One or more implementations of the present disclosure relate to a wireless, multi-sensor food thermometer that includes a temperature probe having a linear array of temperature sensors that are operative to measure: temperature profiles within a food product during a cooking process, a temperature at a core of the food product, a temperature at the surface of the food product, and a temperature of the ambient cooking environment in which the food is being cooked. The temperature probe includes a wireless interface that transmits temperature information to one or more external devices for use thereby. Rather than transmitting raw temperature data, the temperature probe may transmit coefficients that correspond to a function that describes the temperature profile within the food or parameters necessary to solve a governing heat equation, which reduces data transmission requirements and reduces power consumption. The food thermometer may include a charger case that houses the temperature probe and charges a power source of the temperature probe using a replaceable battery.

The design and structure of a fluidic concentration metering device with a full dynamic range utilizing micro-machined thermal time-of-flight sensing elements is exhibited in this disclosure. With an additional identical sensing chip but packaged at the different locations in the measurement fluidic chamber with a closed conduit, the device can simultaneously measure the fluidic concentration and the fluidic flowrate. With a temperature thermistor integrated on the same micro-machined thermal sensing chip, the disclosed device will be able to provide the key processing parameters for the fluidic applications.

The design and structure of a fluidic concentration metering device with a full dynamic range utilizing micro-machined thermal time-of-flight sensing elements is exhibited in this disclosure. With an additional identical sensing chip but packaged at the different locations in the measurement fluidic chamber with a closed conduit, the device can simultaneously measure the fluidic concentration and the fluidic flowrate. With a temperature thermistor integrated on the same micro-machined thermal sensing chip, the disclosed device will be able to provide the key processing parameters for the fluidic applications.

The apparatus for measuring performance of a suspension for cooling a computer processing unit is a measurement and testing tool allowing for the fabrication of new suspensions, and measuring and testing their short-term and long-term thermal performance in real time on any liquid-cooled computer processing unit. The suspension is prepared in a sample receiving reservoir and pumped across the unit, and then input to an air-cooled heat exchanger for recirculation back to the sample receiving reservoir. Temperatures of the working fluid are measured between the sample receiving reservoir and the computer processing unit, between the unit and the heat exchanger, and after output from the heat exchanger. Pressure differentials of the working fluid is measured across the computer processing unit and across the heat exchanger.

The apparatus for measuring performance of a suspension for cooling a computer processing unit is a measurement and testing tool allowing for the fabrication of new suspensions, and measuring and testing their short-term and long-term thermal performance in real time on any liquid-cooled computer processing unit. The suspension is prepared in a sample receiving reservoir and pumped across the unit, and then input to an air-cooled heat exchanger for recirculation back to the sample receiving reservoir. Temperatures of the working fluid are measured between the sample receiving reservoir and the computer processing unit, between the unit and the heat exchanger, and after output from the heat exchanger. Pressure differentials of the working fluid is measured across the computer processing unit and across the heat exchanger.

A thickness analyzer unit for determining a thickness of a layer includes a temperature change device, a temperature sensor, a memory, and a controller. The temperature change device is configured to induce a temperature change of the layer from a first temperature value to a second temperature value. The temperature sensor is configured to generate first temperature data corresponding to the first temperature value and second temperature data corresponding to the second temperature value. The memory is configured to store the first and second temperature values, a thermal conductivity value, a specific thermal capacity value, and a density value. The controller is configured (i) to determine a time constant value of the layer based on the first and second temperature values, and (ii) to determine the thickness of the layer based on the time constant value, the thermal conductivity value, the specific thermal capacity value, and the density value.

A thickness analyzer unit for determining a thickness of a layer includes a temperature change device, a temperature sensor, a memory, and a controller. The temperature change device is configured to induce a temperature change of the layer from a first temperature value to a second temperature value. The temperature sensor is configured to generate first temperature data corresponding to the first temperature value and second temperature data corresponding to the second temperature value. The memory is configured to store the first and second temperature values, a thermal conductivity value, a specific thermal capacity value, and a density value. The controller is configured (i) to determine a time constant value of the layer based on the first and second temperature values, and (ii) to determine the thickness of the layer based on the time constant value, the thermal conductivity value, the specific thermal capacity value, and the density value.

An internal defect detection system for a three-dimensional additive manufacturing device which performs additive molding by emitting a laser beam to a powder bed is provided. This system specifies a candidate position of an internal defect on the basis of a change amount of a local temperature measured in an irradiated part of a powder bed irradiated by a laser beam. The system calculates a cooling speed at the candidate position on the basis of a temperature distribution and determines whether an internal defect exists on the basis of the cooling speed.

An internal defect detection system for a three-dimensional additive manufacturing device which performs additive molding by emitting a laser beam to a powder bed is provided. This system specifies a candidate position of an internal defect on the basis of a change amount of a local temperature measured in an irradiated part of a powder bed irradiated by a laser beam. The system calculates a cooling speed at the candidate position on the basis of a temperature distribution and determines whether an internal defect exists on the basis of the cooling speed.

A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.