An apparatus and a method for determining a power value of a target in the form of an AC circuit (130; 230; 330) having an AC power source (132; 232; 332). The method involves operating (72) a controllable DC power source (12) to provide DC power to a DC circuit (10; 110; 210; 310) and measuring (73) at least one thermal parameter related to power dissipation of the DC circuit (10; 110; 210; 310) and of the target AC circuit (30; 130; 230; 330), wherein at least one heat sink (160a, 160b; 260; 360) is thermally coupled between the DC circuit (10; 110; 210; 310) and the target AC circuit (30; 130; 230; 330). The method further involves controlling (74) the DC power source (12) based on the measured at least one thermal parameter to reduce a difference in power dissipation between the DC circuit (10; 110; 210; 310) and the target AC circuit (30; 130; 230; 330). The method then involves, when thermal equilibrium is reached (75), determining the power value (49) of the target AC circuit (30; 130; 230; 330) by retrieving (76) at least one real-time measurement of at least one electric parameter of the DC circuit (10; 110; 210; 310), calculating (77) a DC power value of the DC circuit (10; 110; 210; 310) based on the retrieved at least one real-time measurement of the at least one electric parameter, and calculating (78) the power value (49) of the target AC circuit (30; 130; 230; 330) using the calculated DC power value.

An apparatus and a method for determining a power value of a target in the form of an AC circuit (130; 230; 330) having an AC power source (132; 232; 332). The method involves operating (72) a controllable DC power source (12) to provide DC power to a DC circuit (10; 110; 210; 310) and measuring (73) at least one thermal parameter related to power dissipation of the DC circuit (10; 110; 210; 310) and of the target AC circuit (30; 130; 230; 330), wherein at least one heat sink (160a, 160b; 260; 360) is thermally coupled between the DC circuit (10; 110; 210; 310) and the target AC circuit (30; 130; 230; 330). The method further involves controlling (74) the DC power source (12) based on the measured at least one thermal parameter to reduce a difference in power dissipation between the DC circuit (10; 110; 210; 310) and the target AC circuit (30; 130; 230; 330). The method then involves, when thermal equilibrium is reached (75), determining the power value (49) of the target AC circuit (30; 130; 230; 330) by retrieving (76) at least one real-time measurement of at least one electric parameter of the DC circuit (10; 110; 210; 310), calculating (77) a DC power value of the DC circuit (10; 110; 210; 310) based on the retrieved at least one real-time measurement of the at least one electric parameter, and calculating (78) the power value (49) of the target AC circuit (30; 130; 230; 330) using the calculated DC power value.

Various embodiments described herein relate to a test chamber device an associated methods and non-transitory machine-readable media including a test chamber, a system builder that is configured to build and apply an equipment load to the test chamber; a load maker that is configured to build and apply a predefined load to the test chamber; and a tester which measures action of the equipment load and the predefined load within the test chamber, producing a test state.

Various embodiments described herein relate to a test chamber device an associated methods and non-transitory machine-readable media including a test chamber, a system builder that is configured to build and apply an equipment load to the test chamber; a load maker that is configured to build and apply a predefined load to the test chamber; and a tester which measures action of the equipment load and the predefined load within the test chamber, producing a test state.

A support guide is provided for supporting a delicate heating wire in a failure test. The support guide includes a body formed of a heat resistant, non-conductive material. The body has a threaded surface configured to receive and support the delicate heating wire in a coiled form. Also provided is a failure testing method using the heat resistant, non-conductive threaded support guide.

The present disclosure provides a power control system for motor preheating including a current sensor, a power calculation module, a power error calculation module, a power control module, a current control module and a voltage control module. The current sensor senses a motor current output by the motor. The power calculation module calculates an output power of the motor according to the voltage command and the motor current. The power error calculation module calculates a power error according to a power command and the output power. The power control module outputs a current braking command according to the power error. The current control module calculates a voltage command according to the current braking command and the motor current. The voltage control module outputs a three-phase voltage according to the voltage command, and the motor is operated in a stationary state, and the stator of the motor is preheated.

The present disclosure provides a power control system for motor preheating including a current sensor, a power calculation module, a power error calculation module, a power control module, a current control module and a voltage control module. The current sensor senses a motor current output by the motor. The power calculation module calculates an output power of the motor according to the voltage command and the motor current. The power error calculation module calculates a power error according to a power command and the output power. The power control module outputs a current braking command according to the power error. The current control module calculates a voltage command according to the current braking command and the motor current. The voltage control module outputs a three-phase voltage according to the voltage command, and the motor is operated in a stationary state, and the stator of the motor is preheated.

A grid sensor system for characterizing a fluid flow includes a sensor insert having a grid sensor element and a flow guide having an inlet line, an outlet line, and an insert holder arranged between the same to hold the sensor insert. A rectilinear flow path is formed by the flow guide. The insert holder is formed in such a way that the sensor insert can be inserted into the insert holder along an insertion direction extending transversely with respect to the flow path. When the sensor insert is held in the insert holder, none of the electrodes extends parallel to the insertion direction.

A semiconductor device is provided which can suppress heating while assigning performances to a plurality of modules whose heat generations are controlled while considering usage conditions of the plurality of modules. The semiconductor device includes a load detection unit that detects operation rates of the plurality of modules, a weighting calculation unit that calculates coefficients of the plurality of modules based on the operation rates of the plurality of modules, and a heat generation control unit that controls power consumptions of the plurality of modules based on the coefficients of the plurality of modules.

A semiconductor device is provided which can suppress heating while assigning performances to a plurality of modules whose heat generations are controlled while considering usage conditions of the plurality of modules. The semiconductor device includes a load detection unit that detects operation rates of the plurality of modules, a weighting calculation unit that calculates coefficients of the plurality of modules based on the operation rates of the plurality of modules, and a heat generation control unit that controls power consumptions of the plurality of modules based on the coefficients of the plurality of modules.