A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.

A die sorter tool may include a first conveyor, and a first lane to receive, from one or more load ports and via the first conveyor, a carrier with a set of dies. The die sorter tool may include a die flip module to receive the carrier from the first lane, manipulate one or more dies of the set of dies by changing orientations of the one or more dies, and return the one or more dies to the carrier after manipulating the one or more dies and without changing positions of the one or more dies within the carrier. The die sorter tool may include a second conveyor, and a second lane to receive, via the second conveyor, the carrier from the die flip module, and provide, via the first conveyor, the carrier to the one or more load ports.

A capacitor testing device includes a carrier with a plurality of clamping holes which are configured to carry capacitors to be tested; a conveying means being configured to convey the carrier; an image collection assembly, including an upper image collection assembly disposed above the conveying means and a lower image collection assembly disposed below the conveying means, the upper image collection assembly and the lower image collection assembly being configured to perform defect testing on outer surfaces of the capacitors to be tested; and a performance testing means, including a performance testing circuit board and a lifting assembly being configured to drive the performance testing circuit board to ascend or descend, and the performance testing means being configured to test electrical performances of the capacitors to be tested.

An Apparatus and Method for reliably sorting RFID chips, in inlays, labels, tags or other units of manufacture, into rows and columns, and using that information to report their exact position on a moving web, in support of further manufacturing processes, in the presence of crosstalk, with speed and accuracy exceeding prior art.

A method for determining the remaining service life of a capacitor is disclosed, wherein the capacitor may be formed by an electrolytic capacitor. The method includes the stages of: measuring a voltage change across the capacitor during a discharging time, determining a discharging current during the discharging time, determining an actual capacitance of the capacitor on the basis of the voltage change, the discharging current and the discharging time, determining a corrected capacitance of the capacitor from the actual capacitance based on an error correction, wherein influences of the temperature on the capacitance of the capacitor are corrected during the error correction, and determining the remaining service life on the basis of a difference between the corrected capacitance and an initial capacitance of the capacitor. A system including an assessment device, configured to perform this method, and a circuit having at least one capacitor to be assessed are also disclosed.

The disclosure generally relates to a failure indicator for providing an indicator that a failure has occurred on a capacitor unit of a capacitor bank. In some embodiments, the failure indicator may include a magnetic element, and the failure indicator may be configured to move from a first orientation to a second orientation based on a mechanical or electromagnetic impulse in the capacitor unit resulting from a failure of the first capacitor unit. In some embodiments, the magnetic element may maintain the first failure indicator in the second orientation to indicate the failure of the first capacitor unit.

An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.

An apparatus, a method and a computer program product for defect detection in work pieces is disclosed. At least one light source is provided and the light source generates an illumination light of a wavelength range at which the work piece is transparent. A camera images the light from at least one face of the work piece on a detector of the camera by means of a lens. A stage is used for moving the work piece and for imaging the at least one face of the semiconductor device completely with the camera. The computer program product is disposed on a non-transitory, computer readable medium for defect detection in work pieces. A computer is used to execute the various process steps and to control the various means of the apparatus.

A method for testing a lifetime of a surface state carrier of a semiconductor, including the following steps, 1) a narrow pulse light source is used to emit a light pulse, and coupled to an interior of a near-field optical probe, and the near-field optical probe produces a photon-generated carrier on a surface of a semiconductor material under test through excitation. 2) The excited photon-generated carrier is concentrated on the surface of the semiconductor material, and recombination is conducted continuously with a surface state as a recombination center. 3) A change in a lattice constant is produced due to an electronic volume effect, a stress wave is produced, and a signal of the stress wave is detected in a high-frequency broadband ultrasonic testing mode. 4) Fitting calculation is conducted on the signal of the stress wave to obtain the lifetime of the surface state carrier τ.sub.c.

A system, method, and computer-readable medium are disclosed for automated component serialization. A group of components that are of the same component to be used in a computer system are identified. One of the components is separated and labeled with serialization information. The labeled serialized information is verified and entered into an enterprise resource planning system. The process continues until all the group of components are labeled and verified.