A method of monitoring the condition of a circuit comprises establishing a known baseline signal for a type of circuit (each is somewhat different) and defining these characteristics in terms of the lead and trailing edge angular components (@ zero crossing point), the voltage (amplitude), and the period (time length) of the waveform. Ideally, the angular component of the square wave should be vertical, or at 90 degrees to x-axis. The baseline non-regular square wave that is composed of current, voltage, any harmonic thereof, or the combination of these signals which best indicate predictive measurement attributed to the type of circuit being monitored. Future wave forms indicate the rate of decay based upon the aggregated angular, amplitude, and period components of the zero-crossing points when compared to the baseline signal and/or prior waveform of the observed specific splice. The rate of decay can help determine the life expectancy of the circuit.

The present invention relates to a system and method for the simultaneous testing of radiation, environmental and electrical reliability of multiple semiconductor devices. The system provides a simultaneous simulation of the space environment in which a device under test (DUT) is expected to operate under thereby providing an accurate test environment. One or more DUTs are simultaneously subject to each of a radiating dose, electrical bias and varying temperature. Additionally, each of the above may be varied over a range of values to provide test data under multiple testing conditions. Finally, a method for operating the system is provided which ensures reliable and high fidelity data from the system. The system comprises seven (7) interconnected subsystems, an electrical environmental subsystem, a radiation subsystem, an environmental control system, a radiation source control system, a temperature monitoring subsystem, an electrical stimulation and data acquisition subsystem and a data processing and analysis subsystem.

A tester apparatus is provided. Slot assemblies are removably mounted to a frame. Each slot assembly allows for individual heating and temperature control of a respective cartridge that is inserted into the slot assembly. A closed loop air path is defined by the frame and a heater and cooler are located in the closed loop air path to cool or heat the cartridge with air. Individual cartridges can be inserted or be removed while other cartridges are in various stages of being tested or in various stages of temperature ramps.

The invention relates to an over-the-air (OTA) test system for measuring a performance of a device under test (DUT). The test system comprises an over-the-air (OTA) measurement chamber provided with at least one feedthrough for at least a first air hose and a second air hose. The test system further includes a thermally isolated hollow body inside the OTA measurement chamber, in which the DUT is positioned having at least two openings for connecting a first end of each of the first and the second air hose, and at least one sensor having a connection wire, located within the thermally isolated hollow body. Advantageously, the sensor connection wire is fed through one of the two openings into the thermally isolated hollow body.

An apparatus for prediction of the residual lifetime of an electrical system includes: an input unit; a processing unit; and an output unit. The input unit provides at least one sensor data from at least one sensor to the processing unit, the at least one the sensor data including a measurement of at least one physical parameter of at least one component of an electrical system. Each sensor data is associated with a corresponding sensor and relates to a measurement of one physical parameter of a corresponding component of the electrical system. Each sensor data extends over a plurality of time windows and is assigned to a certain data class, such that sensor data at a particular time window has a value that falls into one of the data classes. For each sensor data the processing unit assigns the sensor data at each time window into a corresponding measurement window.

An Uninterruptible Power Supply (UPS) system is provided which includes an input configured to receive input power, an output configured to provide output power to a load, power conversion circuitry coupled to the input and the output, a capacitor coupled to the power conversion circuitry, and a controller coupled to the power conversion circuitry. The controller is configured to determine a first value indicative of an equivalent series resistance of the capacitor, determine, based on the first value, if the capacitor satisfies at least one criterion, and execute, responsive to determining that the relative value satisfies the at least one criterion, one or more actions to address degradation of the capacitor.

Arrangements and techniques for testing mobile devices within a test module. The test modules are portable and may be stacked to provide a modular testing system. A pulley system may be used to move an actuator arm horizontally in the X and Y directions. The actuator arm may be moved vertically in the Z direction such that a tip may engage a touchscreen of a mobile device being tested or a user interface element of the mobile device.

An apparatus is described for burn-in and/or functional testing of microelectronic circuits of unsingulated wafers. A large number of power, ground, and signal connections can be made to a large number of contacts on a wafer. The apparatus has a cartridge that allows for fanning-in of electric paths. A distribution board has a plurality of interfaces that are strategically positioned to provide a dense configuration. The interfaces are connected through flexible attachments to an array of first connector modules. Each one of the first connector modules can be independently connected to a respective one of a plurality of second connector modules, thereby reducing stresses on a frame of the apparatus. Further features include for example a piston that allows for tight control of forces exerted by terminals onto contacts of a wafer.

Electronic device characterization platforms, systems, devices, and methods for use in testing instruments, devices, and sensors that is portable, modular, multiplexed, and automated are disclosed. The system includes a substrate, a chip adapter, such as a chip socket, and an optional housing. Chip samples to be tested can be disposed in the chip adapter and various environmental modules designed to supply different environmental conditions to the chip sample can be disposed over the chip adapter, enabling testing of the chip samples to be performed in the different environment conditions. The system can further include various connectors that allow for add-on modules to be included as part of the system. Methods of characterizing electronic devices and sensors are also disclosed.

A method for determining a semiconductor temperature T.sub.j of a semiconductor element of a semiconductor module comprises ascertaining an estimated value of the semiconductor temperature T.sub.j using an optimizable model of a thermal behavior of the semiconductor module, reading a measured value of the semiconductor temperature T.sub.j, optimizing the optimizable model using the measured value, providing the estimated value of the semiconductor temperature T.sub.j, if the measured value is not available, and the measured value if the measured value is available for the point in time, and repeating the steps of the method for further points in time.