A thermal probe and method for generating a thermal map (M) of a sample interface (1). A scanning thermal microscope (100) is provided having at least one or more probe tips (11,12). The probe tips (11,12) are scanned at a near-field distance (D1) over the sample interface (1). Heat flux data (H) is recorded as a function of a relative position (X,Y) of the probe tip (11) over the sample interface (1). The thermal map (M) is calculated from the recorded heat flux data (H) based on a spatially resolved heat flux profile (P) of the probe tip (11) at the sample interface (1). The heat flux profile (P) has a local maximum at a lateral distance (R) across the sample interface (1) with respect to an apex (11a) of the probe tip (11).

A probe for atomic force microscopy comprises a tip for atomic force microscopy oriented in a direction referred to as the longitudinal direction and protrudes from an edge of a substrate in the longitudinal direction, wherein the tip is arranged at one end of a shuttle attached to the substrate at least via a first and via a second structure, which structures are referred to as support structures, at least the first support structure being a flexible structure, extending in a direction referred to as the transverse direction, perpendicular to the longitudinal direction and anchored to the substrate by at least one mechanical linkage in the transverse direction, the support structures being suitable for allowing the shuttle to be displaced in the longitudinal direction. An atomic force microscope comprising at least one such probe is also provided.

Thermal probe (10) for a scanning thermal microscope (100), use, and process of manufacturing. The thermal probe (10) comprises a single-material (M1) thermal conducting body (12) consisting of a probe frame (14) ending in a probe tip (11). A bi-material (M1,M2) cantilever strip (13) is connected to the probe frame (14) in thermal communication with the probe tip (11). The cantilever strip (13) in unbended state lies in-plane (X,Z) with the probe tip (11). The cantilever strip (13) comprises layers of material (M1,M2) having different coefficients of thermal expansion configured to bend the cantilever strip (13) with respect to the single-material thermal conducting body (12) as a function of the heat exchange (H) between the probe tip (11) and the microscopic structure (2) for measuring heat exchange (H) with a sample interface (1) by means of measuring the bending of the cantilever strip (13).

Thermal probe (10) for a scanning thermal microscope (100), use, and process of manufacturing. The thermal probe (10) comprises a single-material (M1) thermal conducting body (12) consisting of a probe frame (14) ending in a probe tip (11). A bi-material (M1,M2) cantilever strip (13) is connected to the probe frame (14) in thermal communication with the probe tip (11). The cantilever strip (13) in unbended state lies in-plane (X,Z) with the probe tip (11). The cantilever strip (13) comprises layers of material (M1,M2) having different coefficients of thermal expansion configured to bend the cantilever strip (13) with respect to the single-material thermal conducting body (12) as a function of the heat exchange (H) between the probe tip (11) and the microscopic structure (2) for measuring heat exchange (H) with a sample interface (1) by means of measuring the bending of the cantilever strip (13).

A device and methods for use thereof in low-temperature thermal scanning microscopy, providing non-contact, non-invasive localized temperature and thermal conductivity measurements in nanometer scale ranges with a temperature resolution in the micro-Kelvin order. A superconductive cap mounted on the tip of an elongated support probe is electrically-connected to superconductive leads for carrying electrical current through the cap. The critical superconducting current of the leads is configured to be greater than the critical current supported by the cap, and the cap's critical current is configured to be a function of its temperature. Thus, the temperature of the cap is measured by measuring its critical superconducting current. In a related embodiment, driving a current greater than the critical current of the cap quenches the cap's superconductivity, and permits the cap to dissipate resistive heat into the sample being scanned. Scanning of the sample in this mode thus images its thermal conductivity patterns.

A device and methods for use thereof in low-temperature thermal scanning microscopy, providing non-contact, non-invasive localized temperature and thermal conductivity measurements in nanometer scale ranges with a temperature resolution in the micro-Kelvin order. A superconductive cap mounted on the tip of an elongated support probe is electrically-connected to superconductive leads for carrying electrical current through the cap. The critical superconducting current of the leads is configured to be greater than the critical current supported by the cap, and the cap's critical current is configured to be a function of its temperature. Thus, the temperature of the cap is measured by measuring its critical superconducting current. In a related embodiment, driving a current greater than the critical current of the cap quenches the cap's superconductivity, and permits the cap to dissipate resistive heat into the sample being scanned. Scanning of the sample in this mode thus images its thermal conductivity patterns.

A probe device for nanoscale thermal measurements including an insulating lever, a tip protruding from the insulating lever, a microstructured layer of Niobium Nitride (NbN) extending over only a part of the tip and covering an apex of the tip and/or covering at least one area adjoining the apex of the tip and/or covering, only partly, the insulating lever and at least two conductive leads extending from the insulating lever to the microstructured NbN layer.