: apply potential to the test cell to thereby polarize a sensing element of the ER probe such that the ER probe is configured to measure data indicative of a corrosion rate of the sensing element when the coating film is disposed within the test cell and while a CP current flows through the sensing element; and measure a current density through the sensing element in order to indicate an extent of CP current shielding of the coating film.