A monitoring system includes an array of optical sensors disposed within a transformer tank. Each optical sensor is configured to have an optical output that changes in response to a temperature within the transformer tank. An analyzer is coupled to the array of optical sensors. The analyzer is configured to determine a sensed temperature distribution based on the sensed temperature. The sensed temperature distribution is compared to an expected distribution. Exterior contamination of the transformer tank is detected based on the comparison.

A monitoring system includes an array of optical sensors disposed within a transformer tank. Each optical sensor is configured to have an optical output that changes in response to a temperature within the transformer tank. An analyzer is coupled to the array of optical sensors. The analyzer is configured to determine a sensed temperature distribution based on the sensed temperature. The sensed temperature distribution is compared to an expected distribution. Exterior contamination of the transformer tank is detected based on the comparison.

A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.

Disclosed is an intelligent on-line diagnosis method for winding deformation of power transformer. When a transformer is subjected to short-circuit shock or transportation collision, transformer windings may undergo local twisting, swelling or the like under the action of an electric power or mechanical force, which is called winding deformation and will cause a huge hidden danger to the safe operation of the power network. Commonly used diagnosis methods for winding deformation are all off-line diagnosis methods, which have the disadvantages that transformers need to be shut down and highly skilled operators are required. The present invention provide an intelligent on-line diagnosis method for winding deformation on the basis of combination of information entropy and support vector machine. By carrying out feature extraction of current and voltage signals based on permutation entropy and wavelet entropy, integrating the variation of the monitoring indicators of the power transformers in complexity, time-frequency domain and the like and automatically learning the diagnostic logic from fault features through the machine learning algorithm, intelligent diagnosis of winding deformation is realized, thereby reducing labor costs and improving diagnosis efficiency.

Disclosed is an intelligent on-line diagnosis method for winding deformation of power transformer. When a transformer is subjected to short-circuit shock or transportation collision, transformer windings may undergo local twisting, swelling or the like under the action of an electric power or mechanical force, which is called winding deformation and will cause a huge hidden danger to the safe operation of the power network. Commonly used diagnosis methods for winding deformation are all off-line diagnosis methods, which have the disadvantages that transformers need to be shut down and highly skilled operators are required. The present invention provide an intelligent on-line diagnosis method for winding deformation on the basis of combination of information entropy and support vector machine. By carrying out feature extraction of current and voltage signals based on permutation entropy and wavelet entropy, integrating the variation of the monitoring indicators of the power transformers in complexity, time-frequency domain and the like and automatically learning the diagnostic logic from fault features through the machine learning algorithm, intelligent diagnosis of winding deformation is realized, thereby reducing labor costs and improving diagnosis efficiency.

A power supply in a test and measurement device includes a stimulus having an output coupled to an amplifier in which an output signal from the stimulus controls an output level of the amplifier. The stimulus may include a Digital to Analog Converter. A measurement circuit detects the output level of the amplifier. The power supply includes an overpulse generator that can be structured to accept a desired amplifier output level, overdrive the stimulus at a first level for a first time period, and drive the stimulus at a second level for a second time period. The measurement circuit determines when the overpulse generator switches from driving the stimulus at the first level to driving the stimulus at the second level. The time period for driving the stimulus at the second level starts as the actual amplifier output level approaches the desired amplifier output level.

A monitoring system includes an array of optical sensors disposed within a transformer tank. Each optical sensor is configured to have an optical output that changes in response to a temperature within the transformer tank. An analyzer is coupled to the array of optical sensors. The analyzer is configured to determine a sensed temperature distribution based on the sensed temperature. The sensed temperature distribution is compared to an expected distribution. Exterior contamination of the transformer tank is detected based on the comparison.

A monitoring system includes an array of optical sensors disposed within a transformer tank. Each optical sensor is configured to have an optical output that changes in response to a temperature within the transformer tank. An analyzer is coupled to the array of optical sensors. The analyzer is configured to determine a sensed temperature distribution based on the sensed temperature. The sensed temperature distribution is compared to an expected distribution. Exterior contamination of the transformer tank is detected based on the comparison.

A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.

A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.