An atomic force microscopy tool (AFM) configured for receiving a plate including a coordinate reference pattern on the plate, for providing a position reference for the AFM: and a device for qualifying a coordinate reference pattern in the AFM, comprising a fixed reference frame, a pattern encoder for reading the reference pattern, an actuation stage for relatively moving the plate and the pattern encoder parallel to the plate, a displacement measurement system for measuring a displacement of the plate or pattern encoder relative to the fixed reference frame, and a controller for controlling the actuation stage, the encoder, and the measurement system, arranged to identify imperfections in the coordinate reference pattern and their locations by controlling the displacement measurement system; and arranged for storing each imperfection coupled to the location determined.

An atomic force microscopy tool (AFM) configured for receiving a plate including a coordinate reference pattern on the plate, for providing a position reference for the AFM: and a device for qualifying a coordinate reference pattern in the AFM, comprising a fixed reference frame, a pattern encoder for reading the reference pattern, an actuation stage for relatively moving the plate and the pattern encoder parallel to the plate, a displacement measurement system for measuring a displacement of the plate or pattern encoder relative to the fixed reference frame, and a controller for controlling the actuation stage, the encoder, and the measurement system, arranged to identify imperfections in the coordinate reference pattern and their locations by controlling the displacement measurement system; and arranged for storing each imperfection coupled to the location determined.

A method and system for calibrating force (F12) in a dynamic mode atomic force microscope (AFM). An AFM tip (11) is disposed on a first cantilever (12). The first cantilever (12) is actuated to oscillate the AFM tip (11) in a dynamic mode. A first sensor (16) is configured to measure a first parameter (A1) of the oscillating AFM tip (11). A second sensor (26) is configured to measure a second parameter (A2) of a resilient element (22). The oscillating AFM tip (11) is moved in proximity to the resilient element (22) while measuring the first parameter (A1) of the AFM tip (11) and the second parameter (A2) of the resilient element (22). A force (F12) between the oscillating AFM tip (11) and the resilient element (22) is calculated based on the measured second parameter (A2) and a calibrated force constant (K2) of the resilient element (22).

A method and system for calibrating force (F12) in a dynamic mode atomic force microscope (AFM). An AFM tip (11) is disposed on a first cantilever (12). The first cantilever (12) is actuated to oscillate the AFM tip (11) in a dynamic mode. A first sensor (16) is configured to measure a first parameter (A1) of the oscillating AFM tip (11). A second sensor (26) is configured to measure a second parameter (A2) of a resilient element (22). The oscillating AFM tip (11) is moved in proximity to the resilient element (22) while measuring the first parameter (A1) of the AFM tip (11) and the second parameter (A2) of the resilient element (22). A force (F12) between the oscillating AFM tip (11) and the resilient element (22) is calculated based on the measured second parameter (A2) and a calibrated force constant (K2) of the resilient element (22).

A method for automatically calibrating a feedback system, comprising: receiving one or more input parameters associated with a feedback system; applying the one or more input parameters to a model of the feedback system; deriving one or more feedback parameters for the feedback system from the model by: optimizing the model for the feedback parameters, and applying a noise characteristic of the feedback system to the model; and automatically tuning the feedback system using the one or more derived feedback parameters.

A method for automatically calibrating a feedback system, comprising: receiving one or more input parameters associated with a feedback system; applying the one or more input parameters to a model of the feedback system; deriving one or more feedback parameters for the feedback system from the model by: optimizing the model for the feedback parameters, and applying a noise characteristic of the feedback system to the model; and automatically tuning the feedback system using the one or more derived feedback parameters.

A standard sample (72) that is a nanometer standard prototype, having a standard length that serves as a length reference, includes a SiC layer in which a step-terrace structure is formed. The height of a step, used as the standard length, is equal to the height of a full unit that corresponds to one periodic of a stack of SiC molecules in a stack direction or equal to the height of a half unit that corresponds to one-half periodic of the stack of SiC molecules in the stack direction. In a microscope such as an STM to be measured in a high-temperature vacuum environment, heating in a vacuum furnace enables surface reconstruction with ordered atomic arrangement, while removing a natural oxide film from the surface, so that accuracy of the height of the step is not degraded. Accordingly, a standard sample usable under a high-temperature vacuum is achieved.

A standard sample (72) that is a nanometer standard prototype, having a standard length that serves as a length reference, includes a SiC layer in which a step-terrace structure is formed. The height of a step, used as the standard length, is equal to the height of a full unit that corresponds to one periodic of a stack of SiC molecules in a stack direction or equal to the height of a half unit that corresponds to one-half periodic of the stack of SiC molecules in the stack direction. In a microscope such as an STM to be measured in a high-temperature vacuum environment, heating in a vacuum furnace enables surface reconstruction with ordered atomic arrangement, while removing a natural oxide film from the surface, so that accuracy of the height of the step is not degraded. Accordingly, a standard sample usable under a high-temperature vacuum is achieved.

Methods for calibration of non-contact velocity measurements and systems for implementing the same are described. Generally, the method comprises inducing a shock wave into a sample at a stress intensity that varies across the sample's elastic limit, which corresponds to the elastic-plastic state transition of the sample. That transition state may be at the sample's Hugoniot elastic limit. The velocity of the sample is measured using a non-contact velocity measurement instrument such as a velocimeter. The measurement may be compared to a predicted velocity or a velocity measurement made by another system to determine calibration parameters.

Methods for calibration of non-contact velocity measurements and systems for implementing the same are described. Generally, the method comprises inducing a shock wave into a sample at a stress intensity that varies across the sample's elastic limit, which corresponds to the elastic-plastic state transition of the sample. That transition state may be at the sample's Hugoniot elastic limit. The velocity of the sample is measured using a non-contact velocity measurement instrument such as a velocimeter. The measurement may be compared to a predicted velocity or a velocity measurement made by another system to determine calibration parameters.