The overall thermal performance of a building UA.sup.Total can be empirically estimated through a short-duration controlled test. Preferably, the controlled test is performed at night during the winter. A heating source is turned off after the indoor temperature has stabilized. After an extended period, such as 12 hours, the heating source is briefly turned back on, such as for an hour, then turned off. The indoor temperature is allowed to stabilize. The energy consumed within the building during the test period is assumed to equal internal heat gains. Overall thermal performance is estimated by balancing the heat gained with the heat lost during the test period.

A system and method for building energy-related changes evaluation with the aid of a digital computer are provided. Obtained is a total amount of fuel purchased for a building over a set period from which an existing amount of the fuel consumed for space heating is derived. Characteristics including thermal performance and furnace and delivery efficiencies of the building for both existing and proposed equipment are obtained, including remotely controlling a heating source inside the building. The thermal performance and furnace and delivery efficiencies characteristics of the existing and proposed equipment are expressed as interrelated ratios. An amount of fuel to be consumed for space heating is evaluated as a function of the existing amount of the fuel consumed for space heating and the ratios of the existing and proposed equipment.

A system and method for building energy-related changes evaluation with the aid of a digital computer are provided. Obtained is a total amount of fuel purchased for a building over a set period from which an existing amount of the fuel consumed for space heating is derived. Characteristics including thermal performance and furnace and delivery efficiencies of the building for both existing and proposed equipment are obtained, including remotely controlling a heating source inside the building. The thermal performance and furnace and delivery efficiencies characteristics of the existing and proposed equipment are expressed as interrelated ratios. An amount of fuel to be consumed for space heating is evaluated as a function of the existing amount of the fuel consumed for space heating and the ratios of the existing and proposed equipment.

A detector of microwave radiation includes a signal input and a detector output. An absorber element of ohmic conductivity is coupled to said signal input through a first length of superconductor. A variable impedance element, the impedance of which is configured to change as a function of temperature, is coupled to the detector output through a second length of superconductor. The detector also includes a heating input and a heating element coupled to the heating input through a third length of superconductor. The absorber element, the variable impedance element, and the heating element are coupled to each other through superconductor sections of lengths shorter than any of said first, second, and third lengths of superconductor.

A detector of microwave radiation includes a signal input and a detector output. An absorber element of ohmic conductivity is coupled to said signal input through a first length of superconductor. A variable impedance element, the impedance of which is configured to change as a function of temperature, is coupled to the detector output through a second length of superconductor. The detector also includes a heating input and a heating element coupled to the heating input through a third length of superconductor. The absorber element, the variable impedance element, and the heating element are coupled to each other through superconductor sections of lengths shorter than any of said first, second, and third lengths of superconductor.

A coaxial power sensor assembly configured to provide a broadband matched termination utilizing coplanar waveguide topology while simultaneously providing a source of heat energy for a surface mount chip thermistor element to measure applied input power. The coaxial thermal power sensor is comprised of a thin film resistive device on a dielectric substrate and a surface mount chip thermistor element placed in close planar proximity to the resistive device in order to maximize the heat flux via a closely coupled thermal path to the thermistor and alter the bias current through the resistance to be measured. The power sensor is intended to function from DC to 70 GHz, but the same should not be construed as a limitation.

A coaxial power sensor assembly configured to provide a broadband matched termination utilizing coplanar waveguide topology while simultaneously providing a source of heat energy for a surface mount chip thermistor element to measure applied input power. The coaxial thermal power sensor is comprised of a thin film resistive device on a dielectric substrate and a surface mount chip thermistor element placed in close planar proximity to the resistive device in order to maximize the heat flux via a closely coupled thermal path to the thermistor and alter the bias current through the resistance to be measured. The power sensor is intended to function from DC to 70 GHz, but the same should not be construed as a limitation.

Techniques described herein address these and other issues by utilizing two or more sensors to take temperature measurements from which a temperature-differential or instantaneous temperature rate-of-change, can be determined. In turn, this can be used to make a highly accurate model of the relationship between the temperature, temperature-differential, and clock circuitry frequency, to accurately estimate the frequency rate-of-change for frequency correction/compensation.

A semiconductor device is provided which can suppress heating while assigning performances to a plurality of modules whose heat generations are controlled while considering usage conditions of the plurality of modules. The semiconductor device includes a load detection unit that detects operation rates of the plurality of modules, a weighting calculation unit that calculates coefficients of the plurality of modules based on the operation rates of the plurality of modules, and a heat generation control unit that controls power consumptions of the plurality of modules based on the coefficients of the plurality of modules.

A semiconductor device is provided which can suppress heating while assigning performances to a plurality of modules whose heat generations are controlled while considering usage conditions of the plurality of modules. The semiconductor device includes a load detection unit that detects operation rates of the plurality of modules, a weighting calculation unit that calculates coefficients of the plurality of modules based on the operation rates of the plurality of modules, and a heat generation control unit that controls power consumptions of the plurality of modules based on the coefficients of the plurality of modules.