Patent classifications
G01Q30/20
VIBRATION COMPONENT MEASUREMENT DEVICE, KELVIN PROBE FORCE MICROSCOPE, AND VIBRATION COMPONENT MEASUREMENT METHOD
In order to increase the order of a frequency of an AC signal to be applied between a vibration section and a sample to an order at substantially the same level as the order of a vibration frequency of the vibration section in measuring a vibration component of the vibration control section, a vibration component measuring device (2) includes: a vibration section (4); a first AC signal generator (20) configured to generate a first AC signal; a second AC signal generator (44) configured to generate a second AC signal having a frequency which is (a) more than one time and less than two times or (b) more than two times and less than three times as high as a frequency of the first AC signal; a signal applying section (14, 56) configured to apply the second AC signal between the vibration section and a sample (X); a vibration control section (10) configured to cause the vibration section to vibrate; and a measuring section (16, 18, 20, 22, 42, 44, 50) configured to measure a varying component of vibration of the vibration section, the varying component being varied by an interaction between the vibration section and the sample.
VIBRATION COMPONENT MEASUREMENT DEVICE, KELVIN PROBE FORCE MICROSCOPE, AND VIBRATION COMPONENT MEASUREMENT METHOD
In order to increase the order of a frequency of an AC signal to be applied between a vibration section and a sample to an order at substantially the same level as the order of a vibration frequency of the vibration section in measuring a vibration component of the vibration control section, a vibration component measuring device (2) includes: a vibration section (4); a first AC signal generator (20) configured to generate a first AC signal; a second AC signal generator (44) configured to generate a second AC signal having a frequency which is (a) more than one time and less than two times or (b) more than two times and less than three times as high as a frequency of the first AC signal; a signal applying section (14, 56) configured to apply the second AC signal between the vibration section and a sample (X); a vibration control section (10) configured to cause the vibration section to vibrate; and a measuring section (16, 18, 20, 22, 42, 44, 50) configured to measure a varying component of vibration of the vibration section, the varying component being varied by an interaction between the vibration section and the sample.
SCANNING PROBE MICROSCOPE COMBINED WITH A DEVICE FOR MODIFYING THE SURFACE OF AN OBJECT
The microscope for monitoring objects after nano-cutting and for investigating structures of macro- and micro-carriers under low temperature comprises a punch having a cutting edge, drives driving the punch along two axes, a platform rotatable in a plane, a piezo-scanner for recording a sample image along three axes, a holder with a carrier of the sample, and a probe unit to which a probe is fastened. The piezo-scanner is fastened to the platform, the punch is able to interact with the sample, and the probe unit is mounted on the platform so as to be movable along one of the axes. The assembly includes a module for mechanical action on the cutting edge of the punch to modify the cutting surface, which module is fastened to the same platform to which the piezo-scanner with the object carrier and the probe unit are fastened.
SCANNING PROBE MICROSCOPE COMBINED WITH A DEVICE FOR MODIFYING THE SURFACE OF AN OBJECT
The microscope for monitoring objects after nano-cutting and for investigating structures of macro- and micro-carriers under low temperature comprises a punch having a cutting edge, drives driving the punch along two axes, a platform rotatable in a plane, a piezo-scanner for recording a sample image along three axes, a holder with a carrier of the sample, and a probe unit to which a probe is fastened. The piezo-scanner is fastened to the platform, the punch is able to interact with the sample, and the probe unit is mounted on the platform so as to be movable along one of the axes. The assembly includes a module for mechanical action on the cutting edge of the punch to modify the cutting surface, which module is fastened to the same platform to which the piezo-scanner with the object carrier and the probe unit are fastened.
SCANNING PROBE MICROSCOPE AND SAMPLE HOLDER THEREFOR
This sample holder for a scanning probe microscope is constituted of (1) a container that retains a liquid and (2) a flat-plate-shaped upper cover that covers an upper opening of the container and that has a narrow slit above the position where a sample is placed. In the upper cover, the slit has a slit width with which a thin film of the liquid is formed over the upper surface of the sample when the liquid fills the space between the container and the upper cover. The thin film of the liquid has a film thickness smaller than the distance between the upper surface of the sample and the upper cover.
SCANNING PROBE MICROSCOPE AND SAMPLE HOLDER THEREFOR
This sample holder for a scanning probe microscope is constituted of (1) a container that retains a liquid and (2) a flat-plate-shaped upper cover that covers an upper opening of the container and that has a narrow slit above the position where a sample is placed. In the upper cover, the slit has a slit width with which a thin film of the liquid is formed over the upper surface of the sample when the liquid fills the space between the container and the upper cover. The thin film of the liquid has a film thickness smaller than the distance between the upper surface of the sample and the upper cover.
Scanning probe microscope with a sample holder fed with electromagnetic wave signals
A scanning probe microscope including a holder having at least one electric port, wherein the holder is configured to support a sample to be imaged. The scanning probe microscope further includes a probe and an actuator configured to move at least one of the holder and the probe up to three directions. The scanning probe microscope further includes a reflectometer configured to measure reflection and/or transmission coefficients at each of the at least one electric ports of the holder by feeding each of the at least one electric ports of the holder with electromagnetic wave signals.
Scanning probe microscope with a sample holder fed with electromagnetic wave signals
A scanning probe microscope including a holder having at least one electric port, wherein the holder is configured to support a sample to be imaged. The scanning probe microscope further includes a probe and an actuator configured to move at least one of the holder and the probe up to three directions. The scanning probe microscope further includes a reflectometer configured to measure reflection and/or transmission coefficients at each of the at least one electric ports of the holder by feeding each of the at least one electric ports of the holder with electromagnetic wave signals.
Fabrication of a malleable lamella for correlative atomic-resolution tomographic analyses
A method of forming a sample and performing correlative S/TEM and APM analysis is provided wherein a sample containing a region of interest is cut from a bulk of sample material and formed into an ultra-thin lamella. The lamella is then analyzed with an S/TEM to form an image. The lamella sample and mount may then go through a cleaning process to remove any contamination. The lamella containing the ROI is then embedded within a selected material and is formed into a needle-shaped sample. The needle-shaped sample is then analyzed with the APM and the resulting data is merged and correlated with the S/TEM data.
Fabrication of a malleable lamella for correlative atomic-resolution tomographic analyses
A method of forming a sample and performing correlative S/TEM and APM analysis is provided wherein a sample containing a region of interest is cut from a bulk of sample material and formed into an ultra-thin lamella. The lamella is then analyzed with an S/TEM to form an image. The lamella sample and mount may then go through a cleaning process to remove any contamination. The lamella containing the ROI is then embedded within a selected material and is formed into a needle-shaped sample. The needle-shaped sample is then analyzed with the APM and the resulting data is merged and correlated with the S/TEM data.