A conductor path structure has a damping device for an oscillation-damped and/or vibration-damped (electronic, electromechanical, micromechanical) component. The conductor path structure has a first base body made of a carrier material including a connection area for receiving the component. The connection area is arranged separated from an area of the first base body surrounding it and is arranged oscillation-damped and/or vibration damped and co-acting with an intrinsic damping device of the conductor path structure. The conductor path structure includes a second base body arranged at a distance under the first base body, wherein above the second base body of the conductor path structure at least one adhesive layer of a damping material is provided. The intrinsic damping device is formed by said at least one adhesive layer arranged between the connection area of the first base body and the area of the second base body arranged below the connection area.

An unmanned aircraft includes a circuit board with an inertia sensor, and a weight block configured to have a flat surface and a recess formed on the flat surface, and a housing assembly configured to form an inner chamber to accommodate the circuit board and the weight block. The circuit board is embedded in the recess by fixedly bonding to the flat surface through adhesion.

Accelerometer including a decoupling structure for fixing the accelerometer on a package and a MEMS sensor chip for measuring an acceleration. The chip is supported by the decoupling structure and includes a sensor wafer layer of a semiconductor material. The decoupling structure forms a bottom portion for fixing the decoupling structure on the package and a top portion fixed to the sensor wafer layer so that the chip is arranged above the decoupling structure. A width of the top portion in a planar direction is smaller than a width of the bottom portion and/or the sensor wafer layer in the planar direction. The decoupling structure is made of the same semiconductor material as the sensor wafer layer. The centre point of the top portion is arranged in a central region of the bottom portion. The chip includes a hermetically closed cavity which includes a seismic mass of the chip.

A conductor path structure has a damping device for an oscillation-damped and/or vibration-damped (electronic, electromechanical, micromechanical) component. The conductor path structure has a first base body made of a carrier material including a connection area for receiving the component. The connection area is arranged separated from an area of the first base body surrounding it and is arranged oscillation-damped and/or vibration damped and co-acting with an intrinsic damping device of the conductor path structure. The conductor path structure includes a second base body arranged at a distance under the first base body, wherein above the second base body of the conductor path structure at least one adhesive layer of a damping material is provided. The intrinsic damping device is formed by said at least one adhesive layer arranged between the connection area of the first base body and the area of the second base body arranged below the connection area.

As the potential applications of unmanned aerial vehicles (UAVs) are growing, more sensors are installed on-board. One of the most important on-board equipments is Inertial Measurement Unit (IMU). Mechanical vibration of the IMU, which greatly hinders the accuracy of its, becomes an increasingly important issue. In this specification, an anti-vibration framework on IMU is provided. A design process of an anti-vibration system of the IMU will be shown and described.

An inertia measurement unit including a housing assembly, a weight block assembly, a circuit board, and a signal line. The housing assembly includes a cavity and a first opening in communication with the cavity. The weight block assembly is arranged in the cavity of the housing assembly. The weight block assembly includes an inner chamber and a second opening in communication with the inner chamber. The circuit board is arranged in the inner chamber of the weight block assembly. The signal line is coupled to a first edge of the circuit board and extends out of the weight block assembly through the second opening and out of the housing assembly through the first opening. At least one of the first opening or the second opening is located proximal to a second edge of the circuit board that is different from the first edge of the circuit board.

A shock-isolated mounting device and a method and system are provided. For example, the shock-isolated mounting device includes an enclosure configured to support the mounting device, at least one damper attached between the mounting device and the enclosure, and a thermally-conductive element disposed on a surface of the mounting device and configured to thermally couple the mounting device to the enclosure. The thermally-conductive element facilitates the dissipation of heat generated by electronic components mounted onto the shock-isolated mounting device.

There is provided a resonant sensor comprising: a substrate; a proof mass suspended from the substrate to allow for relative movement between the proof mass and the substrate along at least one sensitive axis; at least one resonant element coupled to the proof mass; an electrode assembly adjacent to the at least one resonant element; drive and sense circuitry connected to the electrode assembly configured to drive the electrode assembly to cause the at least one resonant element to resonate, wherein a measure of acceleration of the proof mass can be determined from changes in the resonant behavior of the at least one resonant element; at least one substrate electrode on the substrate, adjacent to the proof mass; and electric circuitry connected to the substrate electrode configured to apply a voltage to the substrate electrode providing an electrostatic force on the proof mass. The substrate electrode may be used to provide a number of different functions.

The present disclosure relates to an inertia measurement module for an unmanned aircraft, which comprises a housing assembly, a sensing assembly and a vibration damper. The vibration damper comprises a first vibration-attenuation cushion; and the sensing assembly comprises a first circuit board, a second circuit board and a flexible signal line for connecting the first circuit board and the second circuit board. An inertia sensor is fixed on the second circuit board, and the first circuit board is fixed on the housing assembly. The inertia measurement module further comprises a weight block, and the second circuit board, the weight block, the first vibration-attenuation cushion and the first circuit board are bonded together. The present disclosure greatly reduces the influence of the operational vibration frequency of the unmanned aircraft on the inertia sensor and improves the measurement stability of the inertia sensor.

A conductor path structure has a damping device for an oscillation-damped and/or vibration-damped (electronic, electromechanical, micromechanical) component. The conductor path structure has a first base body made of a carrier material including a connection area for receiving the component. The connection area is arranged separated from an area of the first base body surrounding it and is arranged oscillation-damped and/or vibration damped and co-acting with an intrinsic damping device of the conductor path structure. The conductor path structure includes a second base body arranged at a distance under the first base body, wherein above the second base body of the conductor path structure at least one adhesive layer of a damping material is provided. The intrinsic damping device is formed by said at least one adhesive layer arranged between the connection area of the first base body and the area of the second base body arranged below the connection area.