A system may include an array of sensor elements, the array of sensor elements each comprising a first type of passive reactive element, a second type of passive reactive element electrically coupled to the array of sensor elements, a driver configured to drive the array of sensor elements and the second type of passive reactive element, and control circuitry configured to control enabling and disabling of individual sensor elements of the array of sensor elements to ensure no more than one of the array of sensor elements is enabled at a time such that when one of the array of sensor elements is enabled, the one of the array of sensor elements and the second type of passive reactive element together operate as a resonant sensor.

A system may include an array of sensor elements, the array of sensor elements each comprising a first type of passive reactive element, a second type of passive reactive element electrically coupled to the array of sensor elements, a driver configured to drive the array of sensor elements and the second type of passive reactive element, and control circuitry configured to control enabling and disabling of individual sensor elements of the array of sensor elements to ensure no more than one of the array of sensor elements is enabled at a time such that when one of the array of sensor elements is enabled, the one of the array of sensor elements and the second type of passive reactive element together operate as a resonant sensor.

The present invention provides a display device and detection method for impedance of the display device. The display device includes a display panel, a circuit board, and a chip-on-film. The chip-on-film includes pins, and the pins include conducting pins and test pins. The conducting pins are electrically connected to a first detection part of the circuit board, and the test pins are electrically connected to a second detection part of the circuit board. The conducting pins electrically connected to the first detection part are connected to the test pins by test wires.

The present invention provides a display device and detection method for impedance of the display device. The display device includes a display panel, a circuit board, and a chip-on-film. The chip-on-film includes pins, and the pins include conducting pins and test pins. The conducting pins are electrically connected to a first detection part of the circuit board, and the test pins are electrically connected to a second detection part of the circuit board. The conducting pins electrically connected to the first detection part are connected to the test pins by test wires.

A method for estimating actuator parameters for an actuator, in-situ and in real-time, may include driving the actuator with a test signal imperceptible to a user of a device comprising the actuator during real-time operation of the device, measuring a voltage and a current associated with the actuator and caused by the test signal, determining one or more parameters of the actuator based on the voltage and the current, determining an actuator type of the actuator based on the one or more parameters, and controlling a playback signal to the actuator based on the actuator type.

A method for estimating actuator parameters for an actuator, in-situ and in real-time, may include driving the actuator with a test signal imperceptible to a user of a device comprising the actuator during real-time operation of the device, measuring a voltage and a current associated with the actuator and caused by the test signal, determining one or more parameters of the actuator based on the voltage and the current, determining an actuator type of the actuator based on the one or more parameters, and controlling a playback signal to the actuator based on the actuator type.

An impedance measurement circuit and an operating method thereof are provided. The impedance measurement circuit includes a current source, a voltage controlled oscillator (VCO), an operation circuit, and a first delay circuit. The current source, electrically connected to a power rail, is able to sink a current from the power rail according to the delayed clock signal. The VCO is configured to generate an oscillation signal according to a power voltage on the power rail. The operation circuit is electrically connected to the VCO and is configured to receive a sampling clock signal and the oscillation signal, sense the power voltage to generate a sampled signal, and accumulate the sampled signal to generate a measurement result. The first delay circuit, electrically connected to the current source and the operation circuit, is able to receive the sampling clock signal and transmit the delayed clock signal to the current source.

An impedance measurement circuit and an operating method thereof are provided. The impedance measurement circuit includes a current source, a voltage controlled oscillator (VCO), an operation circuit, and a first delay circuit. The current source, electrically connected to a power rail, is able to sink a current from the power rail according to the delayed clock signal. The VCO is configured to generate an oscillation signal according to a power voltage on the power rail. The operation circuit is electrically connected to the VCO and is configured to receive a sampling clock signal and the oscillation signal, sense the power voltage to generate a sampled signal, and accumulate the sampled signal to generate a measurement result. The first delay circuit, electrically connected to the current source and the operation circuit, is able to receive the sampling clock signal and transmit the delayed clock signal to the current source.

An integrated circuit comprises a substrate that includes a first surface and a second surface. A first through substrate via (TSV) is formed between the first surface and the second surface and a first conductive material is arranged within the first TSV to form a conductive path between the first surface and the second surface through the substrate. A second TSV is formed between the first surface and the second surface and a second conductive material arranged within the second TSV to form a conductive path between the first surface and the second surface through the substrate. In examples the first TSV has a larger cross-sectional area than the second TSV, the cross-section of the first TSV and second TSV being in a plane parallel to the first surface or the second surface.

An integrated circuit comprises a substrate that includes a first surface and a second surface. A first through substrate via (TSV) is formed between the first surface and the second surface and a first conductive material is arranged within the first TSV to form a conductive path between the first surface and the second surface through the substrate. A second TSV is formed between the first surface and the second surface and a second conductive material arranged within the second TSV to form a conductive path between the first surface and the second surface through the substrate. In examples the first TSV has a larger cross-sectional area than the second TSV, the cross-section of the first TSV and second TSV being in a plane parallel to the first surface or the second surface.