G01N23/20

METHOD FOR MANUFACTURING REFERENCE PIECE FOR X-RAY MEASUREMENT OF RESIDUAL STRESS AND REFERENCE PIECE FOR X-RAY MEASUREMENT OF RESIDUAL STRESS
20230160843 · 2023-05-25 · ·

A metal material other than strain-free iron powder can be used as a reference piece for X-ray measurement of residual stress. The metal material is manufactured by nanocrystallizing at least a portion of a surface of a metal material, and then removing inherent strain by annealing the metal material, thereby eliminating stress.

Combined scanning x-ray generator, composite inspection apparatus, and inspection method for hybrid

Embodiments of the present disclosure disclose a combined scanning X-ray generator, a composite inspection apparatus and an inspection method. The combined scanning X-ray generator includes: a housing; an anode arranged in the housing, the anode including a first end of the anode and a second end of the anode opposite the first end of the anode; a pencil beam radiation source arranged at the first end of the anode and configured to emit a pencil X-ray beam; and a fan beam radiation source arranged at the second end of the anode and configured to emit a fan X-ray beam; wherein the pencil beam radiation source and the fan beam radiation source are operated independently.

DETERMINING WEATHERING INDICES BY X-RAY DIFFRACTION
20230105649 · 2023-04-06 ·

Methods for determining a weathering index using x-ray diffraction (XRD) data are provided. An exemplary method includes obtaining XRD data of a weathered rock sample, and calculating the weathering index using a formula developed to use the XRD data.

Substance identification device and method for extracting statistical feature based on cluster analysis

The present disclosure provides a substance identification device and a substance identification method. The substance identification device comprises: a classifier establishing unit configured to establish a classifier based on scattering density values reconstructed for a plurality of known sample materials, wherein the classifier comprises a plurality of feature regions corresponding to a plurality of characteristic parameters for the plurality of known sample materials, respectively; and an identification unit for a material to be tested, configured to match the characteristic parameter of the material to be tested with the classifier, and to identify a type of the material to be tested by obtaining a feature region corresponding to the characteristic parameter of the material to be tested.

Edge phase effects removal using wavelet correction and particle classification using combined absorption and phase contrast

An x-ray microscopy method that obtains a classification of different particles by distinguishing between different material phases through a combination of image processing involving morphological edge enhancement and possibly resolved absorption contrast differences between the phases along with optional wavelet filtering.

Edge phase effects removal using wavelet correction and particle classification using combined absorption and phase contrast

An x-ray microscopy method that obtains a classification of different particles by distinguishing between different material phases through a combination of image processing involving morphological edge enhancement and possibly resolved absorption contrast differences between the phases along with optional wavelet filtering.

METHOD FOR DRY-ETCHING SEMICONDUCTOR SUBSTRATE AND METHOD FOR DRY-ETCHING SILICON OXIDE FILM
20230207399 · 2023-06-29 · ·

A method for dry-etching a semiconductor substrate having an oxide film, including: evaluating a film quality of the oxide film and determining a time for performing the dry-etching on a basis of results of the evaluation in advance. This provides a method for controlling the etching amount of an oxide film accurately and suppressing over-etching and insufficient etching without influence from variation in the film quality of the oxide film when dry-etching the oxide film on the surface of the semiconductor substrate.

METHOD FOR DRY-ETCHING SEMICONDUCTOR SUBSTRATE AND METHOD FOR DRY-ETCHING SILICON OXIDE FILM
20230207399 · 2023-06-29 · ·

A method for dry-etching a semiconductor substrate having an oxide film, including: evaluating a film quality of the oxide film and determining a time for performing the dry-etching on a basis of results of the evaluation in advance. This provides a method for controlling the etching amount of an oxide film accurately and suppressing over-etching and insufficient etching without influence from variation in the film quality of the oxide film when dry-etching the oxide film on the surface of the semiconductor substrate.

PROCESSING METHOD, PROCESSING APPARATUS AND PROCESSING PROGRAM

Provided are a processing method, a processing apparatus and a processing program which can perform pole figure measurement continuously without overlapping of an angle α in a pole figure with the small number of times of φ scan, thereby enabling the efficient measurement. The processing method for determining conditions of pole figure measurement by X-ray diffraction, includes the steps of: receiving input of a diffraction angle 2θ; and determining an angle ω formed by an incident X-ray and an x-axis, and a tilt angle χ of a sample in each φ scan for a rotation angle φ within a sample plane so as to make a range of an angle α continuous from α=90° to α=0° without overlapping, the angle α being formed by the sample plane and a scattering vector, the range of the angle α are detectable at a time on a two-dimensional detection plane in the pole figure measurement at the input angle 2θ, in which determining the angle ω and the angle χ is repeated.

DIFFRACTION-BASED GLOBAL IN VITRO DIAGNOSTIC SYSTEM
20230207074 · 2023-06-29 · ·

Provided herein are diffractometer-based global diagnostic systems and uses thereof. The systems may comprise one or more diffraction apparatus operatively coupled to a computer database over a network. The one or more diffraction apparatus may be configured for transfer of data such as pathology lab image data, diffraction pattern data, subject data, or any combination thereof to the computer database over the network. The systems may further comprise one or more computer processors operatively coupled to the one or more diffraction apparatus, which computer processors may be configured to receive the data from the diffraction apparatus, transmit the data to the computer database, and process the data using a data analytics algorithm which may provide a computer-aided diagnostic indicator for the individual subject.