An electrostatic discharge and electrical overstress detection circuit includes protection circuit, sensing circuit, clamp circuit, several stages of sampling logic circuits connected in sequence and storage circuit. Protection circuit is coupled between input/output pin and internal chip and discharges to a power supply terminal when the electrostatic discharge or electrical overstress events happen. Sensing circuit and clamp circuit are coupled between power supply terminal and ground terminal. Each stage of sampling logic circuit is coupled to power supply terminal and memory cell of storage circuit, and the first stage of sampling logic is coupled to the clamp circuit, and when the electrostatic discharge or electrical overstress events happen, the several stages of sampling logic circuits sample voltage of the power supply terminal one by one and change state of corresponding memory cell, so that the electrostatic discharge or electrical overstress events are successively recorded by the memory cell.

Functionality for estimating characteristics of an on-chip noise signal can be implemented on a processing module. An on-chip noise signal is determined at an on-chip determination point of a computer chip. The on-chip noise signal is converted to a frequency-varying signal using a voltage-controlled oscillator implemented on the computer chip. The frequency-varying signal is measured at an off-chip measurement point and frequency information is extracted from the frequency-varying signal. The frequency information is converted to a voltage level associated with the on-chip noise signal based on the relationship between an input voltage provided to the voltage-controlled oscillator and an output frequency generated by the voltage-controlled oscillator.

An electrical activity monitoring device based on a sensor device attachable to a power cable of an electrical device for monitoring the electrical status of the electrical device. The device comprises an antenna element which performs the dual functions of magnetically coupling with an electrical pulse generated in the power cable in response to a change of electrical power state of the electrical device and to transmit data to a reader via the power cable. An electrical activity monitoring apparatus is also provided for monitoring the electrical status of at least one electrical device connected to a power supply network by a respective power cable provided with a sensor device. The electrical activity monitoring apparatus comprises a reader and a reader-power line interface device.

Devices, systems, and methods are provided for testing and validation of a camera. A device may determine a content object placed in a line of sight of a camera device, wherein the content object provides informational and visual content. The device may capture one or more images of the content object. The device may cause an electromagnetic event using an electromagnetic interference device, causing an electromagnetic event to affect an image quality of at least one of the one or more images captured by the camera device. The device may assign a structural similarity index (SSIM) score to the at least one image of the one or more images, wherein the SSIM score indicates a camera validation status of the camera device. The device may assign an SSIM score between on one image taken without the presence of interference and one image taken in the presences of the interference.

A probe for measuring an electrical field includes at least three antennas, each antenna being adapted to receive a RF signal. The at least three antennas are arranged in accordance with three axes oriented perpendicularly to each other. A detection circuit is provided for each antenna, connected to the corresponding antenna for detecting an RF signal. A processing circuit is operationally connected to an output of each detection circuit for processing the detected signals and outputting a measurement result. A measurement correction mechanism is provided for correcting the measurement result based on a frequency of said electrical field and an angular position of the probe relative to said electrical field.

A device comprises a circuit board, a Rogowski coil on the circuit board, persistent data storage on the circuit board, and a control circuit on the circuit board for collecting values representing current sensed by the coil, and storing the values in the persistent memory.

A test board between a first connector of a cable extending from a source device and a second connector of a sink device including a display panel, includes: a bypass circuit, the bypass circuit to supply a first power from a first output terminal of the first connector to a hot plug detect (HPD) input terminal of the first connector, the first power including a HPD signal.

A method of detecting whether a receiver coil is near a transmit coil in a wireless power transfer system (WPTS), the method involving: applying a pseudo-random signal to the transmit coil; while the pseudo-random signal is being applied to the transmit coil, recording one or more signals produced within the WPTS in response to the applied pseudo-random signal; by using the one or more recorded signals, generating a dynamic system model for some aspect of the WPTS; and using the generated dynamic system model in combination with stored training data to determine whether an object having characteristics distinguishing the object as a receiver coil is near the transmit coil.

A testing method and testing system for a semiconductor element are provided. The method includes following steps. A level of a testing electrostatic discharge (ESD) voltage is determined. A plurality of sample components is provided. The testing ESD voltage is imposed on the sample components for testing ESD decay rates of the sample components. ESD withstand voltages of the sample components are detected. The relation between the ESD withstand voltages and the electrostatic discharge rates are recorded to a database. The testing ESD voltage is imposed on the semiconductor element for testing an ESD decay rate of the semiconductor element. The database is looked up according to the ESD decay rate of the semiconductor element to determine an ESD withstand voltage of the semiconductor element.

An Antenna measurement system incorporating high speed tracking laser-based global positioning capture synchronized with radio frequency (RF) measurements. A high speed tracking laser is used for collecting RF probe position data synchronously with corresponding near-field RF measurements. The probe may be moved across an arbitrary surface surrounding or adjacent to a device under test (DUT); however, it is not necessary for the probe position to be perfectly coincident with the surface, or any of the discrete points which make up the surface. Here, the probe position is determined relative to a global positioning coordinate system which is defined by a set of monuments which are in known positions relative to the global positioning coordinate system, and not the DUT. Any difference between the actual position of the probe, in the global position coordinate system, and a given one of the discrete measuring points, in the global position coordinate system, on the surface surrounding or adjacent to the DUT can be accounted for during post processing, thus eliminating the need for advanced or intermittent calibration to achieve precise near-field measurements.