A magnetic sensor includes an insulating layer, a first MR element, and a second MR element. The insulating layer includes a first layer and a second layer, and also includes first and second inclined surfaces formed across the first layer and the second layer. Each of the first and second MR elements includes a magnetization pinned layer and a free layer. The magnetization pinned layer and the free layer of the first MR element are disposed on the first inclined surface. The magnetization pinned layer and the free layer of the second MR element are disposed on the second inclined surface.

A magnetic sensor includes an insulating layer, a first MR element, and a second MR element. The insulating layer includes a protruding surface including first and second inclined surfaces. Each of the first and second MR elements includes a magnetization pinned layer and a free layer. The magnetization pinned layer and the free layer of the first MR element are disposed on the first inclined surface. The magnetization pinned layer and the free layer of the second MR element are disposed on the second inclined surface. The dimension of the protruding surface in a direction parallel to the Z direction is in the range of 1.4 .Math.m to 3.0 .Math.m.

The present disclosure provides a wafer probe card including: a non-magnetic printed circuit board (PCB) having a first side and a second side opposite the first side, the first side configured to face a magnet; a plurality of connection structures provided on the first side of the non-magnetic PCB; and a Hall sensor unit fixedly provided on the first side of the non-magnetic PCB, the Hall sensor electrically connected to at least one of the plurality of connection structures.

The present disclosure relates to a housing assembly for accommodating printed circuit boards (PCBs). The housing assembly comprises a first housing portion configured to accommodate a first PCB, a second housing portion configured to accommodate a second PCB, and a separating portion for separating the first housing portion from the second housing portion. The separating portion comprises a first separating region in which the first housing portion and the second housing portion overlap and a second separating region that extends beyond the second housing portion and covers the first housing portion. The second separating region comprises one or more convection openings.

Sensor assemblies are provided for use in modeling water systems. These sensor assemblies can be used as sensor fish. These assemblies can include a circuit board supporting processing circuitry components on either or both opposing component support surfaces of the circuit board and a housing above the circuit board and the components, with the housing being circular about the circuit board in at least one cross section, and wherein the supporting surfaces of the circuit board are substantially parallel with the plane of the housing in the one cross section.

Methods for emulating interaction of entities within water systems are provided. The methods can include introducing a sensor assembly into a water system. The sensor assembly can include: a circuit board supporting processing circuitry components on either or both of opposing component support surfaces of the circuit board; a housing about the circuit board and the components, the housing being circular about the circuit board in at least one cross section; and wherein the support surfaces of the circuit board are substantially parallel with the plane of the housing in the one cross section.

A sensor comprises a housing; and a lead frame comprising at least three elongated leads having an exterior portion extending from the housing; and a magnetic sensor circuit disposed in the housing, and connected to the lead frame. The housing comprises two recesses arranged on two opposite sides of the housing for allowing the sensor to be mounted to a support. The lead frame may further comprise a plurality of tabs disposed between the elongated leads, for use as test pins. A component assembly comprising said sensor mounted on a support between deformable protrusions. A method of making said component assembly, comprising the step of positioning said component on the support between said protrusions, and deforming said protrusions such that they are at least partially disposed within the recesses.

A non-intrusive electrical current detector system and method is disclosed. In one example, the system includes a magnetic field sensing device and a controller. The system provides a user with a way to monitor the running status of an electrical device, without the need to make electrical connections or separating conductors in a multi-conductor cable.

A caliper pig for detecting geometrical deformation of a pipeline is disclosed. The caliper pig includes a body and a first sensor arm assembly. The first sensor arm assembly includes a primary caliper sensor ring adapted to be mounted on the body. Further, the first sensor arm assembly includes a plurality of sensor arms adapted circumferentially distributed on the primary caliper sensor ring. Each of the plurality of sensor arms includes a sensing arm adapted to be in contact with an internal surface of the pipeline and a pair of magnets adapted to rotate along the sensing arm. Each of the plurality of sensor arms includes a sensing unit configured to detect a change in magnetic field based on the movement of the sensing arm. The sensing unit is configured to generate an output indicative of an angle of deflection of the sensing arm while traversing on the internal surface of the pipeline.

A semiconductor package includes a leadframe forming a plurality of leads with a die attach site, a semiconductor die including a set of die contacts mounted to the die attach site in a flip chip configuration with each die contact of the set of die contacts electrically connected to leadframe via one of a set of solder joints, a set of solder joint capsules covering each of the set of solder joints against the leadframe, a clip mounted to the leadframe over the semiconductor die with a clip solder joint. The solder joint capsules restrict flow of the solder joints of the semiconductor die contacts in the flip chip configuration such that the solder remains in place if remelted during later clip solder reflow.

A transducer assembly includes an engagement plate, a mounting plate, a support structure, and first and second Hall effect sensor assemblies. The mounting plate defines an S-shaped cutout extending through the mounting plate to define first and second finger regions and a perimeter region. The first finger region includes a first distal end spaced from the perimeter region by a first gap defined by the S-shaped cutout. The second finger region includes a second distal end spaced from the perimeter region by a second gap defined by the S-shaped cutout. The support structure includes a base and first and second tabs. The base is sandwiched between the engagement plate and the mounting plate. The first and second tabs extend from the base and into the first and second gaps, respectively. The first and second Hall effect sensor assemblies are configured to detect movement of the first and second tabs, respectively.