A power supply apparatus includes: an inductor to which an input voltage is applied; a switching element that switches a current flowing to the inductor on and off so as to cause an induced voltage to be generated; an electrolytic capacitor that smoothes the induced voltage and outputs the voltage to a load; and a control circuit that controls the switching element, wherein the control circuit outputs a second switching control signal obtained by superimposing a degradation detection-purpose signal for detecting degradation of the electrolytic capacitor on a first control signal, detects an output voltage output by switching performed by the switching element controlled by the second control signal, and estimates the degradation of the electrolytic capacitor by using the output voltage detected, a duty cycle of the first control signal, and a frequency component of the degradation detection-purpose signal contained in the output voltage detected.

The invention discloses a method and a system for correction of the junction temperatures of an IGBT module in a photovoltaic inverter. The method includes: constructing an electrothermal coupling model of an IGBT model based on a photovoltaic inverter topology, a light radiation intensity, and an ambient temperature; selecting an IGBT collector-emitter on-state voltage drop as an aging parameter and designing an on-state voltage drop sampling circuit to ensure measurement accuracy; constructing an aging database for IGBT modules in different aging stages based on large current and small current injection methods; comparing a junction temperature value output by the electrothermal coupling model with the calibrated junction temperature value and calibrating an aging process coefficient of an electrothermal coupling model correction formula; comparing an IGBT aging monitoring value with the aging threshold to determine the aging process and selecting a corresponding aging process coefficient to ensure accuracy of junction temperature data.

Probe systems configured to test a device under test and methods of operating the probe systems are disclosed herein. The probe systems include an electromagnetically shielded enclosure, which defines an enclosed volume, and a temperature-controlled chuck, which defines a support surface configured to support a substrate that includes the DUT. The probe systems also include a probe assembly and an optical microscope. The probe systems further include an electromagnet and an electronically controlled positioning assembly. The electronically controlled positioning assembly includes a two-dimensional positioning stage, which is configured to selectively position a positioned assembly along a first two-dimensional positioning axis and also along a second two-dimensional positioning axis. The electronically controlled positioning assembly also includes a first one-dimensional positioning stage that operatively attaches the optical microscope to the positioned assembly and a second one-dimensional positioning stage that operatively attaches the electromagnet to the positioning assembly.

The All Test Platform (ATP) provides provides a safe and easy way to test batteries within an environmental test chamber. The ATP enables rapid changing of batteries and battery types between tests, and provides the highest density per square foot of environmental test chamber space available for battery testing. The ATP combines multiple components critical for battery testing into a configurable, scalable, safe, and high density battery testing platform.

A tester apparatus is provided. Slot assemblies are removably mounted to a frame. Each slot assembly allows for individual heating and temperature control of a respective cartridge that is inserted into the slot assembly. A closed loop air path is defined by the frame and a heater and cooler are located in the closed loop air path to cool or heat the cartridge with air. Individual cartridges can be inserted or be removed while other cartridges are in various stages of being tested or in various stages of temperature ramps.

A burn-in resilient integrated circuit is provided. The burn-in resilient integrated circuit includes an inverter chain and a plurality of inverter circuits on the inverter chain. The burn-in resilient integrated circuit also includes a loop providing an electrical connection from an output of the inverter chain to an input of the inverter chain. The loop is selectable in accordance with a burn-in operation.

A method for selecting components in a radiation tolerant electronic system, comprising, determining ionizing radiation responses of COTS devices under various radiation conditions, selecting a subset of the COTS devices whose radiation responses satisfy threshold radiation levels, applying mathematical models of the COTS devices for post-irradiation conditions to determine radiation responses to ionizing radiation; implementing a radiation-tolerant architecture using COTS devices from the selected subset, the implemented circuit may be tested for robustness to ionizing radiation effects without repeated destructive tests of the hardware circuit by using the mathematical models for simulating response to the ionizing radiation, and implementing a multi-layer shielding to protect the implemented circuit under various radiation conditions.

A system includes a memory component and a processing device, operatively coupled with the memory component, to receive a request to perform a first test of memory components at a test platform, identify test resources of the test platform that are associated with the memory components, identify, among the test resources, a subset of test resources that are not being used by a second test of the memory components at the test platform, and assign, based on the subset of the test resources, a test resource of the test resources to obtain an assigned test resource for use by the test.

A device for testing service life in a simulated environment is disclosed, including: a testing box body, a plug testing device, a test control system, and a temperature control assembly. The plug testing device includes an upper clamp assembly and a lower clamp assembly for clamping a to-be-tested piece. The test control system includes a control module, a data acquisition module connected with the plug testing device and the temperature control assembly to acquire data, and a display panel for inputting a control instruction and displaying data. The control module can control the plug testing device to perform a reciprocating plug action at a preset temperature according to the control instruction.

Electronic device characterization platforms, systems, devices, and methods for use in testing instruments, devices, and sensors that is portable, modular, multiplexed, and automated are disclosed. The system includes a substrate, a chip adapter, such as a chip socket, and an optional housing. Chip samples to be tested can be disposed in the chip adapter and various environmental modules designed to supply different environmental conditions to the chip sample can be disposed over the chip adapter, enabling testing of the chip samples to be performed in the different environment conditions. The system can further include various connectors that allow for add-on modules to be included as part of the system. Methods of characterizing electronic devices and sensors are also disclosed.