G01N29/14

Computing progressive failure in materials and structures by integration of digital image correlation with acoustic emission monitoring data

An inventive approach is disclosed to integrate Digital Image Correlation (DIC) with the Acoustic Emission method that may be used for structural health monitoring and assessment of critical structural components in civil, mechanical, and aerospace industries. The inventive approach relies on passively recording acoustic emission across the specimen being tested and activating the DIC cameras automatically to measure deformation on the specimen's surface. The resulting acousto-optic system can be used to determine damage initiation, progressive damage development, identify critical regions and make lifetime predictions of the tested specimen.

Computing progressive failure in materials and structures by integration of digital image correlation with acoustic emission monitoring data

An inventive approach is disclosed to integrate Digital Image Correlation (DIC) with the Acoustic Emission method that may be used for structural health monitoring and assessment of critical structural components in civil, mechanical, and aerospace industries. The inventive approach relies on passively recording acoustic emission across the specimen being tested and activating the DIC cameras automatically to measure deformation on the specimen's surface. The resulting acousto-optic system can be used to determine damage initiation, progressive damage development, identify critical regions and make lifetime predictions of the tested specimen.

SYSTEM FOR AUDIBLY DETECTING PRECURSORS OF MATERIAL FRACTURE FOR A SPECIMEN UNDER TEST
20230014054 · 2023-01-19 ·

A system for determining a trigger amplitude indicating a precursor to a material fracture in a specimen under test includes a microphone converting acoustic emission emitted by the specimen under test into electrical signals. A load is exerted upon the specimen under test and the acoustic emission are emitted when the load causes the specimen under test to undergo deformation prior to the material fracture. A control module is in electrical communication with the microphone and executes instructions to monitor the electrical signals generated by the microphone and filter the electrical signals generated by the microphone. The control module converts the electrical signals generated by the microphone into individual frequency components based on a fast Fourier Transform (FFT). The individual frequency components each include a peak intensity. The control module determines the trigger amplitude based on the peak intensity of the individual frequency components of the FFT.

SYSTEM FOR AUDIBLY DETECTING PRECURSORS OF MATERIAL FRACTURE FOR A SPECIMEN UNDER TEST
20230014054 · 2023-01-19 ·

A system for determining a trigger amplitude indicating a precursor to a material fracture in a specimen under test includes a microphone converting acoustic emission emitted by the specimen under test into electrical signals. A load is exerted upon the specimen under test and the acoustic emission are emitted when the load causes the specimen under test to undergo deformation prior to the material fracture. A control module is in electrical communication with the microphone and executes instructions to monitor the electrical signals generated by the microphone and filter the electrical signals generated by the microphone. The control module converts the electrical signals generated by the microphone into individual frequency components based on a fast Fourier Transform (FFT). The individual frequency components each include a peak intensity. The control module determines the trigger amplitude based on the peak intensity of the individual frequency components of the FFT.

Testing system, crack noise monitoring device and method for monitoring crack noise

A testing system includes a testing apparatus and a crack noise monitoring device. The testing apparatus includes a testing stage and an element pickup module for pressing a semiconductor element on the testing stage. The crack noise monitoring device includes a database unit, a sound conduction set, a voiceprint generation unit and a processing unit. The database unit has a first voiceprint pattern. The sound conduction set is connected to the voiceprint generation unit and the testing apparatus for transmitting a sound wave from the semiconductor element to the voiceprint generation unit. The voiceprint generation unit receives and converts the sound wave into a second voiceprint pattern. The processing unit is electrically connected to the voiceprint generating unit and the database unit for determining whether the first voiceprint pattern is identical to the second voiceprint pattern.

Testing system, crack noise monitoring device and method for monitoring crack noise

A testing system includes a testing apparatus and a crack noise monitoring device. The testing apparatus includes a testing stage and an element pickup module for pressing a semiconductor element on the testing stage. The crack noise monitoring device includes a database unit, a sound conduction set, a voiceprint generation unit and a processing unit. The database unit has a first voiceprint pattern. The sound conduction set is connected to the voiceprint generation unit and the testing apparatus for transmitting a sound wave from the semiconductor element to the voiceprint generation unit. The voiceprint generation unit receives and converts the sound wave into a second voiceprint pattern. The processing unit is electrically connected to the voiceprint generating unit and the database unit for determining whether the first voiceprint pattern is identical to the second voiceprint pattern.

AUTOMATIC MECHANICAL SYSTEMS DIAGNOSIS
20230213486 · 2023-07-06 ·

A method for automatic diagnosis of a mechanical system of a group of mechanical systems sharing mechanical characteristics includes obtaining data relating to a vibration. The vibration-related data is acquired by a portable communications device configured to communicate with a remote processor. The processor automatically diagnoses the mechanical system by applying a relationship to the obtained vibration-related data. The relationship is based on sets of vibration-related data previously obtained from the mechanical systems. Each set of vibration-related data relates to vibrations of a mechanical system. The relationship is further based on sets of operation data previously obtained for mechanical systems of the group. Each set of operation data indicates a previous state of operation of a mechanical system. Each of the previous states of operation is associated with at least one of the previously obtained sets of vibration-related data.

Implant evaluation using acoustic emissions

The present disclosure provides methods of identifying a loosened joint implant by analyzing acoustic emissions from the implant. The present disclosure further provides apparatuses for measuring acoustic data and analyzing acoustic emissions from a joint implant.

Implant evaluation using acoustic emissions

The present disclosure provides methods of identifying a loosened joint implant by analyzing acoustic emissions from the implant. The present disclosure further provides apparatuses for measuring acoustic data and analyzing acoustic emissions from a joint implant.

APPARATUS AND METHOD FOR INSPECTING ELECTROSTATIC CHUCK FOR SUBSTRATE PROCESSING
20230213483 · 2023-07-06 · ·

The apparatus for inspecting the electrostatic chuck for substrate processing includes the electrostatic chuck including a ceramic layer and an electrode layer coupled to an inside of the ceramic layer, an ultrasonic sensor unit disposed on the electrostatic chuck, allowing an ultrasonic wave to be incident into the electrostatic chuck, and converting a reflected signal reflected through the electrostatic chuck into an ultrasonic voltage signal, and an ultrasonic inspection unit to divide the ceramic layer and the electrode layer, based on a size value of the ultrasonic voltage signal.