A monitor system for one or more surge protection devices may include a hub configured for wireless communication with one or more remote devices, or a sensor configured to detect an end-of-life state of a surge protection device (SPD). The sensor may include a transmitter configured to wirelessly transmit a sensor signal to the hub to indicate the end-of-life state of the SPD. The hub may be configured to transmit to one or more of a remote server or a mobile device a hub signal corresponding to the end-of-life state.

A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.

Disclosed is a probe card for testing a wafer. The probe card includes a substrate and a block including an insulation portion and a conducting portion disposed on the insulation portion. Here, the insulation portion includes a via and a probe pin which comes into contact with an object to be tested. The conducting portion includes a contact point electrically connected to the substrate and a conducting pattern passing through the via and electrically connecting the contact point to the probe pin. A pitch between a plurality of such probe pins is smaller than a pitch between a plurality of such contact points. The block includes a plurality of unit blocks. The plurality of unit blocks each include the insulation portion and the conducting portion, and at least parts of the insulation portions of the unit blocks are arranged while being spaced apart from each other.

A testing socket includes a metal block, an assembly block, an analog ground probe pin and a digital ground probe pin. The metal block is formed with a concave portion and used to connect to an independent main ground. The assembly block is electrically isolated from the metal block, and detachably embedded in the recess, so that the metal block and the assembly block are assembled together to be a probe holder. The digital grounding probe is inserted in the metal block, electrically connected to the independent main ground through the metal block. The digital ground probe pin can be electrically connected to a device to be tested (DUT) and the independent main ground. The analog ground probe pin is inserted in the assembly block, and electrically connected to the DUT and another independent main ground.

A test and measurement system can include a data store configured to store augmentation settings for dynamically augmenting a physical testing environment and a computing device coupled to the data store. The computing device can be configured to receive an input feed from the physical testing environment, create an augmentation image based on the augmentation settings and the input feed, and output the augmented image to be overlaid on the physical testing environment to augment a user's view of the physical testing environment.

A signal transmission circuit board includes a main body and a first connecting unit connected with the main body. The first connecting unit includes a test pin area and an avoidance area adjacent to the test pin area, and the avoidance area is free of test pins.

A method includes providing a test structure above a tester, wherein the test structure includes a load board including a first and second connectors, a first socket electrically connected to the first and second connectors of the load board, and a second socket electrically isolated from the first connector of the load board and electrically connected to the second connector of the load board. A first and second semiconductor dies are disposed respectively on the first and second sockets. A test signal to the first semiconductor die and the second semiconductor die through the second connector of the load board are simultaneously applied by using the tester. A first signal of the first semiconductor die through the first connector is read by using the tester. Whether the first semiconductor die is disturbed by the second semiconductor die is determined according to the first signal.

A plurality of touch operation areas which are allocated to a plurality of measurement items for a mobile terminal are set in a touch-panel-type operating unit 40. A list of sections of the touch operation areas and a list of measurement item names for each section are displayed on a screen of a display unit 30. A switching button for switching the measurement item which has been invalidated among the measurement items to a valid state is displayed to inform an operator that the measurement item has been invalidated. The measurement results of the measurement item which has been validated are displayed in the sections to inform the operator that the measurement item has been validated.

The probe assembly operates with a circuit board test apparatus and includes a main test probe and a secondary test probes. The probe assembly is capable of moving in X, Y and Z directions relative to a circuit board being tested (UUT). The two test probes are movable linearly relative to each other and rotatable together so as to accurately locate the two probes on selected pins on the UUT, for receiving signals from the selected pins, The received signals are transmitted to a display apparatus.

A capacitive sensor array may comprise a plurality of column sensor electrodes and a plurality of row sensor electrodes. The column sensor electrodes may be capacitively coupled with the row sensor electrodes to form a plurality of unit cells each including an intensity center identifying a location of greatest capacitance sensitivity between a row electrode and a column electrode. An axis of a set of row sensor electrodes may cross at least a portion of each row electrode in the set, and the intensity centers associated with the row electrodes in the set may be staggered on alternating sides of the axis. For each of the plurality of unit cells, a distance between the intensity center of the unit cell and a nearest intensity center of another unit cell at a perimeter of the unit cell may be at least 0.7 times the height of the unit cell.