An inertial measurement unit includes an angular velocity sensor and an acceleration sensor that output inertial information, a storage portion that stores a plurality of correction parameters related to a range of values of the inertial information, a parameter control portion that selects a selection correction parameter from the plurality of correction parameters, and a correction calculation portion that corrects the inertial information using the selection correction parameter.

A system and method for measuring multiple velocity components with a single wire, by alternating current through the wire at a sufficiently high frequency, where the first current allows measurement of a first velocity component, and the second current allows measurement of a second velocity component. The resolution of the measurements can be adjusted by altering the frequency at which the current is alternated.

A temperature characteristic of an inertial sensor is simply acquired. An information processing apparatus includes: an inertia measuring unit (110, IMU); an information processing unit (120) that performs arithmetic processing that is accompanied by a change in temperature according to a load during operation; a temperature detection unit (130) that detects temperature; a temperature control unit (143) that controls the temperature detected by the temperature detection unit by applying the load to the information processing unit to cause the information processing unit to operate; and a data acquisition unit (145) that acquires temperature characteristic data indicating a relationship between a correction value and the temperature, the correction value being used to correct a measurement value of the inertia measuring unit.

The disclosure describes a magnetic circuit assembly that includes a magnet assembly and an excitation ring. The magnet assembly defines a central axis and includes a pole piece and a magnet underlying the pole piece. The excitation ring includes a base and an outer ring positioned around the magnet assembly. The base includes a platform layer underlying the magnet, an upper base layer underlying the platform layer, and a lower base layer underlying the upper base layer. The outer ring overlies the upper base layer and is configured to couple to an outer radial portion of a proof mass assembly. The platform layer and lower base layer are made from high coefficient of thermal expansion (CTE) materials, while the upper base layer and outer ring are made from low CTE materials. Each relatively high CTE material has a higher CTE than each relatively low CTE material.

An inertial measurement unit includes an angular velocity sensor and an acceleration sensor that output inertial information, a storage portion that stores a plurality of correction parameters related to a range of values of the inertial information, a parameter control portion that selects a selection correction parameter from the plurality of correction parameters, and a correction calculation portion that corrects the inertial information using the selection correction parameter.

Accelerometer including a decoupling structure for fixing the accelerometer on a package and a MEMS sensor chip for measuring an acceleration. The chip is supported by the decoupling structure and includes a sensor wafer layer of a semiconductor material. The decoupling structure forms a bottom portion for fixing the decoupling structure on the package and a top portion fixed to the sensor wafer layer so that the chip is arranged above the decoupling structure. A width of the top portion in a planar direction is smaller than a width of the bottom portion and/or the sensor wafer layer in the planar direction. The decoupling structure is made of the same semiconductor material as the sensor wafer layer. The centre point of the top portion is arranged in a central region of the bottom portion. The chip includes a hermetically closed cavity which includes a seismic mass of the chip.

An inertial measurement unit (IMU) device includes a circuit board assembly including a rigid circuit board and a flexible circuit board, an IMU sensor disposed on the rigid circuit board, and a heat preservation system. The IMU sensor is electrically connected to an external element through the flexible circuit board to transmit at least one of a signal or power between the IMU sensor and the external element. The heat preservation system includes a heat source, a heat preservation body with a receiving space to accommodate the IMU sensor, and a heat conductive member configured to transfer heat from the heat source to the IMU sensor to maintain the IMU sensor at a preset temperature. The heat conductive member includes an electrically insulating and thermally conductive silicone.

Reducing a sensitivity of an electromechanical sensor is presented herein. The electromechanical sensor comprises a sensitivity with respect to a variation of a mechanical-to-electrical gain of a sense element of the electromechanical sensor; and a voltage-to-voltage converter component that minimizes the sensitivity by coupling, via a defined feedback capacitance, a positive feedback voltage to a sense electrode of the sense element—the sense element electrically coupled to an input of the voltage-to-voltage converter component. In one example, the voltage-to-voltage converter component minimizes the sensitivity by maintaining, via the defined feedback capacitance, a constant charge at the sense electrode. In another example, the electromechanical sensor comprises a capacitive sense element comprising a first node comprising the sense electrode. Further, a bias voltage component can apply a bias voltage to a second node of the electromechanical sensor. In yet another example, the electromechanical sensor comprises a piezoelectric sense element.

A method for inertial sensor error modeling and compensation comprises obtaining multiple bias drift datasets for an elapsed time period for one or more gyroscopes; generating a 3D bias drift data plot using the multiple bias drift datasets; generating a partial bias drift data image based on the 3D bias drift data plot; and inputting the partial bias drift data image into a machine learning algorithm to predict how bias drift evolves over time for the gyroscopes. The machine learning algorithm uses the partial bias drift data image, the elapsed time period, and temperature history to compute a predicted bias over temperature with respect to time, to thereby predict bias drift data for a future time period for the gyroscopes. The machine learning algorithm outputs a completed bias drift image that represents drift data from the elapsed time period and the predicted bias drift data for the future time period.

An inertial measurement unit (IMU) device includes a circuit board assembly including a rigid circuit board and a flexible circuit board, an IMU sensor disposed on the rigid circuit board, and a heat preservation system. The IMU sensor is electrically connected to an external element through the flexible circuit board to transmit at least one of a signal or power between the IMU sensor and the external element. The heat preservation system includes a heat source, a heat preservation body with a receiving space to accommodate the IMU sensor, and a heat conductive member configured to transfer heat from the heat source to the IMU sensor to maintain the IMU sensor at a preset temperature. The heat conductive member includes an electrically insulating and thermally conductive silicone.