A signal processing apparatus includes a unit configured to generate noise cut data by deducting a predetermined noise value from values of respective signals constituting input data and a stochastic resonance processing unit configured to subject the noise cut data to a predetermined stochastic resonance processing. The predetermined stochastic resonance processing is processing to output, in a method of synthesizing a result of parallelly performing steps of adding new noise to the noise cut data to subject the resultant data to a binary processing, a value obtained in a case where the parallel number is infinite.

A system can include a plurality of device under test (DUT) cells. Each DUT cell can include a DUT and a plurality of switches configured to control a flow of current to the DUT. The system can further include a controller configured to execute a plurality of test to the plurality of DUTs in the plurality of DUT cells. Each of the plurality of tests comprises applying a measurement condition to a given DUT of the plurality of DUTs and concurrently applying a stress condition to the remaining DUTs of the plurality of DUTs, wherein the plurality of tests can provide measurements sufficient to determine a bias thermal instability and a time dependent dielectric breakdown of the given DUT.

A testing device of a data collecting chip (10) and control method thereof, and the testing device (10) includes: a data collecting module (200) for receiving multiple frames of sampling data sampling data collected by the data collecting chip; a storing module (300); a processing module (400) for calculating noise of a plurality of data sampling points to obtain a noise test result; a data transceiving module (500) for uploading the noise test result; and a control module (600). The testing device (10) only uploads the noise test result by calculating the noise of the plurality of data sampling points, so that the efficiency of a chip test is improved, the cost of the chip test is reduced, and the test reliability is ensured better.

The present invention relates to a signal measurement system (100, 200, 300) for measuring a signal, the system comprising a signal detection unit (41) for detecting a raw signal, a signal processing unit (42) and a signal cable (10) electrically connecting the signal detection unit (41) with the signal processing unit (42). The signal cable (10) comprises a signal conductor (1, 2) for electrically conducting a first signal from the signal detection unit (41) to the signal processing unit (42), which first signal comprises at least the raw signal, a reference conductor (11, 12) for detecting and electrically conducting to the signal processing unit (42) only a noise signal induced by a movement of the signal cable (10) or by electromagnetic interference. In this way the effect of noise on the signal quality is reduced caused by movement of the signal cable (10) or other sources of noise that induce a noise signal in the signal cable (10), such as electromagnetic interference, while at the same time not increasing the power usage or power loss.

A noise detection circuit includes an open and close switch connected onto a signal line for transmitting a detection signal of an extraneous noise, and the open and close switch is configured so as to be in an off state during a time period when the switching of the conduction state of a solid state switch is performed by a control circuit, whereas the open and close switch is configured so as to be in an on state during a time period when the switching of the conduction state of the solid state switch is not performed. As a result, an extraneous noise occurring irregularly can be detected.

A noise detection circuit includes an open and close switch connected onto a signal line for transmitting a detection signal of an extraneous noise, and the open and close switch is configured so as to be in an off state during a time period when the switching of the conduction state of a solid state switch is performed by a control circuit, whereas the open and close switch is configured so as to be in an on state during a time period when the switching of the conduction state of the solid state switch is not performed. As a result, an extraneous noise occurring irregularly can be detected.

A test board between a first connector of a cable extending from a source device and a second connector of a sink device including a display panel, includes: a bypass circuit, the bypass circuit to supply a first power from a first output terminal of the first connector to a hot plug detect (HPD) input terminal of the first connector, the first power including a HPD signal.

A test board between a first connector of a cable extending from a source device and a second connector of a sink device including a display panel, includes: a bypass circuit, the bypass circuit to supply a first power from a first output terminal of the first connector to a hot plug detect (HPD) input terminal of the first connector, the first power including a HPD signal.

To provide a technique capable of measuring high-frequency electrical noise in a charged particle beam device. A charged particle beam device 100 includes an electron source 2 for generating an electron beam EB1, a stage 4 for mounting a sample 10, a detector 5 for detecting secondary electrons EB2 emitted from the sample 10, and a control unit 7 electrically connected to the electron source 2, the stage 4, and the detector 5 and can control the electron source 2, the stage 4, and the detector 5. Here, when the sample 10 is mounted on the stage 4, and a specific portion 11 of the sample 10 is continuously irradiated with the electron beam EB1 from the electron source 2, the control unit 7 can calculate a time-series change in irradiation position of the electron beam EB1 based on an amount of the secondary electrons EB2 emitted from the specific portion 11, and can calculate a feature quantity for a shake of the electron beam EB1 based on the time-series change in irradiation position. Further, the feature quantity includes a frequency spectrum.

To provide a technique capable of measuring high-frequency electrical noise in a charged particle beam device. A charged particle beam device 100 includes an electron source 2 for generating an electron beam EB1, a stage 4 for mounting a sample 10, a detector 5 for detecting secondary electrons EB2 emitted from the sample 10, and a control unit 7 electrically connected to the electron source 2, the stage 4, and the detector 5 and can control the electron source 2, the stage 4, and the detector 5. Here, when the sample 10 is mounted on the stage 4, and a specific portion 11 of the sample 10 is continuously irradiated with the electron beam EB1 from the electron source 2, the control unit 7 can calculate a time-series change in irradiation position of the electron beam EB1 based on an amount of the secondary electrons EB2 emitted from the specific portion 11, and can calculate a feature quantity for a shake of the electron beam EB1 based on the time-series change in irradiation position. Further, the feature quantity includes a frequency spectrum.